Diffraction based overlay metrology tool and method of diffraction based overlay metrology

    公开(公告)号:US11644428B2

    公开(公告)日:2023-05-09

    申请号:US16719107

    申请日:2019-12-18

    CPC classification number: G01N21/95607 G03F7/7015 G03F7/70633

    Abstract: Systems, methods, and apparatus are provided for determining overlay of a pattern on a substrate with a mask pattern defined in a resist layer on top of the pattern on the substrate. A first grating is provided under a second grating, each having substantially identical pitch to the other, together forming a composite grating. A first illumination beam is provided under an angle of incidence along a first horizontal direction. The intensity of a diffracted beam from the composite grating is measured. A second illumination beam is provided under the angle of incidence along a second horizontal direction. The second horizontal direction is opposite to the first horizontal direction. The intensity of the diffracted beam from the composite grating is measured. The difference between the diffracted beam from the first illumination beam and the diffracted beam from the second illumination beam, linearly scaled, results in the overlay error.

    OPTICAL ISOLATION MODULE
    223.
    发明申请

    公开(公告)号:US20230139746A1

    公开(公告)日:2023-05-04

    申请号:US18075589

    申请日:2022-12-06

    Abstract: An optical source for a photolithography tool includes a source configured to emit a first beam of light and a second beam of light, the first beam of light having a first wavelength, and the second beam of light having a second wavelength, the first and second wavelengths being different; an amplifier configured to amplify the first beam of light and the second beam of light to produce, respectively, a first amplified light beam and a second amplified light beam; and an optical isolator between the source and the amplifier, the optical isolator including: a plurality of dichroic optical elements, and an optical modulator between two of the dichroic optical elements.

    METHODS OF MODELLING SYSTEMS FOR PERFORMING PREDICTIVE MAINTENANCE OF SYSTEMS, SUCH AS LITHOGRAPHIC SYSTEMS

    公开(公告)号:US20230138469A1

    公开(公告)日:2023-05-04

    申请号:US17801980

    申请日:2021-02-04

    Abstract: A method of tuning a prediction model relating to at least one particular configuration of a manufacturing device. The method includes obtaining a function including at least a first function of first prediction model parameters associated with the at least one particular configuration, and a second function of the first prediction model parameters and second prediction model parameters associated with configurations of the manufacturing device and/or related devices other than the at least one particular configuration. Values of the first prediction model parameters are obtained based on an optimization of the function, and a prediction model is tuned according to these values of the first prediction model parameters to obtain a tuned prediction mode.

    SUCTION CLAMP, OBJECT HANDLER, STAGE APPARATUS AND LITHOGRAPHIC APPARATUS

    公开(公告)号:US20230121922A1

    公开(公告)日:2023-04-20

    申请号:US17792335

    申请日:2020-12-18

    Inventor: Gijs KRAMER

    Abstract: A suction clamp for clamping an object. The suction clamp includes a base structure including a base and a connection area, and a first pad for receiving the object. The suction clamp further includes a resilient member connecting the first pad to the connection area of the base structure such that the first pad is moveable relative to the base between a receiving position for receiving the object and a clamping position for clamping the object, wherein the resilient member is adapted to bias the first pad to the receiving position. The suction clamp further includes a suction opening arranged in the base and adapted to be connected to a suction device for providing a suction force for clamping the object on the first pad.

    SYSTEMS AND METHODS FOR SIGNAL ELECTRON DETECTION

    公开(公告)号:US20230112447A1

    公开(公告)日:2023-04-13

    申请号:US17910752

    申请日:2021-03-09

    Abstract: Systems and methods of observing a sample using an electron beam apparatus are disclosed. The electron beam apparatus comprises an electron source configured to generate a primary electron beam along a primary optical axis, and a first electron detector having a first detection layer substantially parallel to the primary optical axis and configured to detect a first portion of a plurality of signal electrons generated from a probe spot on a sample. The method may comprise generating a plurality of signal electrons and detecting the signal electrons using the first electron detector substantially parallel to the primary optical axis of the primary electron beam. A method of configuring an electrostatic element or a magnetic element to detect backscattered electrons may include disposing an electron detector on an inner surface of the electrostatic or magnetic element and depositing a conducting layer on the inner surface of the electron detector.

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