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    Molded coil
    225.
    外观设计
    Molded coil 有权

    公开(公告)号：USD810020S1

    公开(公告)日：2018-02-13

    申请号：US29533606

    申请日：2015-07-20

    Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD. ,  NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  I&P CO., LTD.

    Designer： Noriyuki Hayashizaka ,  Daisuke Mishou ,  Takeo Ebina ,  Satomi Hattori ,  Takahiro Ishida ,  Tomoyuki Yamaguchi

    Abstract: The design is the visual features of the MOLDED COIL as shown in the drawings, whether those features are features of one of shape, configuration, pattern or ornament or a combination of any of those features. FIG. 1 is a front view of a MOLDED COIL in accordance with the present design;FIG. 2 is a rear view of the MOLDED COIL of FIG. 1;FIG. 3 is a top plan of the MOLDED COIL of FIG. 1;FIG. 4 is a bottom view of the MOLDED COIL of FIG. 1;FIG. 5 is a right side view of the MOLDED COIL of FIG. 1;FIG. 6 is a left side view of the MOLDED COIL of FIG. 1; FIG. 7 is a front perspective view of the MOLDED COIL of FIG. 1; FIG. 8 is a rear perspective view of the MOLDED COIL of FIG. 1;FIG. 9 is a front view of a first variant of a MOLDED COIL;FIG. 10 is a rear view of the MOLDED COIL of FIG. 9;FIG. 11 is a top plan of the MOLDED COIL of FIG. 9;FIG. 12 is a bottom view of the MOLDED COIL of FIG. 9;FIG. 13 is a right side view of the MOLDED COIL of FIG. 9;FIG. 14 is a left side view of the MOLDED COIL of FIG. 9; FIG. 15 is a front perspective view of the MOLDED COIL of FIG. 9; FIG. 16 is a rear perspective view of the MOLDED COIL of FIG. 9FIG. 17 is a front view of a second variant of a MOLDED COIL;FIG. 18 is a rear view of the MOLDED COIL of FIG. 17FIG. 19 is a top plan of the MOLDED COIL of FIG. 17;FIG. 20 is a bottom view of the MOLDED COIL of FIG. 17;FIG. 21 is a right side view of the MOLDED COIL of FIG. 17;FIG. 22 is a left side view of the MOLDED COIL of FIG.17; FIG. 23 is a front perspective view of the MOLDED COIL of FIG.17; FIG. 24 is a rear perspective view of the MOLDED COIL of FIG. 17FIG. 25 is a front view of a third variant of a MOLDED COIL;FIG. 26 is a rear view of the MOLDED COIL of FIG. 25;FIG. 27 is a top plan of the MOLDED COIL of FIG. 25FIG. 28 is a bottom view of the MOLDED COIL of FIG. 25;FIG. 29 is a right side view of the MOLDED COIL of FIG. 25;FIG. 30 is a left side view of the MOLDED COIL of FIG. 25; FIG. 31 is a front perspective view of the MOLDED COIL of FIG. 25; FIG. 32 is a rear perspective view of the MOLDED COIL of FIG. 25FIG. 33 is a front view of a fourth variant of a MOLDED COIL;FIG. 34 is a rear view of the MOLDED COIL of FIG. 33;FIG. 35 is a top plan of the MOLDED COIL of FIG. 33;FIG. 36 is a bottom view of the MOLDED COIL of FIG. 33;FIG. 37 is a right side view of the MOLDED COIL of FIG. 33;FIG. 38 is a left side view of the MOLDED COIL of FIG.33; FIG. 39 is a front perspective view of the MOLDED COIL of FIG. 33; FIG. 40 is a rear perspective view of the MOLDED COIL of FIG. 33FIG. 41 is a front view of a fifth variant of a MOLDED COIL;FIG. 42 is a rear view of the MOLDED COIL of FIG. 41;FIG. 43 is a top plan of the MOLDED COIL of FIG. 41;FIG. 44 is a bottom view of the MOLDED COIL of FIG. 41;FIG. 45 is a right side view of the MOLDED COIL of FIG. 41;FIG. 46 is a left side view of the MOLDED COIL of FIG. 41; FIG. 47 is a front perspective view of the MOLDED COIL of FIG. 41; FIG. 48 is a rear perspective view of the MOLDED COIL of FIG. 41FIG. 49 is a front view of a sixth variant of a MOLDED COIL;FIG. 50 is a rear view of the MOLDED COIL of FIG. 49FIG. 51 is a top plan of the MOLDED COIL of FIG. 49;FIG. 52 is a bottom view of the MOLDED COIL of FIG. 49;FIG. 53 is a right side view of the MOLDED COIL of FIG. 49;FIG. 54 is a left side view of the MOLDED COIL of FIG. 49; FIG. 55 is a front perspective view of the MOLDED COIL of FIG. 49; FIG. 56 is a rear perspective view of the MOLDED COIL of FIG. 49.

    STRUCTURE FORMED ON SUBSTRATE, STRUCTURE MANUFACTURING METHOD AND LINE PATTERN
    227.
    发明申请
    STRUCTURE FORMED ON SUBSTRATE, STRUCTURE MANUFACTURING METHOD AND LINE PATTERN 审中-公开

    公开(公告)号：US20180020553A1

    公开(公告)日：2018-01-18

    申请号：US15717029

    申请日：2017-09-27

    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

    Inventor： Jun AKEDO ,  Akito ENDO

    IPC: H05K3/12 ,  H05K1/02

    CPC classification number: H05K3/125 ,  H05K1/0296 ,  H05K3/1241

    Abstract: Provided are a structure for which ink wettability/spreadability in the width direction of a line drawn on a substrate is limited and a high aspect ratio can be achieved, a manufacturing method for said structure, and a line pattern. The present invention provides a structure comprising: a droplet overlapping solidification layer obtained by droplets sloping and continuously overlapping each other in the direction of movement of a substrate and solidifying, a droplet flow solidified layer obtained by the droplets flowing on the droplet overlapping solidification layer and continuously being solidified without the droplets overlapping, and recesses formed at the boundary region between the droplet overlapping solidification layer and the droplet flow solidified layer.

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