Semiconductor device
    222.
    发明授权

    公开(公告)号:US11721370B2

    公开(公告)日:2023-08-08

    申请号:US17232708

    申请日:2021-04-16

    CPC classification number: G11C7/06 G11C14/0009

    Abstract: To provide a novel semiconductor device.
    The semiconductor device includes cell arrays and peripheral circuits; the cell arrays include memory cells; the peripheral circuits includes a first driver circuit, a second driver circuit, a first amplifier circuit, a second amplifier circuit, a third amplifier circuit, and a fourth amplifier circuit; the first driver circuit and the second driver circuit have a function of supplying a selection signal to the cell array; the first amplifier circuit and the second amplifier circuit have a function of amplifying a potential input from the cell array; the third amplifier circuit and the fourth amplifier circuit have a function of amplifying a potential input from the first amplifier circuit or the second amplifier circuit; the first driver circuit, the second driver circuit, the first amplifier circuit, the second amplifier circuit, the third amplifier circuit, and the fourth amplifier circuit include a region overlapping with the cell array; and the memory cells include a metal oxide in a channel formation region.

    Comparison circuit, semiconductor device, electronic component, and electronic device

    公开(公告)号:US11689829B2

    公开(公告)日:2023-06-27

    申请号:US17739726

    申请日:2022-05-09

    Abstract: Provided is a comparison circuit to which a negative voltage to be compared can be input directly. The comparison circuit includes a first input terminal, a second input terminal, a first output terminal, and a differential pair. The comparison circuit compares a negative voltage and a negative reference voltage and outputs a first output voltage from the first output terminal in response to the comparison result. The negative voltage is input to the first input terminal. A positive reference voltage is input to the second input terminal. The positive reference voltage is determined so that comparison is performed. The differential pair includes a first n-channel transistor and a second n-channel transistor each having a gate and a backgate. The first input terminal is electrically connected to the backgate of the first n-channel transistor. The second input terminal is electrically connected to the gate of the second n-channel transistor.

    Memory device and semiconductor device

    公开(公告)号:US11424246B2

    公开(公告)日:2022-08-23

    申请号:US17061920

    申请日:2020-10-02

    Abstract: It is an object to provide a memory device whose power consumption can be suppressed and a semiconductor device including the memory device. As a switching element for holding electric charge accumulated in a transistor which functions as a memory element, a transistor including an oxide semiconductor film as an active layer is provided for each memory cell in the memory device. The transistor which is used as a memory element has a first gate electrode, a second gate electrode, a semiconductor film located between the first gate electrode and the second gate electrode, a first insulating film located between the first gate electrode and the semiconductor film, a second insulating film located between the second gate electrode and the semiconductor film, and a source electrode and a drain electrode in contact with the semiconductor film.

    Semiconductor device
    225.
    发明授权

    公开(公告)号:US11355176B2

    公开(公告)日:2022-06-07

    申请号:US17048330

    申请日:2019-04-22

    Abstract: A semiconductor device in which a memory region at each level of a memory device can be changed is provided. The semiconductor device includes a memory device including a first and a second memory circuit and a control circuit. The first memory circuit includes a first capacitor and a first transistor which has a function of holding charges held in the first capacitor. The second memory circuit includes a second transistor, a second capacitor which is electrically connected to a gate of the second transistor, and a third transistor which has a function of holding charges held in the second capacitor. The first and the third transistors each have a semiconductor layer including an oxide semiconductor, a gate, and a back gate. The voltage applied to the back gate of the first or the third transistor is adjusted, whereby the memory region of each of the first and the second memory circuit is changed.

    Memory device
    226.
    发明授权

    公开(公告)号:US11158371B2

    公开(公告)日:2021-10-26

    申请号:US16956630

    申请日:2018-12-13

    Abstract: A novel memory device is provided.
    The memory device including a plurality of memory cells arranged in a matrix, and each of the memory cells includes a transistor and a capacitor. The transistor includes a first gate and a second gate, which include a region where they overlap with each other with a semiconductor layer therebetween. The memory device has a function of operating in a “writing mode”, a “reading mode”, a “refresh mode”, and an “NV mode”. In the “refresh mode”, data retained in the memory cell is read, and then the read data is written to the memory cell again for first time. In the “NV mode”, data retained in the memory cell is read, the read data is written to the memory cell again for second time, and then a potential at which the transistor is turned off is supplied to the second gate. The “NV mode” operation enables data to be stored for a long time even when power supply to the memory cell is stopped. The memory cell can store multilevel data.

    Semiconductor device and method for driving semiconductor device

    公开(公告)号:US11152366B2

    公开(公告)日:2021-10-19

    申请号:US16619190

    申请日:2018-05-29

    Abstract: A semiconductor device with a large storage capacity per unit area is provided. A semiconductor device includes a memory cell. The memory cell includes a first conductor; a first insulator over the first conductor; a first oxide over the first insulator and including a first region, a second region, and a third region positioned between the first region and the second region; a second insulator over the first oxide; a second conductor over the second insulator; a third insulator positioned in contact with a side surface of the first region; and a second oxide positioned on the side surface of the first region, with the third insulator therebetween. The first region includes a region overlapping the first conductor. The third region includes a region overlapped by the second conductor. The first region and the second region have a lower resistance than the third region.

    Semiconductor device, electronic component, and electronic device

    公开(公告)号:US11114470B2

    公开(公告)日:2021-09-07

    申请号:US16616707

    申请日:2018-05-25

    Abstract: A novel semiconductor device formed with single-polarity circuits using OS transistors is provided. Thus, connection between different layers in a memory circuit is unnecessary. This can reduce the number of connection portions and improve the flexibility of circuit layout and the reliability of the OS transistors. In particular, many memory cells are provided; thus, the memory cells are formed with single-polarity circuits, whereby the number of connection portions can be significantly reduced. Further, by providing a driver circuit in the same layer as the cell array, many wirings for connecting the driver circuit and the cell array can be prevented from being provided between layers, and the number of connection portions can be further reduced. An interposer provided with a plurality of integrated circuits can function as one electronic component.

    Semiconductor device and manufacturing method of semiconductor device

    公开(公告)号:US11101300B2

    公开(公告)日:2021-08-24

    申请号:US16628920

    申请日:2018-07-13

    Abstract: A semiconductor device enabling high integration is provided. The semiconductor device includes a plug, two capacitors, and two transistors sharing one oxide semiconductor. Each of the transistors includes a stacked-layer structure of a gate insulator and a gate electrode over the oxide semiconductor and an insulator in contact with a side surface of the gate electrode. An opening between the two gate electrodes exposes the insulators in contact with the side surfaces of the gate electrodes, and the plug is in the opening. The capacitor is directly provided over the oxide semiconductor. The side surface area of the capacitor is larger than the projected area of the capacitor.

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