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1.
公开(公告)号:US20140370706A1
公开(公告)日:2014-12-18
申请号:US14467142
申请日:2014-08-25
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Jun Koyama , Masahiro Takahashi , Hideyuki Kishida , Akiharu Miyanaga , Junpei Sugao , Hideki Uochi , Yasuo Nakamura
IPC: H01L21/768 , H01L29/66 , H01L21/324 , H01L21/02
CPC classification number: H01L29/7869 , H01L21/02164 , H01L21/0217 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L21/324 , H01L21/76801 , H01L21/76828 , H01L21/76838 , H01L27/1225 , H01L27/124 , H01L29/24 , H01L29/42384 , H01L29/45 , H01L29/4908 , H01L29/66742 , H01L29/66969 , H01L29/78606
Abstract: By using a conductive layer including Cu as a long lead wiring, increase in wiring resistance is suppressed. Further, the conductive layer including Cu is provided in such a manner that it does not overlap with the oxide semiconductor layer in which a channel region of a TFT is formed, and is surrounded by insulating layers including silicon nitride, whereby diffusion of Cu can be prevented; thus, a highly reliable semiconductor device can be manufactured. Specifically, a display device which is one embodiment of a semiconductor device can have high display quality and operate stably even when the size or definition thereof is increased.
Abstract translation: 通过使用包含Cu的导电层作为长引线,可以抑制布线电阻的增加。 此外,包括Cu的导电层以与形成TFT的沟道区域的氧化物半导体层不重叠并被包括氮化硅的绝缘层包围的方式设置,由此Cu的扩散可以 防止 因此,可以制造高度可靠的半导体器件。 具体地说,作为半导体装置的一个实施方式的显示装置,即使在尺寸或定义增加的情况下也能够具有高的显示质量,并且稳定地工作。
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公开(公告)号:US11527657B2
公开(公告)日:2022-12-13
申请号:US16965052
申请日:2019-02-18
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yuki Hata , Katsuaki Tochibayashi , Junpei Sugao , Shunpei Yamazaki
IPC: H01L29/78 , H01L29/786 , H01L21/3115 , H01L27/108
Abstract: A semiconductor device with a high on-state current is provided. The semiconductor device includes a first oxide, a second oxide over the first oxide, a third oxide over the second oxide, a first insulator over the third oxide, a conductor over the first insulator, a second insulator in contact with the second oxide and the third oxide, and a third insulator over the second insulator; the second oxide includes first region to fifth regions; the resistance of the first region and the resistance of the second region are lower than the resistance of the third region; the resistance of the fourth region and the resistance of the fifth region are lower than the resistance of the third region and higher than the resistance of the first region and the resistance of the second region; and the conductor is provided over the third region, the fourth region, and the fifth region to overlap with the third region, the fourth region, and the fifth region.
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公开(公告)号:US10056131B2
公开(公告)日:2018-08-21
申请号:US15164133
申请日:2016-05-25
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tomoaki Atsumi , Junpei Sugao
IPC: G11C11/401 , G11C11/4094 , H01L29/786 , H01L27/12 , G11C11/4096 , G11C11/4097 , H01L27/11 , H01L27/1156
CPC classification number: G11C11/4094 , G11C11/401 , G11C11/4096 , G11C11/4097 , H01L27/1104 , H01L27/1156 , H01L27/1225 , H01L27/124 , H01L27/1251 , H01L27/1255 , H01L29/78675 , H01L29/7869 , H01L29/78696
Abstract: The semiconductor device includes a first memory cell, and a second memory cell thereover. The first memory cell includes first and second transistors, and a first capacitor. The second memory cell includes third and fourth transistors, and a second capacitor. A gate of the first transistor is electrically connected to one of a source and a drain of the second transistor and the first capacitor. A gate of the third transistor is electrically connected to one of a source and a drain of the fourth transistor and the second capacitor. One of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the third transistor. The second and fourth transistors include an oxide semiconductor. A channel length direction of the first and third transistors is substantially perpendicular to a channel length direction of the second and fourth transistors.
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4.
公开(公告)号:US08982589B2
公开(公告)日:2015-03-17
申请号:US14088496
申请日:2013-11-25
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yutaka Shionoiri , Junpei Sugao
CPC classification number: H02M3/158 , H01L27/0688 , H01L27/1225 , H02M3/073
Abstract: One object is to provide a boosting circuit whose boosting efficiency is enhanced. Another object is to provide an RFID tag including a boosting circuit whose boosting efficiency is enhanced. A node corresponding to an output terminal of a unit boosting circuit or a gate electrode of a transistor connected to the node is boosted by bootstrap operation, so that a decrease in potential which corresponds to substantially the same as the threshold potential of the transistor can be prevented and a decrease in output potential of the unit boosting circuit can be prevented.
Abstract translation: 一个目的是提供一种提升效率提高的升压电路。 另一个目的是提供一种RFID标签,其包括提升效率提高的升压电路。 与单元升压电路的输出端子或与该节点连接的晶体管的栅电极对应的节点通过自举运算来升压,使得与晶体管的阈值电位基本相同的电位降低可以是 可以防止单元升压电路的输出电位的降低。
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公开(公告)号:US20130113044A1
公开(公告)日:2013-05-09
申请号:US13729322
申请日:2012-12-28
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Jun Koyama , Masahiro Takahashi , Hideyuki Kishida , Akiharu Miyanaga , Yasuo Nakamura , Junpei Sugao , Hideki Uochi
IPC: H01L29/786
CPC classification number: H01L29/78669 , H01L27/1214 , H01L27/1225 , H01L27/124 , H01L27/1255 , H01L27/1288 , H01L29/45 , H01L29/4908 , H01L29/66969 , H01L29/78606 , H01L29/78678 , H01L29/7869
Abstract: It is an object to provide a semiconductor device typified by a display device having a favorable display quality, in which parasitic resistance generated in a connection portion between a semiconductor layer and an electrode is suppressed and an adverse effect such as voltage drop, a defect in signal wiring to a pixel, a defect in grayscale, and the like due to wiring resistance are prevented. In order to achieve the above object, a semiconductor device according to the present invention may have a structure where a wiring with low resistance is connected to a thin film transistor in which a source electrode and a drain electrode that include metal with high oxygen affinity are connected to an oxide semiconductor layer with a suppressed impurity concentration. In addition, the thin film transistor including the oxide semiconductor may be surrounded by insulating films to be sealed.
Abstract translation: 本发明的目的是提供一种由具有良好的显示质量的显示装置代表的半导体器件,其中在半导体层和电极之间的连接部分中产生的寄生电阻被抑制,并且具有诸如电压降等的不利影响 防止由于布线电阻而导致像素的信号布线,灰度级的缺陷等。 为了实现上述目的,根据本发明的半导体器件可以具有这样的结构,其中具有低电阻的布线连接到薄膜晶体管,其中包括具有高氧亲和力的金属的源电极和漏电极是 连接到具有抑制的杂质浓度的氧化物半导体层。 另外,包含氧化物半导体的薄膜晶体管也可以被要被密封的绝缘膜包围。
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公开(公告)号:US11729960B2
公开(公告)日:2023-08-15
申请号:US17503651
申请日:2021-10-18
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Hajime Kimura , Takayuki Ikeda , Kiyoshi Kato , Yuta Endo , Junpei Sugao
IPC: H10B12/00 , G11C5/02 , G11C11/403 , G11C11/409 , H01L29/24
CPC classification number: H10B12/00 , G11C5/02 , G11C11/403 , G11C11/409 , H01L29/24
Abstract: A semiconductor device with a large storage capacity per unit area is provided. A semiconductor device includes a memory cell. The memory cell includes a first conductor; a first insulator over the first conductor; a first oxide over the first insulator and including a first region, a second region, and a third region positioned between the first region and the second region; a second insulator over the first oxide; a second conductor over the second insulator; a third insulator positioned in contact with a side surface of the first region; and a second oxide positioned on the side surface of the first region, with the third insulator therebetween. The first region includes a region overlapping the first conductor. The third region includes a region overlapped by the second conductor. The first region and the second region have a lower resistance than the third region.
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公开(公告)号:US11367793B2
公开(公告)日:2022-06-21
申请号:US17008745
申请日:2020-09-01
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Jun Koyama , Masahiro Takahashi , Hideyuki Kishida , Akiharu Miyanaga , Junpei Sugao , Hideki Uochi , Yasuo Nakamura
IPC: H01L29/66 , H01L29/786 , H01L21/768 , H01L27/12 , H01L29/45 , H01L29/49 , H01L21/02 , H01L21/324 , H01L29/24 , H01L29/423
Abstract: By using a conductive layer including Cu as a long lead wiring, increase in wiring resistance is suppressed. Further, the conductive layer including Cu is provided in such a manner that it does not overlap with the oxide semiconductor layer in which a channel region of a TFT is formed, and is surrounded by insulating layers including silicon nitride, whereby diffusion of Cu can be prevented; thus, a highly reliable semiconductor device can be manufactured. Specifically, a display device which is one embodiment of a semiconductor device can have high display quality and operate stably even when the size or definition thereof is increased.
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公开(公告)号:US20200211627A1
公开(公告)日:2020-07-02
申请号:US16732555
申请日:2020-01-02
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tomoaki Atsumi , Junpei Sugao
IPC: G11C11/4094 , H01L29/786 , H01L27/12 , G11C11/4096 , G11C11/401 , G11C11/4097
Abstract: The semiconductor device includes a first memory cell, and a second memory cell thereover. The first memory cell includes first and second transistors, and a first capacitor. The second memory cell includes third and fourth transistors, and a second capacitor. A gate of the first transistor is electrically connected to one of a source and a drain of the second transistor and the first capacitor. A gate of the third transistor is electrically connected to one of a source and a drain of the fourth transistor and the second capacitor. One of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the third transistor. The second and fourth transistors include an oxide semiconductor. A channel length direction of the first and third transistors is substantially perpendicular to a channel length direction of the second and fourth transistors.
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公开(公告)号:US10043915B2
公开(公告)日:2018-08-07
申请号:US15432977
申请日:2017-02-15
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Jun Koyama , Masahiro Takahashi , Hideyuki Kishida , Akiharu Miyanaga , Junpei Sugao , Hideki Uochi , Yasuo Nakamura
IPC: H01L29/76 , H01L29/786 , H01L29/24 , H01L29/49 , H01L29/423 , H01L29/66
Abstract: By using a conductive layer including Cu as a long lead wiring, increase in wiring resistance is suppressed. Further, the conductive layer including Cu is provided in such a manner that it does not overlap with the oxide semiconductor layer in which a channel region of a TFT is formed, and is surrounded by insulating layers including silicon nitride, whereby diffusion of Cu can be prevented; thus, a highly reliable semiconductor device can be manufactured. Specifically, a display device which is one embodiment of a semiconductor device can have high display quality and operate stably even when the size or definition thereof is increased.
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公开(公告)号:US09865742B2
公开(公告)日:2018-01-09
申请号:US13729322
申请日:2012-12-28
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Jun Koyama , Masahiro Takahashi , Hideyuki Kishida , Akiharu Miyanaga , Yasuo Nakamura , Junpei Sugao , Hideki Uochi
IPC: H01L27/14 , H01L29/786 , H01L27/12 , H01L29/45 , H01L29/66
CPC classification number: H01L29/78669 , H01L27/1214 , H01L27/1225 , H01L27/124 , H01L27/1255 , H01L27/1288 , H01L29/45 , H01L29/4908 , H01L29/66969 , H01L29/78606 , H01L29/78678 , H01L29/7869
Abstract: It is an object to provide a semiconductor device typified by a display device having a favorable display quality, in which parasitic resistance generated in a connection portion between a semiconductor layer and an electrode is suppressed and an adverse effect such as voltage drop, a defect in signal wiring to a pixel, a defect in grayscale, and the like due to wiring resistance are prevented. In order to achieve the above object, a semiconductor device according to the present invention may have a structure where a wiring with low resistance is connected to a thin film transistor in which a source electrode and a drain electrode that include metal with high oxygen affinity are connected to an oxide semiconductor layer with a suppressed impurity concentration. In addition, the thin film transistor including the oxide semiconductor may be surrounded by insulating films to be sealed.
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