SYSTEMS AND METHODS FOR PROCESS METRIC AWARE PROCESS CONTROL

    公开(公告)号:US20230076185A1

    公开(公告)日:2023-03-09

    申请号:US17799806

    申请日:2021-01-26

    Abstract: A method including: determining a sequence of states of an object, the states determined based on processing information associated with the object, wherein the sequence of states includes one or more future states of the object; determining, based on at least one of the states within the sequence of states and the one or more future states, a process metric associated with the object, the process metric including an indication of whether processing requirements for the object are satisfied for individual states in the sequence of states; and initiating an adjustment to processing based on (1) at least one of the states and the one or more future states and (2) the process metric, the adjustment configured to enhance the process metric for the individual states in the sequence of states such that final processing requirements for the object are satisfied.

    METHODS AND SYSTEMS FOR MASKLESS LITHOGRAPHY

    公开(公告)号:US20230061967A1

    公开(公告)日:2023-03-02

    申请号:US17793726

    申请日:2020-12-28

    Abstract: Method of exposing a substrate by a patterned radiation beam, comprising: —providing a radiation beam; —imparting the radiation beam by an array of individually controllable elements; —generating, from the radiation beam, a patterned radiation beam, by tilting the individually controllable elements between different positions about a tilting axis; —projecting the patterned radiation beam towards a substrate; —scanning a substrate across the patterned radiation beam in a scanning direction so as to expose the substrate to the patterned radiation beam, whereby the tilting axis of the individually controllable elements is substantially perpendicular to the scanning direction.

    Pixel shape and section shape selection for large active area high speed detector

    公开(公告)号:US11594395B2

    公开(公告)日:2023-02-28

    申请号:US17049329

    申请日:2019-03-21

    Abstract: Detectors and detection systems are disclosed. According to certain embodiments, a detector comprises a substrate comprising a plurality of sensing elements including a first sensing element and a second sensing element, wherein at least the first sensing element is formed in a triangular shape. The detector may include a switching region configured to connect the first sensing 5 element and the second sensing element. There may also be provided a plurality of sections including a first section connecting a first plurality of sensing elements to a first output and a second section connecting a second plurality of sensing elements to a second output. The section may be provided in a hexagonal shape.

    Assembly comprising a cryostat and layer of superconducting coils and motor system provided with such an assembly

    公开(公告)号:US11592756B2

    公开(公告)日:2023-02-28

    申请号:US15734882

    申请日:2019-05-09

    Abstract: The invention provides an assembly comprising a cryostat (6, 7, 8, 9) and a flat coil layer (3) of superconducting coils (2) for use with a magnetic levitation and/or acceleration motor system (1) of a lithographic apparatus. The cryostat comprises two insulation coverings (8, 9). The coil layer is arranged between the two coverings. The coverings each comprise an inner plate (10) configured to be cryocooled and an outer plate (11) parallel to the inner plate, and an insulation system with a vacuum layer (13) between the inner and outer plate. The insulation system of said covering comprises a layer of circular bodies (101), the central axes of these bodies extending perpendicular to the inner and outer plate, and is configured to provide a layer of point contacts between two layers of circular bodies or between a layer of circular bodies and the inner and/or outer plate.

    Apparatus and method for process-window characterization

    公开(公告)号:US11592752B2

    公开(公告)日:2023-02-28

    申请号:US16875643

    申请日:2020-05-15

    Abstract: A process of characterizing a process window of a patterning process, the process including: obtaining a set of inspection locations for a pattern, the pattern defining features to be applied to a substrate with a patterning process, the set of inspection locations corresponding to a set of the features, the set of features being selected from among the features according to sensitivity of the respective features to variation in one or more process characteristics of the patterning process; patterning one or more substrates under varying process characteristics of the patterning process; and determining, for each of the variations in the process characteristics, whether at least some of the set of features yielded unacceptable patterned structures on the one or more substrates at corresponding inspection locations.

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