公开(公告)号：US20170339476A1

公开(公告)日：2017-11-23

申请号：US15670678

申请日：2017-08-07

Applicant: GOERTEK INC.

Inventor： Wei JIA ,  Hua SHI

IPC: H04R1/02 ,  H04M1/02 ,  H04M1/03 ,  H04M1/60

CPC classification number: H04R1/025 ,  H04M1/026 ,  H04M1/035 ,  H04M1/6041 ,  H04R1/02 ,  H04R1/2811 ,  H04R2499/11

Abstract: Disclosed is a loudspeaker module applied inside a terminal, wherein, the terminal comprises a terminal housing, and the loudspeaker module is fixed inside the terminal. The loudspeaker module comprises a loudspeaker unit and a module housing for accommodating and fixing the loudspeaker unit. A closed space formed by the loudspeaker unit, an outer wall of the module housing, and the terminal housing is a rear sound cavity. By means of the loudspeaker module provided in the present invention, the usable space inside the terminal can be converted into the rear sound cavity, so that the space of the rear sound cavity is enlarged, and the acoustic performance of the loudspeaker module can be effectively improved. Therefore, the present invention makes full use of the inside space of the terminal to realize the thinning of the loudspeaker module without changing the inside space of the terminal, and achieves good acoustic performance.

公开(公告)号：US20170330867A1

公开(公告)日：2017-11-16

申请号：US15531194

申请日：2015-07-14

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/83192 ,  H01L2933/005 ,  H01L2933/0066

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate, wherein the micro-LEDs are lateral micro-LEDs whose P electrodes and N electrodes are located on one side; bringing the P electrodes and N electrodes of the lateral micro-LEDs into contact with pads preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the lateral micro-LEDs from the original substrate. A technical effect of using lateral micro-LEDs lies in that the processing for N metal electrode after the micro-LED transfer can be omitted.

公开(公告)号：US20170307647A1

公开(公告)日：2017-10-26

申请号：US15517478

申请日：2015-06-29

Applicant: Goertek Inc.

Inventor： Wenming Yan

IPC: G01P5/14

CPC classification number: G01P5/14

Abstract: Disclosed is a method and device for testing wind speed. The method includes, but is not limited to: measuring a static pressure P0 of an inner cavity of a pressure hole of a mobile device (S100), wherein the pressure hole being in communication with the outside; aligning the pressure hole to a wind direction and acquiring a total pressure P of the wind (S101); and acquiring a current wind speed according to a corresponding relational expression between a wind speed v and a dynamic pressure P−P0 (S102). The device includes, but is not limited to, a pressure sensor and a wind speed acquiring unit. The technical solution acquires the current wind speed according to a correspondence between wind speeds and dynamic pressures of wind, may effectively improve the precision of the wind speed testing, and does not cause damage to relevant parts of the mobile device.

公开(公告)号：US20170265013A1

公开(公告)日：2017-09-14

申请号：US15127002

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU

IPC: H04R31/00 ,  B81B3/00 ,  H04R7/04 ,  B81C1/00 ,  H04R19/02 ,  H04R19/00

Abstract: Provided is a PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate; providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate; providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer; and releasing the sacrificial layer and the diaphragm layer remains. With the micromachining method for the above PCB substrate and the diaphragm, the production cost of the speaker can be lowered, and the reliability of the product can be improved at the same time.

公开(公告)号：US20170201833A1

公开(公告)日：2017-07-13

申请号：US15315350

申请日：2015-05-19

Applicant: GOERTEK INC.

Inventor： Jingwei WANG ,  Ling WAN

IPC: H04R9/06 ,  H04R9/02 ,  H04R7/04 ,  H04R1/02

CPC classification number: H04R9/06 ,  H04R1/028 ,  H04R7/04 ,  H04R7/12 ,  H04R9/025 ,  H04R9/046

Abstract: A bending loudspeaker and an electronic wearing product using same. The bending loudspeaker comprises a vibrating system, a magnetic circuit system and a shell (1), wherein the vibrating system comprises a vibrating diaphragm (2) having a bending shape and a voice coil (3) having a bending shape which is in matched combination with the vibrating diaphragm; the magnetic circuit system comprises a washer, a magnet and a speaker frame (8) having a bending shape from top to bottom, wherein the washer comprises a central washer (4) having a bending shape and side washers (5) having a bending shape which are arranged at two sides of the central washer (4) having a bending shape, and the magnets comprises a central magnet (6) having a bending shape and side magnetic (7) having a bending shape which are arranged at two sides of the central magnet (6) having a bending shape.

公开(公告)号：US20170164117A1

公开(公告)日：2017-06-08

申请号：US15311152

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Zhe WANG

IPC: H04R19/00 ,  B81B3/00 ,  H04R31/00 ,  B81C1/00

CPC classification number: H04R19/005 ,  B81B3/001 ,  B81B7/00 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/012 ,  B81C1/0023 ,  B81C2203/0118 ,  B81C2203/058 ,  B81C2203/0785 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: The present invention provides a method for manufacturing a fully wafer-level-packaged MEMS microphone and a microphone manufactured with the same, the method comprises: separately manufacturing a first packaging wafer, an MEMS microphone wafer and a second packaging wafer; performing wafer-to-wafer bonding for the three wafers to form a plurality of fully wafer-level-packaged MEMS microphone units; singulating the fully wafer-level-packaged MEMS microphone units to form a plurality of fully wafer-level-packaged MEMS microphones, which are fully packaged at wafer level and do not need any further process after die singulation. The method can improve cost-effectiveness, performance consistency, manufacturability, quality, scaling capability of the packaged MEMS microphone.

公开(公告)号：US20170134848A1

公开(公告)日：2017-05-11

申请号：US15323045

申请日：2014-09-09

Applicant: GOERTEK INC.

Inventor： Minghui SHAO ,  Jianbin YANG

IPC: H04R1/28 ,  H04R7/12 ,  H04R7/18 ,  H04R9/06 ,  H04R9/02

CPC classification number: H04R1/2834 ,  H04R1/2842 ,  H04R1/2857 ,  H04R7/127 ,  H04R7/18 ,  H04R9/025 ,  H04R9/06 ,  H04R2307/025 ,  H04R2499/11

Abstract: Disclosed is a speaker module, comprising an active sound source, a passive sound source and a protective frame; the active sound source comprises a vibration system and a magnetic circuit system; the side surface of the protective frame is provided with a sound hole for the active sound source; the passive sound source comprises two passive radiators, and the two passive radiators are arranged in parallel and enclose a cavity; a sound wave at one side of a vibrating diaphragm adjacent to the magnetic circuit system is divided into two parts respectively transmitted to one side of each of the two passive radiators away from the cavity; and a sound wave in the cavity is projected and emitted to the external environment via a sound hole for the passive sound source. The structure improves the bass effect of the speaker module, and improves the acoustic performance of the product.

公开(公告)号：US20170112448A1

公开(公告)日：2017-04-27

申请号：US15126873

申请日：2015-08-03

Applicant: Goertek Inc.

Inventor： Song LIU ,  Shasha LOU ,  Bo LI

IPC: A61B5/00 ,  A61B5/024

CPC classification number: A61B5/725 ,  A61B5/02 ,  A61B5/024 ,  A61B5/6803 ,  A61B5/6831 ,  A61B5/7207 ,  A61B5/7282

Abstract: A photoelectric type pulse signal measuring method includes, obtaining a main-path light signal transmitted by a photoelectric transmitter and reflected back from a surface of skin having an artery underneath, obtaining at least one auxiliary-path light signal receiving an ambient light signal, and based on the at least one auxiliary-path light signal, adaptively filtering an ambient light interference from the main-path light signal and obtaining an adaptive filtration result; or obtaining at least one auxiliary-path light signal transmitted by the same photoelectric transmitter and reflected back from a surface of skin without any artery underneath, and based on the auxiliary-path light signal, adaptively filtering a motion interference from the main-path light signal; then extracting a pulse signal from the adaptive filtration result. The present invention can simply and effectively eliminate the ambient light interference or motion interference upon photoelectric pulse signal measurement. Photoelectric type pulse signal measuring devices are also disclosed.

公开(公告)号：US09628900B2

公开(公告)日：2017-04-18

申请号：US14892121

申请日：2013-12-13

Applicant: GOERTEK INC.

Inventor： Jianbin Yang ,  Chao Jiang

IPC: H04R1/24 ,  H04R9/02 ,  H04R9/06 ,  H04R1/28 ,  H04R7/18 ,  H04R1/02

CPC classification number: H04R1/24 ,  H04R1/02 ,  H04R1/025 ,  H04R1/28 ,  H04R1/2807 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R9/063 ,  H04R2400/07

Abstract: A double-diaphragm loudspeaker module comprises: a housing providing with a first sound hole and a second sound hole; a supporting structure fixed on an inner wall of the housing; and a loudspeaker unit comprising a first diaphragm, a sound coil, a magnetic circuit system and a second diaphragm. The sound coil and the magnetic circuit system are separately combined with the first diaphragm and the second diaphragm. The housing, the supporting structure and the loudspeaker unit form a first front sound cavity, a second front sound cavity, and a rear sound cavity. The first front sound cavity comprises a space between the first diaphragm and the housing. The second front sound cavity comprises a space between the second diaphragm and the housing. The rear sound cavity comprises a space between the first diaphragm and the second diaphragm.

公开(公告)号：US20170055081A1

公开(公告)日：2017-02-23

申请号：US15119116

申请日：2014-07-15

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Zhe WANG

IPC: H04R7/14 ,  H04R1/04 ,  B81B3/00 ,  H04R19/04

CPC classification number: H04R7/14 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/019 ,  B81C1/0023 ,  B81C2201/115 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15192 ,  H04R1/04 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003 ,  H04R2307/027 ,  H01L2924/00014

Abstract: The present invention provides a silicon microphone with a high-aspect-ratio corrugated diaphragm and a microphone package including the same. The microphone comprises the corrugated diaphragm on which at least one ring-shaped corrugation is formed in the vicinity of the edge of the diaphragm which is fixed to the substrate, the corrugated diaphragm is flexible, wherein the ratio of the depth of the corrugation to the thickness of the diaphragm is larger than 5:1, preferably 20:1, and the walls of the corrugation are inclined to the surface of the diaphragm at an angle in the range of 80° to 100°. The microphone with the high-aspect-ratio corrugated diaphragm can achieve a consistent and optimal sensitivity and greatly reduce impact applied thereto in a drop test so that the performances, the reproducibility, the reliability and the yield can be improved. The microphone package of the present invention further provides a simplified processing, an improved sensitivity and an improved SNR.

Abstract translation: 本发明提供一种具有高纵横比的波纹状隔膜的硅麦克风和包括该硅麦克风的麦克风封装。 麦克风包括波纹膜片，在该波纹膜片上，在隔膜的边缘附近形成有至少一个环形波纹，该波纹膜片固定到基底上，波纹膜片是柔性的，其中波纹深度与 隔膜的厚度大于5:1，优选为20:1，并且波纹壁相对于隔膜的表面以80°至100°的范围内的角度倾斜。 具有高纵横比波纹膜片的麦克风可以实现一致和最佳的灵敏度，并且在跌落测试中大大降低了对其的影响，从而可以提高性能，再现性，可靠性和产量。 本发明的麦克风封装还提供简化的处理，改进的灵敏度和改进的SNR。