Abstract:
There is provided an RF receiver recovering timing offset by shifting timing slots in response to timing offset occurring when a signal is sampled. An RF receiver having timing offset recovery function according to an aspect of the invention includes: a preprocessing unit sampling and digitalizing an analog received signal; a differential operation unit delaying the digitalized received signal from the preprocessing unit for predetermined periods of time and differentiating the delayed signals; a correlation unit correlating the differentiated received signals from the differential operation unit with a plurality of predetermined PN code sequences and sequentially outputting correlation values; a setting unit sequentially storing the correlation values from the correlation unit, detecting a maximum value among the stored correlation values, and shifting a plurality of determination slots by a difference between a storage location of the detected maximum value and a reference storage location; and a demodulation value estimation unit estimating as a demodulation value of the received signal, a symbol of a PN code sequence corresponding to the maximum value from the shifted determination slots.
Abstract:
An apparatus and method for determining operation of location update in a broadband wireless communication system are provided. The apparatus includes a receiver, an interpreter, and a determiner. In an idle mode, the receiver receives a paging advertisement message from a Base Station (BS). The interpreter identifies paging group identification information included in the paging advertisement message. The determiner determines one of execution and non-execution of a location update process due to a change of a paging group if the paging group identification information is different from paging group identification information included in a previously received paging advertisement message.
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base integrated circuit, by: providing a metal sheet, mounting an integrated circuit die on the metal sheet, injecting a molded package body on the integrated circuit die and the metal sheet, and forming a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body; coupling a circuit package on the ball pad; and forming a component package on the substrate, the base integrated circuit, and the leadframe interposer.
Abstract:
The present invention relates to a wireless communication system and a service flow identifier management method thereof. The wireless communication system includes a plurality of RASs for controlling a plurality of PSSs in a radio network, and a plurality of ACRs for providing wireless communication services to the PSSs through the plurality of RASs, and respectively managing a service flow identifier used for identifying a connection service for each PSS. When a status of each service flow identifier managed by the plurality of ACRs is different, the wireless communication system releases the corresponding service flow identifier so as to set the status of each of the service flow identifiers to be the same. According to the present invention, in the wireless communication system, the plurality of ACRs separately manage service flow identifiers, and mismatched service flow identifier information due to errors in the system or a node or message transmission/receiving errors can be set to be the same. In addition, when a partial system error occurs and thus the system is restored, a service flow identifier not having the same status due to the error can be efficiently released and set to be the same.
Abstract:
An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.
Abstract:
An integrated circuit package system comprising: providing a substrate having a first substrate surface and a second substrate surface; forming a first package connector and a second package connector over substantially opposite locations of the first substrate surface and the second substrate surface; and attaching a first integrated circuit and a second integrated circuit adjacent the first package connector over the first substrate surface and the second package connector over the second substrate surface.
Abstract:
Disclosed herein is a composition for the treatment and prevention of allergic inflammatory diseases comprising N-hydroxy-4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl)phenoxy]pentoxy}-benzamidine, 4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl)phenoxy]pentoxy}-benzamidine or pharmaceutically acceptable salts. The composition exhibits excellent medicinal effects on allergic inflammatory diseases, with a great reduction in typical chronic inflammation symptoms, such as an increase of eosinophil level in bronchoalveolar lavage fluid, total leukocyte level and eosinophil level in blood, the hypertrophy or hyperplasia of bronchial epithelium due to an increase in the number of mucus cells, a reduction in alveolar surface area resulting from the hyptertrophy of alveolar walls, and the infiltration of inflammatory cells.
Abstract:
A global matching method for semiconductor memory device fabrication may include extracting a graphic data system (GDS) image and a scanning electron microscope (SEM) image of patterns in a region on a wafer. First directional edges extending in a first direction and second directional edges extending in a second direction may be separately extracted from each of the GDS image and the SEM image with the first and second directions being different. The GDS image and the SEM image may be matched with respect to either the first directional edges or the second directional edges which are relatively shorter. After the relatively shorter edges of the GDS image and the SEM image are matched, the GDS image and the SEM image may be matched with respect to relatively longer edges, based on a result of the matching with respect to the relatively shorter edges, thereby completing pattern matching of the GDS image and the SEM image.
Abstract:
A rotary punching apparatus includes: an upper rotation plate provided with punching member on which punching blade having a pattern of a specific shape is formed, and an upper jig which support elastically the punching member and forms a guide hole in the same shape as the pattern; an upper plate configured to enable the upper rotation plate to be rotated; a lower rotation plate including lower jig on which a punching hole in the same shape as the pattern is formed; and lower plate configured to enable the lower rotation plate to be rotated.
Abstract:
A power control system for an LCD monitor having an LCD panel includes a light source unit providing light to the LCD panel, a power supply unit generating a standard low DC current, and a high-voltage generator for converting the lower DC voltage to a relatively high voltage and supplying the high voltage to the light source. The power control system further includes a feedback control unit coupled to the power supply unit for interrupting the operation of the power supply unit when the converted high voltage is determined to be abnormal. The feedback control unit includes a cable, through which a voltage can be induced due to high voltage generated by the high-voltage generator, and a power supply control circuit capable of interrupting the operation of the power supply unit when the converted high voltage is determined to be abnormal by analyzing the induced current. The