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    Method For Direct Connection Of MMIC Amplifiers To Balanced Antenna Aperture
    262.
    发明申请
    Method For Direct Connection Of MMIC Amplifiers To Balanced Antenna Aperture 审中-公开
    将MMIC放大器直接连接到平衡天线孔径的方法

    公开(公告)号：US20140327590A1

    公开(公告)日：2014-11-06

    申请号：US14332979

    申请日：2014-07-16

    Applicant: BAE Systems Information and Electronic Systems Integration Inc.

    Inventor： David E. Meharry ,  David P. Charette

    IPC: H01Q13/04

    CPC classification number: H01Q13/08 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01Q13/04 ,  H01Q13/10 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00014

    Abstract: A MMIC amplifier is directly connected to the balanced feed points at the aperture of an antenna to eliminate the distance between electronics coupled to the antenna and the antenna itself, such that interfaces, components and connection lines which introduce losses and parasitic effects that degrade system performance are eliminated due the direct connection. Expanding the aperture of the antenna to accommodate the direct connection of a MMIC amplifier to balanced feed points of an antenna has been found to have no deleterious effects on antenna performance. Moreover, when coupling the MMIC amplifier to an unbalanced coaxial line, any associated ripple is minimized due to the direct connection.

    Abstract translation: MMIC放大器直接连接到天线孔径处的平衡馈电点，以消除耦合到天线的电子设备与天线本身之间的距离，从而导致损耗和寄生效应降低系统性能的接口，组件和连接线路 由于直接连接被消除。 已经发现扩大天线的孔径以适应MMIC放大器与天线的平衡馈电点的直接连接对天线性能没有有害的影响。 此外，当将MMIC放大器耦合到不平衡同轴线路时，由于直接连接，任何相关联的纹波被最小化。

    MULTIBAND WHIP ANTENNA
    263.
    发明申请
    MULTIBAND WHIP ANTENNA 审中-公开
    多天线天线

    公开(公告)号：US20140327488A1

    公开(公告)日：2014-11-06

    申请号：US14333019

    申请日：2014-07-16

    Applicant: BAE Systems Information and Electronic Systems Integration Inc.

    Inventor： John T. Apostolos ,  William Mouyos ,  Judy Feng

    IPC: H04B3/28

    CPC classification number: H01P1/20 ,  H01P3/08 ,  H01Q1/10 ,  H01Q1/32 ,  H01Q5/314

    Abstract: A multi-band whip antenna having a 30 MHz to 2 GHz bandwidth and an L-band dipole has its coverage extended up to 6 GHz by eliminating nulls and reducing VSWR problems that are cured through the utilization of a sleeve over the feedpoint of the L-band antenna. Chokes in the form of sleeves are provided at either end of the L-band dipole to shorten the L-band antenna for preventing reverse polarity currents at the L-band antenna feedpoint, with the antenna further including the use of double shielded meanderlines to provide improved performance between 410-512 MHz and in which a capacitance sleeve is added at the bottom of the L-band antenna to effectively elongate the antenna below the L-band to permit operation below 700 MHz.

    Abstract translation: 具有30MHz至2GHz带宽和L频带偶极子的多频带鞭状天线的覆盖范围通过消除零点并且减少通过在L的馈电点上利用套筒而固化的VSWR问题而将其覆盖范围扩展到6GHz 带天线。 袖带形式的扼流器设置在L波段偶极子的任一端，以缩短L波段天线，以防止L波段天线馈电点处的反向极性电流，天线还包括使用双屏蔽曲折线，以提供 改善了在410-512MHz之间的性能，并且在L波段天线的底部添加了一个电容套管，以有效地将天线拉长至低于L波段，以允许低于700 MHz的工作。

    METHOD FOR SIMULATION OF PARTIAL VLSI ASIC DESIGN
    264.
    发明申请
    METHOD FOR SIMULATION OF PARTIAL VLSI ASIC DESIGN 有权
    用于模拟部分VLSI ASIC设计的方法

    公开(公告)号：US20140325460A1

    公开(公告)日：2014-10-30

    申请号：US14251267

    申请日：2014-04-11

    Applicant: BAE Systems Information And Electronic Systems Integration Inc.

    Inventor： Richard Ferguson ,  Lloyd Brown

    IPC: G06F17/50

    CPC classification number: G06F17/5036

    Abstract: A system and method for an automated way of running spice on a small portion of a design is presented. The system includes a sub-circuit netlist generation processor and an analog simulation processor. The sub-circuit netlist generation processor generates a sub-circuit netlist based, at least in part, on a HDL netlist, a parasitic capacitance database and trace rules. The sub-circuit netlist contains significantly fewer paths than the HDL netlist of an entire design so that its simulation time is much quicker. The analog simulation processor generates analog simulation results of the sub-circuit netlist based, at least in part, on dynamic inputs.

    Abstract translation: 提出了一种用于在设计的一小部分上运行香料的自动化方式的系统和方法。 该系统包括一个子电路网表生成处理器和一个模拟仿真处理器。 子电路网表生成处理器至少部分地基于HDL网表，寄生电容数据库和跟踪规则来生成子电路网表。 子电路网表包含比整个设计的HDL网表少得多的路径，以便其模拟时间更快。 模拟仿真处理器至少部分地基于动态输入产生子电路网表的模拟仿真结果。

    Method for fabricating an image panel for a hyperspectral camera
    265.
    发明授权
    Method for fabricating an image panel for a hyperspectral camera 有权
    制造高光谱相机图像面板的方法

    公开(公告)号：US08865496B2

    公开(公告)日：2014-10-21

    申请号：US14271574

    申请日：2014-05-07

    Applicant: BAE Systems Information and Electronic Systems Integration Inc.

    Inventor： Thomas H. Wallace

    IPC: H01L21/00 ,  H01L31/18 ,  H01L31/0232

    CPC classification number: H01L31/02327 ,  G01J3/04 ,  G01J3/2803 ,  G01J3/2823 ,  G02B5/005 ,  H01L27/14625 ,  H01L31/18

    Abstract: A method for fabricating an image panel for a hyperspectral camera that is configured to scan a scene and obtain spectral image data over as defined range of wavelengths. At least one companion sensor is first fabricated on a planar imaging surface of a silicon die. At least as region of the silicon die is then back thinned to a diffraction thickness that is suitable for a diffraction slit. A diffraction slit is then formed in the thinned region so that the diffraction slit penetrates the silicon die in the thinned region, and the diffraction slit is co-planar with the imaging surface of the silicon die.

    Abstract translation: 一种用于制造用于超光谱照相机的图像面板的方法，其被配置为扫描场景并且以规定的波长范围获得光谱图像数据。 首先在硅片的平面成像表面上制造至少一个伴随传感器。 至少当硅晶片的区域然后被背薄化到适合于衍射狭缝的衍射厚度。 然后在减薄区域中形成衍射狭缝，使得衍射狭缝穿透薄化区域中的硅模头，并且衍射狭缝与硅模具的成像表面共面。

    Method for fabricating infrared sensors
    266.
    发明授权
    Method for fabricating infrared sensors 有权
    制造红外传感器的方法

    公开(公告)号：US08822256B1

    公开(公告)日：2014-09-02

    申请号：US13856784

    申请日：2013-04-04

    Applicant: Bae Systems Information and Electronic Systems Integration Inc.

    Inventor： Chi-Hua Yang ,  David Sargent

    IPC: H01L21/00 ,  C23C4/12

    CPC classification number: C23C14/0623 ,  C23C14/5826 ,  C23C14/5833 ,  C23C14/584 ,  C23C14/5873

    Abstract: A method for fabricating infrared sensors is disclosed. a chalcogenide layer is initially deposited on a substrate. A group of vias is then formed within the chalcogenide layer. After the vias have been converted to a group of studs, a vanadium oxide layer is deposited on the chalcogenide layer covering the studs. Next, the vanadium oxide layer is separated into multiple vanadium oxide membranes. After the chalcogenide layer has been removed, each of the vanadium oxide membranes is allowed to be freestanding while only supported by a corresponding one of the studs. The vanadium oxide membranes will be used as infrared sensors.

    Abstract translation: 公开了一种用于制造红外传感器的方法。 硫属化物层最初沉积在基底上。 然后在硫族化物层内形成一组通孔。 在通孔转换成一组螺柱之后，在覆盖螺柱的硫族化物层上沉积氧化钒层。 接下来，将氧化钒层分离成多个氧化钒膜。 在去除硫族化物层之后，允许每个氧化钒膜是独立的，而仅由对应的一个螺柱支撑。 氧化钒膜将用作红外传感器。

    FRONT-END SIGNAL GENERATOR FOR HARDWARE IN-THE-LOOP SIMULATION
    267.
    发明申请
    FRONT-END SIGNAL GENERATOR FOR HARDWARE IN-THE-LOOP SIMULATION 审中-公开
    用于硬件在环模拟的前端信号发生器

    公开(公告)号：US20140222397A1

    公开(公告)日：2014-08-07

    申请号：US13961919

    申请日：2013-08-08

    Applicant: BAE Systems Information and Electronic Systems Integration Inc.

    Inventor： Jeffrey L JEW ,  Dennis R. CLARK ,  Nathan D. SMITH ,  Forrest C. VATTER ,  Anthony MAHAR

    IPC: G06F17/50

    CPC classification number: G06F17/5036 ,  G06F2217/86

    Abstract: A front-end signal generator for hardware-in-the-loop simulators of a simulated missile is disclosed. The front-end signal generator is driven by the Digital Scene And Reticle Simulation-Hardware In The Loop (DSARS-HITL) simulator. The simulator utilizes a computer to calculate irradiance on an Electro-Optical/Infrared (EO/IR) detector. The generator converts irradiance values into voltages that are injected into the missile's electronics during simulation. The conversion is done with low latency and a high dynamic range sufficient for hardware-in-the-loop simulation. The generator is capable of emulating laser pulse inputs that would be present during laser-based jammer countermeasures. Computer control of the generator occurs via front-panel-data-port (FPDP).

    Abstract translation: 公开了一种用于模拟导弹的硬件在环仿真器的前端信号发生器。 前端信号发生器由数字场景和光栅模拟 - 硬件循环（DSARS-HITL）模拟器驱动。 模拟器利用电脑计算电光/红外（EO / IR）检测器的辐照度。 发电机将辐照值转换成在模拟期间注入到导弹的电子装置中的电压。 该转换以低延迟和高动态范围完成，足以进行硬件在环仿真。 该发生器能够模拟在基于激光的干扰对策中将存在的激光脉冲输入。 发生器的计算机控制通过前面板数据端口（FPDP）进行。

    Nanostructure having metal nanoparticles and method of assembly thereof
    269.
    发明申请
    Nanostructure having metal nanoparticles and method of assembly thereof 有权
    具有金属纳米粒子的纳米结构及其组装方法

    公开(公告)号：US20140135516A1

    公开(公告)日：2014-05-15

    申请号：US13986178

    申请日：2013-04-08

    Applicant: BAE Systems Information and Electronic Systems Integration Inc.

    Inventor： Idan Mandelbaum ,  Tadd C. Kippeny

    IPC: C07F19/00

    CPC classification number: C07F19/00 ,  B82Y20/00

    Abstract: A nanostructure and method for assembly thereof are disclosed. An exemplary nanostructure includes a photocatalytic nanoparticle; a first tier of metal nanoparticles, each metal nanoparticle of the first tier being linked about the photocatalytic nanoparticle; and a second tier of metal nanoparticles, each metal nanoparticle of the second tier being linked to one of the metal nanoparticles of the first tier and located a distance from the photocatalytic nanoparticle greater than a distance between a metal nanoparticle of the first tier and the photocatalytic nanoparticle.

    Abstract translation: 公开了纳米结构及其组装方法。 示例性纳米结构包括光催化纳米颗粒; 第一层金属纳米颗粒，第一层的每个金属纳米颗粒围绕光催化纳米颗粒连接; 和第二层金属纳米颗粒，第二层的每个金属纳米颗粒连接到第一层的金属纳米颗粒之一，并且距离光催化纳米颗粒一定距离大于第一层金属纳米颗粒与光催化剂之间的距离 纳米颗粒。

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