公开(公告)号：US20080127455A1

公开(公告)日：2008-06-05

申请号：US11813989

申请日：2005-10-24

Applicant: Sang Ho Lee

Inventor： Sang Ho Lee

IPC: E05D11/06 ,  H04B1/38 ,  E05D11/02 ,  E05D7/00

CPC classification number: H04M1/0237 ,  H04B1/38 ,  Y10T16/525 ,  Y10T16/544

Abstract: A slide hinge device installed between two terminal bodies opening and closing by sliding is provided. The slide hinge unit includes: a rail hinge unit including an upper supporter, a lower supporter separated from the upper supporter by a pre-determined distance, and at least one guide bar bound with the upper supporter and the lower supporter; and a slide hinge unit, in which a penetration hole corresponding to the guide bar is formed, including a slide guide for sliding along the guide bar and a guide frame bound with the slide guide as one body.

Abstract translation: 提供了一种安装在通过滑动打开和关闭的两个终端体之间的滑动铰链装置。 滑动铰链单元包括：轨道铰链单元，包括上支撑件，与上支撑件分离预定距离的下支撑件，以及与上支撑件和下支撑件结合的至少一个导杆; 以及滑动铰链单元，其中形成有与引导杆相对应的贯通孔，其包括沿着引导杆滑动的滑动引导件和与滑动引导件一体地限定的引导框架。

公开(公告)号：US20080121083A1

公开(公告)日：2008-05-29

申请号：US11693947

申请日：2007-03-30

Applicant: Ok-Hwan Kim ,  Sang-Ho Lee

Inventor： Ok-Hwan Kim ,  Sang-Ho Lee

IPC: B26D7/00

CPC classification number: B26F1/36 ,  B26D3/10 ,  B26D7/015 ,  B26D2007/0087 ,  B26F1/40 ,  B26F2001/407 ,  Y10T83/8878

Abstract: A punching apparatus is disclosed. The apparatus includes an upper plate including a punching member having punching blade and guide blade with specific patterns, and upper jig to elastically support the punching member and having guide hole with the same pattern as the blade pattern; a lower plate including lower jig formed with punching hole having the same pattern as the blade pattern, and a guide protrusion to punch by variously changing positions of an object to be punched; and magnets independently provided at corresponding positions of the upper and lower plates, independent from each other, to face each other and to align the upper plate with the lower plate at a predetermined position. The punching can be freely performed at a desired position regardless of the position of the object to be punched and the object can have a continuous punched pattern.

Abstract translation: 公开了冲孔装置。 该装置包括上板，该上板包括具有冲切刀片和具有特定图案的引导刀片的冲压件，以及上部夹具，用于弹性地支撑冲压件并具有与刀片图案相同图案的导向孔; 下板，包括形成有与刀片图案相同图案的冲孔的下夹具，以及通过不同地改变待冲压物体的位置来冲压的引导突起; 独立地设置在彼此独立的上板和下板的相应位置处的磁体彼此面对并且将上板与下板对准在预定位置。 可以在期望的位置自由地执行冲孔，而不管待冲压的物体的位置如何，并且物体可以具有连续的冲压图案。

公开(公告)号：US20080101516A1

公开(公告)日：2008-05-01

申请号：US11925121

申请日：2007-10-26

Applicant: Koon Shik Cho ,  Seung Han Ko ,  Jae Hyung Lee ,  Kwang Mook Lee ,  Sang Hyun Min ,  Sang Ho Lee ,  U Sang Lee

Inventor： Koon Shik Cho ,  Seung Han Ko ,  Jae Hyung Lee ,  Kwang Mook Lee ,  Sang Hyun Min ,  Sang Ho Lee ,  U Sang Lee

IPC: H04L7/02

CPC classification number: H04L7/08

Abstract: Provided is a synchronization device for wireless communication packets, the synchronization device including an A/D (analog/digital) converter that converts an analog input signal applied from outside into a digital signal; a correlation calculating section that is connected to the A/D converter and correlates the converted input signal with a preset reference code so as to calculate a correlation value; a threshold setting section that is connected to the correlation calculating section and sets a threshold value of the correlation value; a maximum correlation detecting section that is connected to the correlation calculating section and the threshold setting section, compares the correlation value with the threshold value, detects the position of the maximum correlation value within each symbol of the input signal when the correlation value is larger than the threshold value, and judges whether a difference in position between the maximum correlation values of consecutive symbols is equal to the period of one symbol or not; a preamble detecting section that is connected to the correlation calculating section and the maximum correlation detecting section and outputs a preamble detection signal when the difference is equal to the period of one symbol; and a data detecting section that receives data of the input signal when the preamble detection signal is applied.

Abstract translation: 提供了一种用于无线通信分组的同步装置，该同步装置包括将从外部施加的模拟输入信号转换为数字信号的A / D（模拟/数字）转换器; 相关计算部分，连接到A / D转换器，并将转换的输入信号与预置的参考码相关联，以便计算相关值; 阈值设定部，与相关计算部连接并设定相关值的阈值; 连接到相关计算部分和阈值设定部分的最大相关检测部分将相关值与阈值进行比较，当相关值大于该值时，检测输入信号的每个符号内的最大相关值的位置 阈值，并且判断连续符号的最大相关值之间的位置差是否等于一个符号的周期; 前同步码检测部，其连接到所述相关计算部和所述最大相关检测部，并且当所述差等于一个符号的周期时，输出前同步码检测信号; 以及数据检测部分，当应用前导码检测信号时，接收输入信号的数据。

公开(公告)号：US20080079225A1

公开(公告)日：2008-04-03

申请号：US11648438

申请日：2006-12-29

Applicant: Hae Ryong Choi ,  Un Koo Lee ,  Sang Ho Lee ,  Hyun Sung ,  Jung Won Kim ,  Sung Jun Kim ,  Young Kwang Kim ,  In Ho Lee

Inventor： Hae Ryong Choi ,  Un Koo Lee ,  Sang Ho Lee ,  Hyun Sung ,  Jung Won Kim ,  Sung Jun Kim ,  Young Kwang Kim ,  In Ho Lee

IPC: B60G7/00

CPC classification number: B60G17/0155 ,  B60G7/006 ,  B60G2200/44 ,  B60G2202/422 ,  Y10T74/1868

Abstract: The present invention provides an actuator for AGCS of a vehicle having a piston reciprocating rectilinearly, a screw bar engaged with the rear portion of the piston and rotating in place, and a drive motor rotating the screw bar in place, the actuator comprising an impact buffering means for buffering a load in the axial direction and an impact absorbing means for absorbing a load in the vertical direction to the axis, the impact buffering means and impact absorbing means being provided on the boundary portion between the screw bar and the motor.

Abstract translation: 本发明提供了一种具有活塞往复直线运动的车辆的AGCS致动器，与活塞的后部接合并旋转就位的螺杆以及将螺杆转动就位的驱动马达，该致动器包括冲击缓冲 用于沿轴向缓冲负载的装置和用于吸收沿着垂直于轴线的负载的冲击吸收装置，冲击缓冲装置和冲击吸收装置设置在螺杆与电动机之间的边界部分上。

公开(公告)号：USRE40112E1

公开(公告)日：2008-02-26

申请号：US10825670

申请日：2004-04-14

Applicant: Won Sun Shin ,  Do Sung Chun ,  Sang Ho Lee ,  Seon Goo Lee ,  Vincent DiCaprio

Inventor： Won Sun Shin ,  Do Sung Chun ,  Sang Ho Lee ,  Seon Goo Lee ,  Vincent DiCaprio

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1094 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input/output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with he ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input/output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.

Abstract translation: 公开了具有能够容易地从包括在其中的半导体芯片放出热的薄结构的半导体封装以及制造这种半导体封装的方法。 半导体封装的实施例包括具有第一主表面和第二主表面的半导体芯片，所述半导体芯片在第二主表面处设置有多个输入/输出焊盘; 包括具有第一主表面和第二主表面的树脂基板的电路板，形成在第一主表面处并设置有多个球接头的第一电路图案，形成在第二主表面处并且设置有第二主表面的第二电路图案 通过导电通孔与树皮基板连接的多个粘结指状物，分别涂覆第一和第二电路图案的盖涂层，同时允许粘合指状物和球状区域暴露于其中;以及中心通孔，其适于 在其中接收半导体芯片; 电导体，其将半导体芯片的输入/输出焊盘电连接到电路板的键合指; 覆盖半导体芯片，电导体和电路板的至少一部分的树脂封装; 以及多个导电球分别熔合在电路板的球面上。

公开(公告)号：US20080042245A1

公开(公告)日：2008-02-21

申请号：US11465706

申请日：2006-08-18

Applicant: Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

Inventor： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC: H01L23/12

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit packaging system is provided including forming a first device wafer having a first backside and a first active side; forming a waferscale spacer wafer having a waferscale spacer and a first opening; mounting the waferscale spacer wafer on the first backside; and singulating an first integrated circuit die having the waferscale spacer from the first device wafer having the first backside with the waferscale spacer wafer thereon.

Abstract translation: 提供一种集成电路封装系统，包括形成具有第一背面和第一有源侧的第一器件晶片; 形成具有晶片间隔件和第一开口的晶片间隔晶片; 将所述晶片间隔晶片安装在所述第一背面上; 以及从具有第一背面的第一器件晶片和其上具有晶片间隔晶片的单片化第一集成电路晶片，其具有晶片尺寸间隔物。

公开(公告)号：US20070012931A1

公开(公告)日：2007-01-18

申请号：US10554469

申请日：2004-04-23

Applicant: Dong-Yeoul Lee ,  Yong-Tae Kim ,  Sang-Ho Lee ,  Jin-Hwan Kim ,  Min-Sang Lee

Inventor： Dong-Yeoul Lee ,  Yong-Tae Kim ,  Sang-Ho Lee ,  Jin-Hwan Kim ,  Min-Sang Lee

IPC: H01L33/00

CPC classification number: H01L33/504 ,  C09K11/7706 ,  C09K11/886 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A white light semiconductor light emitting device includes a semiconductor LED and first and second phosphors provided on a light emitting region of the LED to emit light within a first wavelength range, which is different from that of light emitted from the LED, by absorbing a portion of the light emitted from the LED. The first and second phosphors are respectively a barium-silicate-base green phosphor and a zinc-selenium-base red phosphor.

Abstract translation: 白光半导体发光器件包括半导体LED以及设置在LED的发光区域上的第一和第二荧光体，以通过吸收一部分来发射与LED发射的光不同的第一波长范围内的光 从LED发出的光。 第一和第二荧光体分别是硅酸钡基绿色磷光体和锌 - 硒 - 基红色荧光体。

公开(公告)号：USD527005S1

公开(公告)日：2006-08-22

申请号：US29232537

申请日：2005-06-21

Applicant: Paul Navarrez ,  Scott Vance ,  Sungwook Jung ,  Sang Ho Lee ,  Giovanni Pagnotta

Designer： Paul Navarrez ,  Scott Vance ,  Sungwook Jung ,  Sang Ho Lee ,  Giovanni Pagnotta

公开(公告)号：US20060151866A1

公开(公告)日：2006-07-13

申请号：US11326925

申请日：2006-01-06

Applicant: Sang-Ho Lee

Inventor： Sang-Ho Lee

IPC: H01L23/02

CPC classification number: G01R31/2884 ,  G01R31/3172 ,  G01R31/318513 ,  H01L2225/06596

Abstract: A multi-chip package is provided. The multi-chip package includes semiconductor chips. The multi-chip package receives selection signals for selecting two or more chips in response to the selection signals. Any number of chips may be simultaneously selected for a test and the test time can be reduced.

公开(公告)号：USD523837S1

公开(公告)日：2006-06-27

申请号：US29228643

申请日：2005-04-27

Applicant: Sang Ho Lee

Designer： Sang Ho Lee