Apparatus for detecting liquid discharge characteristics and apparatus for discharging liquid

    公开(公告)号:US10751990B2

    公开(公告)日:2020-08-25

    申请号:US16503427

    申请日:2019-07-03

    Abstract: Disclosed is an apparatus for detecting liquid discharge characteristics according to an embodiment of the present invention, the apparatus including: a liquid supply unit supplying a liquid; a liquid guide unit including a flow path through which the liquid supplied from the liquid supply unit passes and a nozzle mounting portion communicating with the flow path and on which the nozzle is mounted and guiding the liquid supplied from the liquid supply unit to the nozzle mounted on the nozzle mounting portion; a lighting unit projecting light onto the liquid passing through the flow path inside the liquid guide unit; and a camera obtaining an image of the liquid discharged from the nozzle by being arranged toward the nozzle.

    Method of testing semiconductor packages

    公开(公告)号:US10705137B2

    公开(公告)日:2020-07-07

    申请号:US15896399

    申请日:2018-02-14

    Abstract: A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each including a heater, includes receiving temperature information of the semiconductor packages from the tester while testing the semiconductor packages, calculating an overall average temperature of the semiconductor packages from the received temperature information, and individually controlling operations of heaters of the pusher units based on difference values between the overall average temperature and individual temperatures of the semiconductor packages.

    Apparatus and method for treating substrate

    公开(公告)号:US10682674B2

    公开(公告)日:2020-06-16

    申请号:US15796415

    申请日:2017-10-27

    Abstract: Embodiments of the inventive concept relate to an apparatus and a method for removing a liquid residing on a substrate. The substrate treating apparatus includes a substrate support unit configured to support the substrate, a liquid supply unit configured to supply a liquid onto the substrate supported by the substrate support unit, and a heating unit configured to heat the substrate supported by the substrate support unit, wherein the substrate support unit includes a support plate having a seating surface, on which the substrate is seated, and having a suction hole on the seating surface, a rotary shaft configured to rotate the support plate, and a vacuum member configured to reduce a pressure of the suction hole such that the substrate seated on the seating surface is vacuum-suctioned on the support plate. Accordingly, the drying efficiency of the substrate may be increased.

    SUBSTRATE TREATMENT APPARATUS
    276.
    发明申请

    公开(公告)号:US20200168496A1

    公开(公告)日:2020-05-28

    申请号:US16682333

    申请日:2019-11-13

    Applicant: SEMES CO., LTD

    Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a control device to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The control device determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

    SUBSTRATE TREATING APPARATUS AND APPARATUS AND METHOD FOR ECCENTRICITY INSPECTION

    公开(公告)号:US20200167946A1

    公开(公告)日:2020-05-28

    申请号:US16685345

    申请日:2019-11-15

    Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.

    METHOD OF MONITORING MEMORY USAGE AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20200065008A1

    公开(公告)日:2020-02-27

    申请号:US16535125

    申请日:2019-08-08

    Applicant: SEMES Co. Ltd.

    Inventor: Sangman YIM

    Abstract: The present invention relates to a method of monitoring a memory usage and a substrate processing apparatus. The method of monitoring a memory usage of the present invention comprises: a memory usage collecting step of collecting a memory usage according to a predetermined collection period; a memory leak determining step of determining a memory leak based on the collected memory usage; and an alarm processing step of generating an equipment alarm based on the determining result of the memory leak, wherein the memory leak determining step includes a first memory leak determining step of determining the memory leak by comparing the memory usage with a predetermined threshold value and a second memory leak memory step of determining the memory leak based on a change trend of the memory usage when the memory usage does not exceed the predetermined threshold value.

    Method, system, and apparatus for controlling a temperature of a substrate in a plasma processing chamber

    公开(公告)号:US10563919B2

    公开(公告)日:2020-02-18

    申请号:US15463319

    申请日:2017-03-20

    Abstract: An embodiment includes an apparatus for controlling temperature of a substrate, an apparatus for treating a substrate comprising the same, and a method of controlling the same, which may control the temperature of the substrate by each area and not increasing the volume of the apparatus. The substrate temperature control apparatus comprises: a support plate for supporting a substrate; a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area; a power supply unit for providing a power to control the temperature of the substrate; a switch unit connected between the plurality of heating units and the power supply unit, and obtaining one or more of a transistor device; and a controller for controlling a power which is supplied to each heating units by controlling unit.

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