Abstract:
A processing device of an NFC device receives a request, initiated by a first application loaded in a memory of the NFC device, to modify one or more parameters of an NFC routing table of an NFC router of the NFC device. The NFC routing table has parameters indicating the devices to which NFC messages are to be routed. The processing device retrieves a first identifier associated with the application and transmits the first identifier to the NFC router. The NFC router, based on the first identifier, verifies whether or not the application is authorized to modify the routing table.
Abstract:
Disclosed herein is a device comprising a protection circuit configured to protect against a polarity reversal of the input DC power supply voltage, the protection circuit comprising an N-channel main transistor having a source coupled to an input terminal and having a drain coupled to an output terminal, a command circuit configured to render the main transistor blocked in the event of a polarity reversal and conducting otherwise, and a control circuit configured to dynamically adjust the bias of substrate regions of respective components connected to the main transistor by connecting the substrate regions either to the source or to the drain of the main transistor according to the value of the voltages present at the source and the drain of the main transistor and the type of conductivity of the substrate regions.
Abstract:
A device for detecting the thinning down of the substrate of an integrated circuit chip, including, in the active area of the substrate, bar-shaped diffused resistors connected as a Wheatstone bridge, wherein: first opposite resistors of the bridge are oriented along a first direction; the second opposite resistors of the bridge are oriented along a second direction; and the first and second directions are such that a thinning down of the substrate causes a variation of the imbalance value of the bridge.
Abstract:
A system for detecting a laser attack on an integrated circuit chip formed in a semiconductor substrate, including a detection device capable of detecting voltage variations of the substrate. The system includes P-type first wells and N-type second wells extending in a P-type upper portion of the substrate; an N-type buried layer extending under at least a portion of the first and second wells; biasing contacts for the second wells and the buried layer; ground contacts for the first wells; and substrate contacts for detecting a substrate voltage, the detection contacts surrounding the first and second wells. The detection device comprises a resistor having a first terminal connected to said ground contacts of the first wells and a second terminal connected to said substrate contacts; and a comparator connected in with the resistor configured to detect a potential difference across the resistor.
Abstract:
A method is used to control an electronic device that includes a switching unit having a main MOS transistor having a substrate, a first conducting electrode and a second conducting electrode coupled to an output terminal. The method includes controlling the main transistor in such a way as to put it into an on state or an off state such that, when the main transistor is in the on state, the substrate and the first conducting electrode of the main transistor are connected to an input terminal and, when the main transistor is in the off state, the first conducting electrode of the main transistor is isolated from the input terminal and a first bias voltage is applied to the first conducting electrode and a second bias voltage is applied to the substrate of the main transistor.
Abstract:
According to an embodiment, generating an adjustable bandgap reference voltage includes generating a current proportional to absolute temperature (PTAT). Generating the PTAT current includes equalizing voltages across the terminals of a core that is designed to be traversed by the PTAT current. Generating the adjustable bandgap reference also includes generating a current inversely proportional to absolute temperature (CTAT), summing the PTAT and the CTAT currents and generating the bandgap reference voltage based on the sum of the currents. Equalizing includes connecting-across the terminals of the core a first fed-back amplifier with at least one first stage arranged as a folded setup and including first PMOS transistors arranged according to a common-gate setup. Equalizing also includes biasing the first stage based on the CTAT current. The summation of the PTAT and CTAT currents is performed in the feedback stage of the first amplifier.
Abstract:
A method for managing a non-volatile memory may include a first phase of writing data to a first bank of a memory plane of the non-volatile memory, and then a second phase of writing the same data to a second bank of the same memory plane of the non-volatile memory in the case of success of the first writing phase.
Abstract:
An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.
Abstract:
A method for detecting a fault injection in a random number generation circuit, wherein a bit pattern is mixed to a bit stream originating from a noise source and the presence of this pattern is detected in a signal sampled downstream of the mix.
Abstract:
The disclosure relates to an integrated circuit comprising at least two memory cells formed in a semiconductor substrate, and a buried gate common to the selection transistors of the memory cells. The buried gate has a first section of a first depth extending in front of vertical channel regions of the selection transistors, and at least a second section of a second depth greater than the first depth penetrating into a buried source line. The lower side of the buried gate is bordered by a doped region forming a source region of the selection transistors and reaching the buried source line at the level where the second section of the buried gate penetrates into the buried source line, whereby the source region is coupled to the buried source line.