Abstract:
An exemplary visual inspection apparatus for a flexible printed circuit board includes a frame, an inspection station, a control system, a roller system and a power system. The inspection station is disposed on the frame. The inspection station has an inspection surface for placing the flexible printed circuit board thereon for visual inspection. The roller system includes a first roller for unwinding a flexible printed circuit board therefrom and a second roller for winding up the flexible printed circuit board therearound. The power system includes a driving device and a braking device. The driving device includes a torque motor engaging with the second roller to drive the second roller to roll. The braking device includes a detent engaging with the first roller to stop rolling of the first roller. The control system electrically connects to the power system for controlling the power system.
Abstract:
The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.
Abstract:
An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.
Abstract:
A coverlay processing system includes a processing device and a conveyance device. The conveyance device is configured for moving the coverlay to the process device. The conveyance device includes a pulling member, a first securing member, a detector and a controller. The pulling member is configured for driving the coverlay. The first securing member is configured for stopping moving the coverlay. The detector is configured for detecting a moving state of the coverlay and is connected to the controller. The controller is connected to the processing device for managing the operation of the processing device.
Abstract:
An exemplary screen printing stencil includes a frame, a screen mesh and a metal foil. The screen mesh is stretched tightly in the frame. The metal foil is attached on a surface of the screen mesh. A screen printing pattern is defined on the metal foil by a laser machining process. A machining tolerance of the screen printing pattern is either in a range from 0.005 to 0.02 millimeters or in a range from −0.02 to −0.005 millimeters. The screen printing stencil can be used in a screen printing process of manufacturing a printed circuit board, thereby improving quality of the printed circuit board.
Abstract:
A gas-driven liquid pump includes a gas source, a tank, a pumping pipe, at least one gas conveying pipe, and at least one liquid conveying pipe. The pumping pipe includes a gas input end, a liquid output end and a suction portion located between the gas input end and the liquid output end. An inner diameter of the pumping pipe gradually decreases from the gas input end to the suction portion, and the inner diameter of the pumping pipe gradually increases from the suction portion to the liquid output end. At least one gas conveying pipe is configured for connecting the gas source and the gas input end of the pumping pipe. One end of the liquid conveying pipe is connected to the tank, and another end is engaged with the suction portion of the pumping pipe.
Abstract:
A laminator is configured for laminating a film sheet on a respective surface of a plurality of substrates. The laminator includes a pressure roller, a first conveyance device, a second conveyance device, and a distance measuring system. The first conveyance device is provided for controllably conveying substrates to the pressure roller. The second conveyance device is provided for controllably conveying substrates to the first conveyance device. The distance measuring system is provided for measuring a space between the substrate on the first conveyance device and the sequential substrate on the second conveyance device, adjacent to the first substrate.
Abstract:
The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.
Abstract:
An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion.
Abstract:
In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed.