VAPOR PHASE DEPOSITION PROCESSES FOR DOPING SILICON
    23.
    发明申请
    VAPOR PHASE DEPOSITION PROCESSES FOR DOPING SILICON 失效
    用于掺硅的蒸气相沉积工艺

    公开(公告)号:US20110124187A1

    公开(公告)日:2011-05-26

    申请号:US12625835

    申请日:2009-11-25

    CPC classification number: H01L21/2254

    Abstract: A process of doping a silicon layer with dopant atoms generally includes reacting a vapor of a dopant precursor with oxide and/or hydroxide reactive sites present on the silicon layer to form a self assembled monolayer of dopant precursor; hydrolyzing the self assembled monolayer of the dopant precursor with water vapor to form pendant hydroxyl groups on the dopant precursor; capping the self assembled monolayer with an oxide layer; and annealing the silicon layer at a temperature effective to diffuse dopant atoms from the dopant precursor into the silicon layer. Additional monolayers can be formed in a similar manner, thereby providing controlled layer-by-layer vapor phase deposition of the dopant precursor compounds for controlled doping of silicon.

    Abstract translation: 用掺杂剂原子掺杂硅层的方法通常包括使掺杂剂前体的蒸气与存在于硅层上的氧化物和/或氢氧化物反应性位点反应以形成掺杂剂前体的自组装单层; 用水蒸汽水解掺杂剂前体的自组装单层以在掺杂剂前体上形成侧基羟基; 用氧化物层封闭自组装单层; 以及在有效地将掺杂剂原子从掺杂剂前体扩散到硅层中的温度下退火硅层。 可以以类似的方式形成另外的单层,由此提供受控的掺杂剂前体化合物的逐层气相沉积用于硅的受控掺杂。

    RADIATION SENSITIVE SELF-ASSEMBLED MONOLAYERS AND USES THEREOF
    29.
    发明申请
    RADIATION SENSITIVE SELF-ASSEMBLED MONOLAYERS AND USES THEREOF 有权
    辐射敏感自组装单体及其用途

    公开(公告)号:US20080318157A1

    公开(公告)日:2008-12-25

    申请号:US12199607

    申请日:2008-08-27

    CPC classification number: C23C22/02 B82Y10/00 G03F7/165 G03F7/405

    Abstract: The invention is directed to a radiation sensitive compound comprising a surface binding group proximate to one end of the compound for attachment to a substrate, and a metal binding group proximate to an opposite end of the compound. The metal binding group is not radiation sensitive. The radiation sensitive compound also includes a body portion disposed between the surface binding group and the metal binding group, and a radiation sensitive group positioned in the body portion or adjacent to the metal binding group. The surface binding group is capable of attaching to a substrate selected from a metal, a metal oxide, or a semiconductor material.

    Abstract translation: 本发明涉及一种辐射敏感化合物,其包含接近化合物一端的表面结合基团,用于连接至底物,以及靠近化合物相对端的金属结合基团。 金属结合组不辐射敏感。 辐射敏感化合物还包括设置在表面结合基团和金属结合基团之间的主体部分和位于主体部分中或与金属结合基团相邻的辐射敏感组。 表面结合基团能够附着于选自金属,金属氧化物或半导体材料的基板。

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