公开(公告)号：US20050062301A1

公开(公告)日：2005-03-24

申请号：US10981443

申请日：2004-11-05

Applicant: Cheol-Joon Yoo

Inventor： Cheol-Joon Yoo

IPC: H01L21/50 ,  H01L21/00 ,  H01L21/68 ,  A47J45/00

CPC classification number: H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

公开(公告)号：US20060157848A1

公开(公告)日：2006-07-20

申请号：US11330773

申请日：2006-01-11

Applicant: Cheol-Joon Yoo ,  Jin-Ho Kim ,  Hee-Jin Park ,  Tae-Sung Yoon ,  Chan-Suk Lee

Inventor： Cheol-Joon Yoo ,  Jin-Ho Kim ,  Hee-Jin Park ,  Tae-Sung Yoon ,  Chan-Suk Lee

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0568 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a semiconductor package and a package mounting substrate are joined using a conductive material column such as a solder column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. By forming the insulating protective openings with sufficient depth, each protects the solder column against stress faults and thereby forms more reliable electrical connections and supports high-density electrical connections between the semiconductor package and the package mounting substrate.

Abstract translation: 在一个实施例中，使用诸如焊料柱的导电材料柱将半导体封装和封装安装基板接合。 半导体封装和封装安装衬底中的每一个包括暴露其中的布线层的绝缘保护开口。 焊料柱位于绝缘保护开口内，以电连接布线层。 通过形成具有足够深度的绝缘保护开口，每个保护焊料柱免受应力故障，从而形成更可靠的电连接并且支持半导体封装和封装安装基板之间的高密度电连接。

公开(公告)号：US20050269715A1

公开(公告)日：2005-12-08

申请号：US11029566

申请日：2005-01-06

Applicant: Cheol-Joon Yoo

Inventor： Cheol-Joon Yoo

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/04 ,  H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An apparatus, method and mold for manufacturing a semiconductor package are provided. The semiconductor package may include at least a semiconductor chip positioned on a substrate, a bonding wire for electrically connecting the semiconductor chip to the substrate, an encapsulant for enclosing the semiconductor chip and sides of the substrate, and a conductor connector attached to a lower surface of the substrate.

Abstract translation: 提供一种用于制造半导体封装的设备，方法和模具。 半导体封装可以包括位于基板上的至少一个半导体芯片，用于将半导体芯片电连接到基板的接合线，用于封装半导体芯片的密封剂和衬底的侧面，以及连接到下表面的导体连接器 的基底。

公开(公告)号：US06808379B2

公开(公告)日：2004-10-26

申请号：US10029165

申请日：2001-12-20

Applicant: Cheol Joon Yoo

Inventor： Cheol Joon Yoo

IPC: B29C3358

CPC classification number: H01L21/67051 ,  B08B1/00 ,  B29C45/14655 ,  B29C45/1753 ,  H01L21/67046

Abstract: An apparatus for cleaning a mold die set includes a pair of brushes, a pair of vacuum holes, and multiple nozzles. One of the brushes is positioned to scrub a first surface of the mold die set, and the other of the brushes is positioned to scrub a second surface of the mold die set to separate a residue from the first and second surfaces of the mold die set. The vacuum holes receives the separated residue from the first and second surfaces of the mold die set, and through the nozzles, a parting compound is provided to coat the first and second surfaces of the mold die set. The apparatus further includes multiple air holes through which air is blown to the first and second surfaces of the mold die set. An apparatus for semiconductor manufacturing includes a mold die set having a first surface and a second surface and a mold die set cleaner that can remove a residue from the first and second surfaces of the mold die set and coat a parting compound on the first and second surfaces.

Abstract translation: 用于清洁模具模具的装置包括一对刷子，一对真空孔和多个喷嘴。 刷子中的一个定位成擦拭模具模具的第一表面，并且另一个刷子被定位成擦拭模具模具的第二表面以将残留物与模具模具的第一和第二表面分离 。 真空孔从模具模具的第一和第二表面接收分离的残留物，并且通过喷嘴，提供分开化合物以涂覆模具模具的第一和第二表面。 该装置还包括多个气孔，空气通过该空气吹送到模具模具的第一和第二表面。 一种用于半导体制造的设备包括具有第一表面和第二表面的模具模具和模具模具清洁器，其可以从模具模具的第一和第二表面去除残留物并在第一和第二表面上涂覆分离化合物 表面。