公开(公告)号：US20100291781A1

公开(公告)日：2010-11-18

申请号：US12604914

申请日：2009-10-23

Applicant: CHIA-EN LEE

Inventor： CHIA-EN LEE

IPC: H01R13/62

CPC classification number: G06F1/1632 ,  H04M1/24

Abstract: A fixture includes a base seat, a resist mechanism, a drive mechanism and an adjust mechanism. The resist mechanism is fixed to the base seat and includes a connector. The drive mechanism is fixed to the base seat. The adjust mechanism is fixed to the base seat and includes a connecting board. The connecting board has a power module attached thereto. The adjust mechanism can adjust the power module relative to the connector. The drive mechanism can drive the connector to move towards the power module.

Abstract translation: 固定装置包括基座，抵抗机构，驱动机构和调节机构。 抗蚀剂机构固定在基座上并包括连接器。 驱动机构固定在基座上。 调节机构固定在基座上并具有连接板。 连接板具有附接到其上的功率模块。 调节机构可以相对于连接器调整功率模块。 驱动机构可以驱动连接器朝向电源模块移动。

公开(公告)号：US20100258818A1

公开(公告)日：2010-10-14

申请号：US12464859

申请日：2009-05-12

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/00 ,  H01L21/78

CPC classification number: H01L33/0095 ,  H01L21/78 ,  H01L33/20 ,  H01L33/44

Abstract: The present invention provides a manufacturing method of an LED chip. First, a device layer is formed on a growth substrate, wherein the device layer has a first surface connected to the growth substrate and a second surface. Next, a plurality of first trenches are formed on the second surface of the device layer. Then, a protection layer is formed on the side walls of the first trenches. After that, the second surface is bonded with a supporting substrate and the device layer is then separated from the growth substrate. Further, a plurality of second trenches corresponding to the first trenches are formed in the device layer to form a plurality of LEDs, wherein the second trenches extend from the first surface to the bottom portions of the first trenches. Furthermore, a plurality of electrodes are formed on the first surface of the device layer.

Abstract translation: 本发明提供一种LED芯片的制造方法。 首先，在生长衬底上形成器件层，其中器件层具有连接到生长衬底的第一表面和第二表面。 接下来，在器件层的第二表面上形成多个第一沟槽。 然后，在第一沟槽的侧壁上形成保护层。 之后，将第二表面与支撑基板接合，然后将器件层与生长衬底分离。 此外，在器件层中形成对应于第一沟槽的多个第二沟槽以形成多个LED，其中第二沟槽从第一沟槽的第一表面延伸到底部。 此外，在器件层的第一表面上形成多个电极。

公开(公告)号：US20100162559A1

公开(公告)日：2010-07-01

申请号：US12512376

申请日：2009-07-30

Applicant: CHIA-EN LEE

Inventor： CHIA-EN LEE

IPC: G01M19/00 ,  B23P19/00

CPC classification number: H04M1/24 ,  G01R31/01 ,  Y10T29/5191 ,  Y10T29/5313 ,  Y10T29/53365 ,  Y10T29/53374 ,  Y10T29/53404

Abstract: A production line used to assemble and test some electronic elements includes a first assembly line used to assemble some electronic elements requiring a relatively high requirements of cleanliness factor, a second assembly line used to assemble some electronic elements requiring a relatively low requirements of cleanliness factor, a first testing line used to do some testing items with a relatively high requirements of lightness, a second testing line used to do some testing items with a relatively low requirements of lightness, and a third testing line do some testing items requiring a relatively high requirements of cleanliness factor, the first assembly line, the second assembly line, the first testing line, the second testing line, and the third testing line are located adjacent to each other and connected together in series.

Abstract translation: 用于组装和测试一些电子元件的生产线包括用于组装需要相对较高清洁度要求的一些电子元件的第一组装线，用于组装需要相对较低清洁度要求的一些电子元件的第二组装线， 第一条测试线用于做一些相对较高亮度要求的测试项目，第二条测试线用于做一些相对较低亮度要求的测试项目，第三条测试线做一些需要较高要求的测试项目 的清洁因子，第一组装线，第二组装线，第一测试线，第二测试线和第三测试线彼此相邻并串联连接。

公开(公告)号：US20100044538A1

公开(公告)日：2010-02-25

申请号：US12495869

申请日：2009-07-01

Applicant: CHIA-EN LEE

Inventor： CHIA-EN LEE

IPC: F16B47/00

CPC classification number: B25B11/007 ,  G02B7/02

Abstract: An assembly device for display screen includes a vacuum source generating vacuum, a connecting tube connecting with the vacuum source, a holding body connecting with the connecting, and a suction member connecting the holding body. The holding body includes a main portion and a connecting portion laterally extending form the main portion, the vacuum source, the connecting tube, the holding body, and the suction member communicates with each other in order and forms a passage for gas, the display screen can be gripped by the suction cover by action of the vacuum source.

Abstract translation: 用于显示屏的组装装置包括真空源产生真空，与真空源连接的连接管，与连接件连接的保持体以及连接保持体的抽吸构件。 保持体包括主要部分和从主要部分横向延伸的连接部分，真空源，连接管，保持本体和抽吸部件依次连通并形成气体通道，显示屏 可以通过真空源的作用被吸盘夹持。

公开(公告)号：US20100032915A1

公开(公告)日：2010-02-11

申请号：US12534769

申请日：2009-08-03

Applicant: Mau-Pin Hsu ,  Chia-Ming Wu ,  Chia-En Lee ,  Ta-Chan Peng

Inventor： Mau-Pin Hsu ,  Chia-Ming Wu ,  Chia-En Lee ,  Ta-Chan Peng

IPC: B60G17/00

CPC classification number: B60G21/073 ,  B60G2200/132 ,  B60G2200/42 ,  B60G2200/446 ,  B60G2204/143 ,  B60G2204/148 ,  B60G2204/4222 ,  B60G2204/4605 ,  B60G2204/82 ,  B60G2204/8304 ,  B60G2206/60 ,  B60G2300/122 ,  B62H1/12 ,  B62K5/01 ,  B62K5/10 ,  B62K13/04 ,  B62K2202/00

Abstract: A motor vehicle is provided. The motor vehicle comprises a vehicle body, a front wheel, a rear wheel and a tilting mechanism. The front wheel, the rear wheel and the tilting mechanism are disposed on the vehicle body. The tilting mechanism comprises a first compensation unit, a first arm, a first wheel, a second compensation unit, a second arm, a second wheel, at least one pipe and a fluid. The first arm is connected to the first compensation unit, and the first wheel. The second arm is connected to the second compensation unit, and the second wheel. The pipe connects the first compensation unit to the second compensation unit. The fluid flows in the first compensation unit, the second compensation unit and the pipe, wherein when the motor vehicle tilts, an extension length of the first compensation unit equals to a compression length of the second compensation unit.

Abstract translation: 提供汽车。 机动车辆包括车身，前轮，后轮和倾斜机构。 前轮，后轮和倾斜机构设置在车体上。 倾斜机构包括第一补偿单元，第一臂，第一轮，第二补偿单元，第二臂，第二轮，至少一个管和流体。 第一臂连接到第一补偿单元和第一轮。 第二臂连接到第二补偿单元和第二轮。 管道将第一补偿单元连接到第二补偿单元。 流体在第一补偿单元，第二补偿单元和管道中流动，其中当机动车辆倾斜时，第一补偿单元的延伸长度等于第二补偿单元的压缩长度。

公开(公告)号：US20090307919A1

公开(公告)日：2009-12-17

申请号：US12327495

申请日：2008-12-03

Applicant: CHIA-EN LEE

Inventor： CHIA-EN LEE

IPC: G01B5/02

CPC classification number: G01B3/42 ,  G01B5/06

Abstract: A thickness gauge (10) includes a main body (12), a plurality of measuring portions (14) defined along an edge of the main body (12), each measuring portion (14) having a different height, and a numerical pattern corresponding to the height of the measuring portion (14). The thickness gauge (10) only has one main body (12), so the material for making the measuring portions (14) can be reduced. Further more, the thickness gauge (10) is small, and easy to carry.

Abstract translation: 厚度计（10）包括主体（12），沿着主体（12）的边缘限定的多个测量部分（14），每个测量部分（14）具有不同的高度，并且数字图案对应于 到测量部分（14）的高度。 厚度计（10）仅具有一个主体（12），因此可以减少用于制造测量部分（14）的材料。 此外，厚度计（10）小，易于携带。

公开(公告)号：USD680976S1

公开(公告)日：2013-04-30

申请号：US29406576

申请日：2011-11-16

Applicant: Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

Designer： Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

公开(公告)号：US08278681B2

公开(公告)日：2012-10-02

申请号：US12469669

申请日：2009-05-20

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/00

CPC classification number: H01L33/0079 ,  H01L24/26 ,  H01L24/93 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.

Abstract translation: 提供了发光二极管的晶片级封装工艺。 首先，在生长基板上形成半导体堆叠层。 然后在半导体堆叠层上形成多个阻挡图案和多个反射层，其中每个反射层被一个屏障图案包围。 然后在半导体堆叠层上形成第一结合层以覆盖阻挡图案和反射层。 此后，设置具有多个第二接合层和彼此电绝缘的多个导电插塞的承载基板，并且第一接合层与第二接合层接合。 然后将半导体堆叠层与生长衬底分离。 接下来，对半导体堆叠层进行图案化以形成多个半导体堆叠图案。 接下来，每个半导体堆叠图案电连接到导电插头。

公开(公告)号：US20120164768A1

公开(公告)日：2012-06-28

申请号：US13403714

申请日：2012-02-23

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/60

CPC classification number: H01L33/0079 ,  H01L24/26 ,  H01L24/93 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.

Abstract translation: 提供了发光二极管的晶片级封装工艺。 首先，在生长基板上形成半导体堆叠层。 然后在半导体堆叠层上形成多个阻挡图案和多个反射层，其中每个反射层被一个屏障图案包围。 然后在半导体堆叠层上形成第一结合层以覆盖阻挡图案和反射层。 此后，设置具有多个第二接合层和彼此电绝缘的多个导电插塞的承载基板，并且第一接合层与第二接合层接合。 然后将半导体堆叠层与生长衬底分离。 接下来，对半导体堆叠层进行图案化以形成多个半导体堆叠图案。 接下来，每个半导体堆叠图案电连接到导电插头。

公开(公告)号：US08070320B2

公开(公告)日：2011-12-06

申请号：US12497747

申请日：2009-07-06

Applicant: Chia-En Lee

Inventor： Chia-En Lee

IPC: G02B27/20

CPC classification number: G01N21/8803 ,  G01N2201/0221 ,  G01N2201/06113

Abstract: A laser illumination device including a body, a head secured to the body, a laser generator accommodated in the head, and a rotatable output adjustment member having a graduated disk and an adjustment disk. The graduated disk defines a circle of graduated sections, at least one of which is exposed out of the head. The adjustment disk includes a plurality of through holes with different sizes, arranged in a circle. The measuring member coupled with the graduated disk rotates relative to the body to align each one of the through holes with the laser generator, to adjust the amount of laser light passing through the one of the through holes.

Abstract translation: 一种激光照明装置，包括主体，固定到主体的头部，容纳在头部中的激光发生器，以及具有刻度盘和调节盘的可旋转输出调节构件。 刻度盘定义了一圈刻度的部分，其中至少一个暴露在头部之外。 调整盘包括多个不同尺寸的通孔，排列成圆形。 与刻度盘耦合的测量构件相对于主体旋转，以使每个通孔与激光发生器对准，以调节通过一个通孔的激光量。