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公开(公告)号：US20110186873A1
公开(公告)日：2011-08-04
申请号：US13019812
申请日：2011-02-02
Applicant: David T. Emerson
Inventor： David T. Emerson
CPC classification number: H01L33/48 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12032 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: Packages, systems and methods for light emitting devices are disclosed. An LED package in one aspect can be of various sizes and configurations and can include one or more LEDs of a size smaller than those typically provided. The LED package or packages can for example be used for backlighting or other lighting fixtures. Optimized materials and techniques can be used for the LED packages to provide energy efficiency and long lifetime.
Abstract translation: 公开了用于发光器件的封装，系统和方法。 一个方面的LED封装可以具有各种尺寸和配置，并且可以包括尺寸小于通常提供的尺寸的一个或多个LED。 LED封装或封装可以例如用于背光或其他照明灯具。 优化的材料和技术可用于LED封装，以提供能源效率和长寿命。
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公开(公告)号：US20110164435A1
公开(公告)日：2011-07-07
申请号：US13046982
申请日：2011-03-14
Applicant: Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
Inventor： Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
CPC classification number: H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
Abstract translation: 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。
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公开(公告)号：US07968900B2
公开(公告)日：2011-06-28
申请号：US11624954
申请日：2007-01-19
Applicant: Christopher P. Hussell , David T. Emerson , Michael J. Bergmann
Inventor： Christopher P. Hussell , David T. Emerson , Michael J. Bergmann
IPC: H01L33/00
CPC classification number: H01L33/60 , G02B6/0073 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting diode lamp is disclosed that includes a resin package that defines a recess in the shape of a solid polygon or another three-dimensional solid. The recess includes a floor, two side walls along the respective longer sides of the floor, and two end walls along the respective shorter sides of the floor. The two side walls define an angle therebetween greater than 3°, and the two end walls define an angle therebetween greater than 40°. A light emitting diode chip is positioned on the rectangular floor of the package.
Abstract translation: 公开了一种发光二极管灯，其包括限定具有实心多边形或另一立体固体形状的凹部的树脂封装。 凹部包括地板，沿着地板的相应长边的两个侧壁以及沿着地板的相应短边的两个端壁。 两个侧壁在它们之间限定了大于3°的角度，并且两个端壁在它们之间限定了大于40°的角度。 发光二极管芯片位于封装的矩形地板上。
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公开(公告)号：US20110149604A1
公开(公告)日：2011-06-23
申请号：US13040088
申请日：2011-03-03
Applicant: CHRISTOPHER P. HUSSELL , Michael J. Bergmann , Brian T. Collins , David T. Emerson
Inventor： CHRISTOPHER P. HUSSELL , Michael J. Bergmann , Brian T. Collins , David T. Emerson
CPC classification number: H01L33/54 , H01L33/486 , H01L33/50 , H01L33/60 , H01L2224/48091 , H01L2224/48465 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.
Abstract translation: 公开了一种发光封装二极管，其包括安装在反射封装中的发光二极管，其中与二极管相邻的表面靠近朗伯反射器。 包装中的密封剂由朗伯反射器界定，并且密封剂中的磷光体转换由LED芯片发射的频率，并且与LED芯片发射的频率一起产生白光。 由密封剂形成的基本平坦的弯液面限定了封装二极管的发射表面。
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公开(公告)号：US20100123104A1
公开(公告)日：2010-05-20
申请号：US12271945
申请日：2008-11-17
Applicant: Brian T. Collins , Christopher P. Hussell , David T. Emerson , Ronan P. Le Toquin
Inventor： Brian T. Collins , Christopher P. Hussell , David T. Emerson , Ronan P. Le Toquin
IPC: G02B5/23
CPC classification number: C09K11/7734 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/5935 , C04B35/597 , C04B2235/3224 , C04B2235/3852 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/445 , C09K11/025 , C09K11/0883 , C09K11/7728
Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
Abstract translation: 公开了一种形成混合荧光粉组合物的方法。 该方法包括以下步骤：在耐火金属坩埚中，并且在气体存在下，将包含至少钙，锶和铝的铕和氮化物的前体组合物焙烧，以防止在氮化物起始材料和耐火材料之间形成氮化物组合物 形成坩埚的金属。 所得组合物可以包括将可见光谱的蓝色部分中的频率转换成可见光谱的红色部分中的频率的磷光体。
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Patent Agency Ranking
公开(公告)号：US20100090233A1
公开(公告)日：2010-04-15
申请号：US12635818
申请日：2009-12-11
Applicant: Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
Inventor： Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
IPC: H01L33/00
CPC classification number: H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
Abstract translation: 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。
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公开(公告)号：US09905731B2
公开(公告)日：2018-02-27
申请号：US12796365
申请日：2010-06-08
Applicant: John Adam Edmond , Michael J. Bergmann , David T. Emerson , Kevin Ward Haberern
Inventor： John Adam Edmond , Michael J. Bergmann , David T. Emerson , Kevin Ward Haberern
CPC classification number: H01L33/32 , H01L33/007 , H01L33/325
Abstract: A light emitting diode is disclosed that includes a silicon carbide substrate and a light emitting structure formed from the Group III nitride material system on the substrate. The diode has an area greater than 100,000 square microns and has a radiant flux at 20 milliamps current of at least 29 milliwatts at its dominant wavelength between 390 and 540 nanometers.
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公开(公告)号：US09041285B2
公开(公告)日：2015-05-26
申请号：US13429053
申请日：2012-03-23
Applicant: Christopher P. Hussell , David T. Emerson
Inventor： Christopher P. Hussell , David T. Emerson
IPC: H01J1/70 , F21K99/00 , F21Y101/02
CPC classification number: F21K9/90 , F21Y2115/10 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2924/00014
Abstract: A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.
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公开(公告)号：US08648359B2
公开(公告)日：2014-02-11
申请号：US13227961
申请日：2011-09-08
Applicant: Christopher P. Hussell , David T. Emerson , Jeffrey C. Britt
Inventor： Christopher P. Hussell , David T. Emerson , Jeffrey C. Britt
IPC: H01L23/52
CPC classification number: H01L27/153 , H01L25/0753 , H01L25/167 , H01L33/08 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/12032 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
Abstract: Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
Abstract translation: 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。
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公开(公告)号：US08390022B2
公开(公告)日：2013-03-05
申请号：US13347243
申请日：2012-01-10
Applicant: Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
Inventor： Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
IPC: H01L33/00
CPC classification number: H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
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