Abstract:
Provided are methods for manufacturing improved cerium oxide abrasives suitable for forming slurry compositions suitable for CMP processes. The cerium oxide abrasives are produced by the heat treatment of a mixture of a cerium precursor compound under conditions that produce primary cerium oxide particles that are incorporated in larger secondary abrasive particles. The structure of the primary cerium oxide particles and/or the presence of incompletely oxidized cerium within the secondary abrasive particle tend to reduce its mechanical strength, thereby reducing the likelihood of damaging a substrate surface during a CMP process utilizing such abrasives.
Abstract:
A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
Abstract:
Provided are semiconductor devices and methods of fabricating the same. A semiconductor device may include a semiconductor substrate with a device isolation layer defining HVE and HVD active regions. Gate insulation layer patterns may be disposed on the HVE and HVD active regions. Gate electrodes may be disposed on the gate insulation layer patterns to intersect the HVE and HVD active regions and the device isolation layer. An ion implantation layer may be disposed on the semiconductor substrate under the gate electrode of the HVD active region, spaced apart from the device isolation layer, and serves to adjust a threshold voltage.
Abstract:
A slurry composition for a chemical mechanical processing process includes about 0.05 to about 0.3 percent by weight of a ceria abrasive, about 0.005 to about 0.04 percent by weight of an anionic surfactant, about 0.0005 to about 0.003 percent by weight of a polyoxyethylene-based nonionic surfactant, about 0.2 to about 1.0 percent by weight of a salt of polyacrylic acid having an average molecular weight substantially greater than a molecular weight of the anionic surfactant, and a remainder of water. In addition, a method of polishing an object layer and a method of manufacturing a semiconductor device using the slurry composition are also provided.
Abstract:
Disclosed herein are an apparatus and method for testing open and short circuits of conductive lines. A probe is brought into contact with one end of each of the conductive lines, AC power is applied, and the conductive lines are tested using electrical variations measured in the probe. By using a single-side probe device, it is possible to remarkably reduce the number of probes when the open or short circuit of a PCB pattern, a data transmission line or an electrical cable is tested and to remarkably reduce time or labor necessary for testing the open or short circuit. Since the measurement is performed only at one end of the conductive line to test the open or short circuit of the conductive line, it is possible to self-diagnose the open or short circuit when a single-side probe device is mounted in an input/output port of an electrical device.
Abstract:
A method and apparatus for correcting a Signal-to-Noise Ratio (SNR) of an antenna of a mobile terminal, which can detect if a Micro-Electro Mechanical System (MEMS) reconfigurable antenna for wireless communication contacts a foreign substance, to correct an SNR of the antenna. The mobile terminal having the MEMS reconfigurable antenna changes the MEMS reconfigurable antenna and calculates an SNR during execution of the wireless communication, thereby setting the MEMS reconfigurable antenna to an antenna form corresponding to a greatest SNR.
Abstract:
A slider cradle for lateral positioning slider near rotating disk surface in hard disk drive, consisting essentially of piezoelectric micro-actuator coupling to slider cradle blank, further including piezoelectric micro-actuator coupling to first slider mount arm near slider mount and near slider mount base. A head gimbal assembly including slider cradle coupling to slider, flexure finger, and flexure finger electrically coupling to piezoelectric contacts. An actuator arm coupling to at least one head gimbal assembly. An actuator assembly, comprising voice coil coupling to at least one actuator arm. A hard disk drive containing actuator assembly. The invention includes a method of making slider cradle blank and slider cradle. The products of this process. Making head gimbal assembly, actuator assembly and hard disk drive using the invention's components. The head gimbal assembly, the actuator assembly, and the hard disk drive are products of these processes.
Abstract:
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
Abstract:
A hard disk drive that includes a voice coil motor and a micro-actuator. The disk drive includes a servo with a voice coil motor loop, a micro-actuator loop and an overall loop. The servo is calibrated by first calibrating the voice coil motor loop, then calibrating the micro-actuator loop and finally calibrating the overall loop.
Abstract:
A terminal location estimation method in a wireless communication system in which an access point (AP) provides an access service to a plurality of terminals includes defining a plurality of beam spaces around the AP through space multiplexing; scheduling the beam spaces according to a predetermined pattern; simultaneously forming a beam in at least one beam space; and detecting the existence and location of a terminal according to whether a response message in response to the formed beam is received. Accordingly, an AP forms beams in a predetermined scheduling pattern, and each of the terminals detecting the beams registers its location by informing the AP that each of the terminals exists in a relevant beam area, and thus, a location of each of the terminals can be estimated without using a complex DOA algorithm.