公开(公告)号：US11637537B2

公开(公告)日：2023-04-25

申请号：US16938734

申请日：2020-07-24

申请人： INVENSENSE, INC.

发明人： Igor Mucha ,  Michael Perrott

IPC分类号： H03G3/30 ,  H03F3/68 ,  H04R3/04 ,  H04R29/00

摘要： Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.

公开(公告)号：US11632639B2

公开(公告)日：2023-04-18

申请号：US17681349

申请日：2022-02-25

申请人： InvenSense, Inc.

发明人： Marek Matej ,  Stefano Riva

IPC分类号： H04R29/00 ,  H04R3/00 ,  B81B3/00

摘要： A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.

公开(公告)号：US11623246B2

公开(公告)日：2023-04-11

申请号：US16269892

申请日：2019-02-07

申请人： INVENSENSE, INC.

发明人： Emad Mehdizadeh ,  Bongsang Kim ,  Chienliu Chang ,  Leonardo Baldasarre ,  Nikhil Apte ,  Xiaoyue Jiang ,  Mei-Lin Chan

IPC分类号： B06B1/06 ,  B06B1/02 ,  H01L41/04 ,  H01L41/047 ,  H01L41/08 ,  H01L41/187 ,  H01L41/29 ,  H01L41/332 ,  H01L41/313 ,  G06V40/13

摘要： A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.

公开(公告)号：US20230089813A1

公开(公告)日：2023-03-23

申请号：US17950007

申请日：2022-09-21

申请人： InvenSense, Inc.

发明人： Weng Shen Su ,  Chung-Hsien Lin ,  Yaoching Wang ,  Tsung Lin Tang ,  Ting-Yuan Liu ,  Calin Miclaus

IPC分类号： B81C1/00 ,  G01L9/00 ,  B81B3/00

摘要： A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.

公开(公告)号：US20230068608A1

公开(公告)日：2023-03-02

申请号：US17822619

申请日：2022-08-26

申请人： InvenSense, Inc.

发明人： Ardalan HESHMATI ,  Hideaki FUKUZAWA

IPC分类号： G06F3/01 ,  G02B27/01 ,  G02B26/10 ,  G02B26/08

摘要： A retinal projection display system includes at least one visible light source for projecting a visible light image, an infrared light source for projecting infrared light, a scanning mirror having a field of view larger than the visible light image, a reflective surface on which the visible light image is projected and on which the infrared light is reflected at least partially towards an eye of a user, wherein the reflective surface is larger than the visible light image, at least one infrared photodetector for receiving reflected infrared light that reflects off of the eye of the user, and a hardware computation module comprising a processor and a memory, the hardware computation module configured to determine a gaze direction of the user based at least in part on the reflected infrared light.

公开(公告)号：US20230054450A1

公开(公告)日：2023-02-23

申请号：US17820876

申请日：2022-08-18

申请人： InvenSense, Inc.

发明人： Ardalan HESHMATI ,  Hideaki FUKUZAWA

IPC分类号： G02B27/01 ,  G02B26/10

摘要： A retinal projection display system includes a light source for projecting an image, a scanning mirror having a field of view larger than the image, and a reflective surface on which the image is projected, wherein the reflective surface is larger than the image. The scanning mirror projects the image onto a viewable region of the reflective surface such that the image is projected into a retina of a user.

公开(公告)号：US20230037849A1

公开(公告)日：2023-02-09

申请号：US17877089

申请日：2022-07-29

申请人： InvenSense, Inc.

发明人： Daesung Lee ,  Alan Cuthbertson

IPC分类号： B81C1/00

摘要： A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.

公开(公告)号：US20230030211A1

公开(公告)日：2023-02-02

申请号：US17964520

申请日：2022-10-12

申请人： InvenSense, Inc.

发明人： Calin Miclaus ,  Chung-Hsien Lin ,  Jye Ren ,  Tim Piessens ,  Pei-Wen Yen ,  Manish Sharma-Kulamarva

IPC分类号： G01L19/06 ,  G01L19/00 ,  G01L9/00 ,  G01N27/22 ,  G01N25/56 ,  G01N27/04

摘要： A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.

公开(公告)号：US11563166B2

公开(公告)日：2023-01-24

申请号：US16812752

申请日：2020-03-09

申请人： INVENSENSE, INC.

发明人： Chienliu Chang

IPC分类号： H01L41/257 ,  B06B1/02 ,  B06B1/06 ,  H01L41/04 ,  H01L41/047 ,  H01L41/193 ,  H01L41/29 ,  H01L41/332 ,  H01L41/08 ,  G06V40/13

摘要： An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied between the upper electrode and the interconnected set of lower electrodes. After poling is complete, portions of the interconnected set of lower electrodes are removed to permanently isolate permanent lower electrodes from each other.

公开(公告)号：US11548780B2

公开(公告)日：2023-01-10

申请号：US17516245

申请日：2021-11-01

申请人： INVENSENSE, INC.

发明人： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC分类号： G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

摘要： An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.