Abstract:
Methods for performing epitope mapping, and for characterizing the antibody binding affinity and epitope diversity of antibodies in a sample using peptide microarray are provided. In some aspects, methods are provided for the specific characterization of IgE and IgG4. Also disclosed are methods for diagnosing whether a milk-allergic individual will outgrow his or her allergy based on the characterization of the individual's milk allergen-specific IgE antibodies.
Abstract:
This invention relates to a semiconductor device and a manufacturing method therefor for reducing stacking faults caused by high content of Ge in an embedded SiGe structure. The semiconductor device comprises a Si substrate with a recess formed therein. A SiGe seed layer is formed on sidewalls of the recess, and a first SiGe layer having a Ge content gradually increased from bottom to top is formed on the recess bottom. A second SiGe layer having a constant content of Ge is formed on the first SiGe layer. The thickness of the first SiGe layer is less than the depth of the recess. The Ge content in the SiGe seed layer is less than the Ge content in the second SiGe layer, and the Ge content at the upper surface of the first SiGe layer is less than or equal to the Ge content in the second SiGe layer.
Abstract:
A method of distinguishing a control solution from a sample in an electrochemical test sensor is performed. The method includes adding a control marker to the control solution. The control solution includes the control marker and analyte. The test sensor includes working and counter electrodes, and a reagent. A potential is applied to the test sensor to oxidize the control marker and the analyte. The resulting electrical current is measured. A potential is applied to the test sensor lower than the other potential in which the potential is sufficient to oxidize the analyte and not the control marker. The resulting electrical current is measured. Determining whether a control solution or a sample is present based on the measured electrical currents. To increase the measured current, a salt may be added to the control solution in an amount sufficient to increase the electrical current by at least 5% as compared to a control solution in the absence of a salt.
Abstract:
A temperature conditioning system for outdoor digital signage and method thereof comprises a central control module, a system temperature sensor, a fan temperature sensor, a digital signage control module, an internal power supply module, a display module, a heating module and an external fan, wherein the central control module is responsible for receiving temperature signals detected by the system temperature sensor and the fan temperature sensor; in case the detected temperature is lower than a certain range, the central control module activates the heating module, the external fan and the display module in order to start and display the warm-up process of the outdoor digital signage. Consequently, when the temperature elevates to a certain range, the digital signage control module activates the power source of the outdoor digital signage such that the outdoor digital signage operates within a normal temperature range thereby preventing the dew formed by excessively low outdoor temperature from causing malfunction problems in the outdoor digital signage.
Abstract:
A user token management system in a client device on a network comprises an obtaining module, a web controller and a processing module. The obtaining module obtains a user token from a database in response to a retrieving request for retrieving authorization of a web service provider on the network. The web controller transmits an authenticating request for authenticating the user token to the web service provider and receives an authentication result authenticating the user token. The processing module deletes the user token from the database when that user token is not authenticated by the web service provider.
Abstract:
A standalone printer includes a configuration module, a screen, a process module, and a print module. The configuration module can arrange two digital images in a print layout. The screen is configured to display a preview of the print layout with the two digital images. The process module is configured to decode the print layout of the two digital images into a raster image along a decoding orientation. The print module is configured to print the raster image along the decoding orientation. The process module is configured to stream partial raster image to the print module when decoding the print layout. The printer module is configured to print received partial raster image.
Abstract:
Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes to provide tungsten films having significantly improved surface uniformity while increasing the production level throughput. In one embodiment, a method is provided which includes depositing a tungsten silicide layer on the substrate by exposing the substrate to a continuous flow of a silicon precursor while also exposing the substrate to intermittent pulses of a tungsten precursor. The method further provides that the substrate is exposed to the silicon and tungsten precursors which have a silicon/tungsten precursor flow rate ratio of greater than 1, for example, about 2, about 3, or greater. Subsequently, the method provides depositing a tungsten nitride layer on the tungsten suicide layer, depositing a tungsten nucleation layer on the tungsten nitride layer, and depositing a tungsten bulk layer on the tungsten nucleation layer.
Abstract:
A testing system for testing an analyte in a fluid sample includes a user interface including a display for displaying information relating to measurements of health data and an input device for receiving information from a user relating to the health data. The testing system further includes an automarking feature adapted to identify a testing result of a control solution, the testing of the control solution being distinguishable from the testing of the fluid sample. The testing result of the control solution is not included in the information relating to the measurements of health data that is displayed to a user via the user interface.
Abstract:
A heat dissipation system for digital electronic signboard includes a first heat dissipation subsystem disposed in a main circuit board area of a digital electronic signboard, and a second heat dissipation subsystem disposed in a computer mainboard area of the digital electronic signboard. The main circuit board area has a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the main circuit board area, while another heat dissipation fan is disposed at a side of a power supply and can be externally connected to an air guide pipe. The computer mainboard area can also have a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the computer mainboard, while another heat dissipation fan is disposed on the top of a microprocessor of the computer mainboard.
Abstract:
Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes to provide tungsten films having significantly improved surface uniformity while increasing the production level throughput. In one embodiment, a method is provided which includes depositing a tungsten silicide layer on the substrate by exposing the substrate to a continuous flow of a silicon precursor while also exposing the substrate to intermittent pulses of a tungsten precursor. The method further provides that the substrate is exposed to the silicon and tungsten precursors which have a silicon/tungsten precursor flow rate ratio of greater than 1, for example, about 2, about 3, or greater. Subsequently, the method provides depositing a tungsten nitride layer on the tungsten suicide layer, depositing a tungsten nucleation layer on the tungsten nitride layer, and depositing a tungsten bulk layer on the tungsten nucleation layer.