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    COMPOSITIONS AND METHODS FOR PREDICTION OF CLINICAL OUTCOME FOR ALL STAGES AND ALL CELL TYPES OF NON-SMALL CELL LUNG CANCER IN MULTIPLE COUNTRIES
    22.
    发明申请
    COMPOSITIONS AND METHODS FOR PREDICTION OF CLINICAL OUTCOME FOR ALL STAGES AND ALL CELL TYPES OF NON-SMALL CELL LUNG CANCER IN MULTIPLE COUNTRIES 审中-公开

    公开(公告)号：US20160053327A1

    公开(公告)日：2016-02-25

    申请号：US14467002

    申请日：2014-08-23

    Applicant: Tiehua Chen ,  Luming Chen ,  Jing Ling

    Inventor： Tiehua Chen ,  Luming Chen ,  Jing Ling

    IPC: C12Q1/68

    CPC classification number: C12Q1/6886 ,  C12Q2600/106 ,  C12Q2600/112 ,  C12Q2600/118 ,  C12Q2600/158 ,  C12Q2600/16

    Abstract: Lung cancer is one of the most commonly diagnosed cancers in the world. While numerous predictive genetic models of non-small cell lung cancer (NSCLC) have been proposed, but many current models fail to accurately predict patient survival when verified by other multiple datasets. Here, we successfully eliminated institutional variations and merged twelve datasets from different institutions to generate a training cohort of 1073 and a testing cohort of 659. From the training cohort, we identified 129 deferentially expressed probes or 95 genes (Table1-2) associated with Lung Cancer.Here we showed that using seven genes from Table1-2 and combined these genes values with the clinical parameters of age and cancer stage to design the Lung Cancer Prognostic Index (LCPI). Using the LCPI, we were able to differentiate patient populations into low, intermediate, and high risk groups and predict patient survival probabilities for all stages and all cell types of NSCLC at 10 and 15 years. The overall survival probability of low risk group defined by LCPI at 15 years was 65%-100%. Those lung cancer patients were surgical curable. Any post-surgery treatment like ACT (adjuvant chemotherapy) might actually decrease survival probabilities or shorten the life of those patients.We extensively verified the predictive ability of the LCPI model for overall survival and recurrence free survival using six datasets (n=1665) from five different countries, which included samples of multiple cancer stages and all cell types. Using this model, clinicians would be able to prevent thousands of NSCLC patients from receiving excessive and unnecessary treatments and ultimately prolong their lives.This research has been published in the first issue of “EbioMedicine” (http://www.ebiomedicine.com/article/S2352-3964%2814%2900014-0/fulltext) which is a high quality peer review journal under editorial leadership of “Cell Press” and “The Lancet”.

    Through silicon via structure and method of fabricating the same
    23.
    发明申请
    Through silicon via structure and method of fabricating the same 审中-公开
    通过硅通孔结构及其制造方法

    公开(公告)号：US20130200519A1

    公开(公告)日：2013-08-08

    申请号：US13364331

    申请日：2012-02-02

    Applicant: Ji Feng ,  Hailong Gu ,  Ying-Tu Chen ,  Jing-Ling Wang

    Inventor： Ji Feng ,  Hailong Gu ,  Ying-Tu Chen ,  Jing-Ling Wang

    IPC: H01L23/48 ,  H01L21/768

    CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention relates to a method of fabricating a through silicon via (TSV) structure, in which, a dielectric layer is disposed to cover surface of each of a device region of a substrate and a sidewall and a bottom of a via hole in a TSV region of the substrate, and the via hole having the dielectric layer covering the sidewall and the bottom is filled with a conductive material. The present invention also relates to a TSV structure, in which, a dielectric layer disposed in the device region of a substrate extends to the via hole in a TSV region of the substrate to cover surface of the sidewall of the via hole to serve as a dielectric liner, and a conductive material is filled into the via hole having the dielectric layer covering the sidewall.

    Abstract translation: 本发明涉及一种制造贯穿硅通孔（TSV）结构的方法，其中介电层被设置成覆盖基板的器件区域的每一个的表面以及通孔的侧壁和底部的表面 TSV区域，并且具有覆盖侧壁和底部的电介质层的通孔填充有导电材料。 本发明还涉及TSV结构，其中设置在基板的器件区域中的电介质层延伸到衬底的TSV区域中的通孔以覆盖通孔的侧壁的表面，以用作 电介质衬垫和导电材料填充到具有覆盖侧壁的电介质层的通孔中。

    Differential delay compensation
    25.
    发明授权
    Differential delay compensation 有权
    差分延时补偿

    公开(公告)号：US08488631B2

    公开(公告)日：2013-07-16

    申请号：US13229455

    申请日：2011-09-09

    Applicant: Jing Ling ,  Soowan Suh ,  Juan-Carlos Calderon

    Inventor： Jing Ling ,  Soowan Suh ,  Juan-Carlos Calderon

    IPC: H04J99/00

    CPC classification number: G06F12/06 ,  H04J3/0623 ,  H04J2203/0094 ,  H04L45/742 ,  H04L49/30 ,  H04L49/90 ,  H04L49/901

    Abstract: In one embodiment, a method comprises receiving a plurality of data frames representing at least one virtually concatenated data stream, storing the plurality of data frames in a memory; and recording, for each of a plurality of data frames, a physical write address that indicates a position in the memory and a virtual write address that includes a multiframe indicator and a byte number indicator.

    Abstract translation: 在一个实施例中，一种方法包括：接收表示至少一个虚拟级联数据流的多个数据帧，将多个数据帧存储在存储器中; 并且针对多个数据帧中的每一个记录指示存储器中的位置的物理写入地址和包括多帧指示符和字节数指示符的虚拟写入地址。

    Method for showing a component on a user interface
    28.
    发明申请
    Method for showing a component on a user interface 审中-公开
    在用户界面上显示组件的方法

    公开(公告)号：US20060020897A1

    公开(公告)日：2006-01-26

    申请号：US11175338

    申请日：2005-07-07

    Applicant: Jing-Ling Li

    Inventor： Jing-Ling Li

    IPC: G06F3/00

    CPC classification number: G06F3/0481

    Abstract: A method for showing a component on a user interface is disclosed. A style maker provides some style options, each style option including associated configurations. When constructing the component on the user interface, one of the style options is selected for showing the component. In this manner, the constructed component is distinctly displayed on the user interface responding to the respective event.

    Abstract translation: 公开了一种在用户界面上显示组件的方法。 风格制作者提供一些风格选项，每种风格选项包括相关配置。 在用户界面上构建组件时，选择其中一个样式选项来显示组件。 以这种方式，响应于相应的事件，构造的组件被明确地显示在用户界面上。

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