Defect inspecting apparatus
    21.
    发明授权
    Defect inspecting apparatus 失效
    缺陷检查装置

    公开(公告)号:US07535561B2

    公开(公告)日:2009-05-19

    申请号:US11717651

    申请日:2007-03-14

    IPC分类号: G01N21/00

    摘要: A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition.

    摘要翻译: 本发明的缺陷检查装置解决了在缺陷检查装置中,由于通过减小检测像素尺寸来提高微观缺陷的检测灵敏度,焦点深度变浅,成像高度由于环境变化而变化, 缺陷的检测灵敏度变得不稳定。 该装置包括XY台,其承载待检查的基板和沿预定方向扫描的机构,以及具有以倾斜方式照射被检查基板上的缺陷的系统的机构,并且通过设置在该检测光学系统上的检测光学系统检测该缺陷 上部,其实时校正成像的高度以改变温度和大气压力,以便将成像保持在最佳状态。

    Apparatus and method for inspecting defects
    22.
    发明授权
    Apparatus and method for inspecting defects 失效
    用于检查缺陷的装置和方法

    公开(公告)号:US07511806B2

    公开(公告)日:2009-03-31

    申请号:US11931120

    申请日:2007-10-31

    IPC分类号: G01N21/00

    CPC分类号: G01N21/9501

    摘要: A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concave-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

    摘要翻译: 一种缺陷检查装置,包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元,其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类,其中通过基于凹凸水平(b / a)改变所述缺陷尺寸的校正系数来估计缺陷尺寸, 其中缺陷的凹凸级(b / a)由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比值表示,其中第二方向与第 第一个方向。

    Defect inspection system
    23.
    发明申请
    Defect inspection system 失效
    缺陷检查系统

    公开(公告)号:US20080291436A1

    公开(公告)日:2008-11-27

    申请号:US12081107

    申请日:2008-04-10

    IPC分类号: G01N21/88

    摘要: A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.

    摘要翻译: 缺陷检查系统可以抑制来自样品粗糙表面或常规电路图案的光的影响,并且增加来自诸如异物的缺陷的光的增益以高灵敏度检测样品表面上的缺陷。 当使用具有大NA值的透镜时,透镜的外径为10a,并且样品表面与来自缺陷的光的行进方向之间的角度为α1。 倾斜检测光学系统以相对于样品表面的降低的仰角α2接收来自缺陷的光,以减少来自样品粗糙表面,氧化膜粗糙底表面和电路图案的光,并且增加 来自缺陷的光并检测。 透镜的直径10a小于直径10b,导致散射光聚焦的能力降低。 当使用外径为10c的透镜来提高聚焦能力时,透镜会干扰样品。 为了避免干扰,去除了与样品干扰的一部分透镜。 透镜具有大于直径10b的孔径,而透镜接收以仰角α2散射的光,从而可以提高同时检测缺陷和透镜性能的能力。

    Defect Inspection Method and Defect Inspection Apparatus
    24.
    发明申请
    Defect Inspection Method and Defect Inspection Apparatus 有权
    缺陷检查方法和缺陷检查装置

    公开(公告)号:US20080204736A1

    公开(公告)日:2008-08-28

    申请号:US12038274

    申请日:2008-02-27

    IPC分类号: G01N21/94

    CPC分类号: G01N21/9501 G01N2021/9513

    摘要: Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system.

    摘要翻译: 提供一种具有大范围的缺陷检查装置,用于在确保足够大的信号强度的同时从细小的缺陷接收光散射; 及其缺陷检查方法。 缺陷检查装置包括:能够相对于光学系统行进的载台部件,其中待检查的基板安装在平台部分上; 用于照射基板上的检查区域的照明光学系统; 用于检测来自基板上的检查区域的光的检测光学系统; 用于通过检测光学系统将形成在图像传感器上的图像转换成信号的图像传感器; 信号处理器,用于通过处理来自图像传感器的信号来检测缺陷; 以及布置在检测光学系统和基板之间的用于将来自基板的光传输到检测光学系统的平面反射镜。

    Surface inspection apparatus and method thereof
    25.
    发明授权
    Surface inspection apparatus and method thereof 有权
    表面检查装置及其方法

    公开(公告)号:US07242016B2

    公开(公告)日:2007-07-10

    申请号:US11104621

    申请日:2005-04-13

    IPC分类号: G01N21/88

    摘要: A surface inspection apparatus and a method for inspecting the surface of a sample are capable of inspecting discriminatingly between scratches of various configuration and adhered foreign objects that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to a polishing process such as CMP or a grinding process, in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity from the shallow scratch and from the foreign object is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light is detected to discriminate between the linear scratch and the foreign object.

    摘要翻译: 表面检查装置和检查样品表面的方法能够在工作目标(例如,工件的表面上的绝缘膜)上区别地检查在工作目标表面上发生的各种构造和附着异物的划痕 半导体衬底)在半导体制造工艺或磁头制造工艺中进行诸如CMP或研磨工艺的抛光工艺。 在本发明中,通过使用大致相同的光通量,在样品的抛光或地面上发生的划痕和异物被表面照射和倾斜照射,来自浅划痕的散射光强度与来自 应用异物,从而区分浅刮痕和异物,并且检测散射光的方向性以区分线状划痕和异物。

    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
    29.
    发明授权
    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
    用于测量对准精度的装置和方法,以及用于制造半导体器件的方法和系统

    公开(公告)号:US06897956B2

    公开(公告)日:2005-05-24

    申请号:US10235656

    申请日:2002-09-06

    摘要: An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured, comprising: an XY stage running in a direction x and in a direction y while mounting the substrate; an illumination optical system for illuminating each of the alignment mark portions in a state where the XY stage runs in a direction x which is a direction of arranging the chips; a detecting optical system having an objective lens for collecting a reflection light in the running state obtained from the overlaid alignment marks, a focusing optical system for focusing the reflection light in the running state obtained from the objective lens, a scanning optical system for scanning reflection light image in the running state focused by the focusing optical system in a direction opposite to that of the running and a linear image sensor receiving reflection light image substantially in a static state being scanned in the opposite direction by the scanning optical system and converting them into image signal; and an alignment accuracy calculation device for measuring the alignment accuracy between the overlaid alignment marks at least for a direction perpendicular to the running direction based on the image signal converted by the linear image sensor.

    摘要翻译: 一种用于测量在布置在待测量基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置,包括:沿x方向和y方向运行的XY台, 安装基板; 照明光学系统,用于在XY台在作为排列芯片的方向的方向x上行进的状态下照亮每个对准标记部分; 一种检测光学系统,具有用于收集从重叠的对准标记获得的运行状态的反射光的物镜,用于将反射光聚焦在从物镜获得的运行状态的聚焦光学系统,用于扫描反射的扫描光学系统 聚焦光学系统以与行进方向相反的方向聚焦的运行状态的光图像和接收基本处于静止状态的反射光图像的线性图像传感器被扫描光学系统沿相反方向扫描并将其转换成 图像信号; 以及对准精度计算装置,用于根据由线性图像传感器转换的图像信号,至少对垂直于行进方向的方向测量重叠的对准标记之间的对准精度。

    Method of inspecting a semiconductor device and an apparatus thereof
    30.
    发明授权
    Method of inspecting a semiconductor device and an apparatus thereof 有权
    检查半导体器件的方法及其装置

    公开(公告)号:US06888959B2

    公开(公告)日:2005-05-03

    申请号:US09791682

    申请日:2001-02-26

    摘要: In order to inspect a substance to be detected such as a foreign substance in accordance with the condition of the surface of a sample to be inspected such as a semiconductor substrate manufactured in various manufacturing processes under a suitable inspection condition, this method includes the steps of: inspecting a substance to be detected on a sample to be inspected under a plurality inspection conditions, which are previously set, as a single unit to detect at least the data of a detected substance for each of the plurality of inspection conditions; checking the data of the detected substance for the respective inspection conditions against each other to make check data; analyzing the detected substance based on the check data of the detected substance to classify the detected substance; adding the data of classified detected substance to the coordinate data of the detected substance for the respective inspection conditions to make data relating to the classified detected substance for the respective inspection conditions; and selecting a suitable inspection condition based on the data relating to the classified detected substance for the respective inspection conditions.

    摘要翻译: 为了在适当的检查条件下,根据在各种制造工序中制造的半导体衬底等被检测样品的表面状况,检查异物等异物,该方法包括以下步骤: 在预先设定的多个检查条件下检查待检测样品上检测到的物质作为单个单元,至少检测多个检查条件中检测物质的数据; 检查相应检查条件的检测物质的数据,以进行检查数据; 基于检测到的物质的检查数据分析检测到的物质以对检测到的物质进行分类; 将各种检测条件的检测物质的坐标数据相加,对各检查条件进行分类检测物质的数据的添加; 以及基于与各检查条件的分类检测物质有关的数据来选择合适的检查条件。