Abstract:
An array substrate includes a base substrate which includes a display area and a peripheral area adjacent to the display area, a plurality of fan-out lines arranged in the peripheral area to receive a driving signal from an exterior source, at least one fan-out line among the plurality of fan-out lines arranged on a different layer from a layer on which remaining fan-out lines of the plurality of fan-out lines are arranged, a plurality of signal lines arranged in the display area to receive the driving signal from the plurality of fan-out lines and a pixel array arranged in the display area to receive the driving signal from the plurality of signal lines.
Abstract:
Provided is a thin-film transistor (TFT) display panel having improved electrical and reliability properties and a method of fabricating the TFT display panel. The TFT display panel includes gate wiring formed on a substrate; an oxide active layer pattern formed on the gate wiring; data wiring formed on the oxide active layer pattern to cross the gate wiring; a passivation layer formed on the oxide active layer pattern and the data wiring and made of nitrogen oxide; and a pixel electrode disposed on the passivation layer.
Abstract:
In a liquid crystal display device, the device includes a first substrate, a second substrate and a liquid crystal layer interposed therebetween. The first substrate includes a pixel electrode, a thin film transistor connected to the pixel electrode, and also a hitch to connect both a lower and upper electrode of the pixel electrode. The second substrate includes a common electrode having a lower domain division part and an upper domain division part, in which each of domain division part is formed at the position corresponding to the lower and upper electrode of the pixel electrode, respectively. Through the electric field controller connected at both sides of the upper electrode of the pixel electrode, quality of display image can improve without a darkening area occurring at one part of the unit pixel.
Abstract:
Provided is a method for manufacturing a thin-film transistor substrate, in which the etching characteristics of an insulating film and a passivation layer are enhanced. The insulating film and the passivation layer are deposited by low temperature chemical vapor deposition. The method includes disposing a gate wiring on an insulating substrate; disposing a gate insulating film on the gate wiring; disposing a data wiring on the gate insulating film; disposing a passivation layer on the data wiring; and forming a contact hole by etching at least one of the gate insulating film and the passivation layer, wherein at least one of the gate insulating film and the passivation layer is disposed at a temperature of about 280° C. or below, and the forming of the contact hole is performed at a pressure of about 60 mT or below.
Abstract:
A thin film transistor substrate includes an insulating plate, a plurality of fan-out lines arranged on the insulating plate and including at least a pair of adjacent fan-out lines, a plurality of signal lines connected to the plurality of fan-out lines, and a plurality of thin film transistors connected to the plurality of signal lines. The adjacent fan-out lines partially overlap with each other, and each overlapping area of the adjacent fan-out lines is the same.
Abstract:
Provided are a metal line, a method of forming the same, and a display using the same. To increase resistance of a metal line having a multilayered structure of CuO/Cu and prevent blister formation, a plasma treatment is performed using a nitrogen-containing gas and a silicon-containing gas or using a hydrogen or argon as and the silicon-containing gas. Accordingly, a plasma treatment layer such as a SiNx or Si layer is thinly formed on the copper layer, thereby preventing an increase in resistance of the copper layer and also preventing blister formation caused by the damage of a copper oxide layer. Consequently, it is possible to improve the reliability of a copper line and thus enhance the reliability of a device.
Abstract:
Provided are a display substrate and a display device including the same. The display substrate includes: gate wiring; a first semiconductor pattern formed on the gate wiring and having a first energy bandgap; a second semiconductor pattern formed on the first semiconductor pattern and having a second energy bandgap which is greater than the first energy bandgap; data wiring formed on the first semiconductor pattern; and a pixel electrode electrically connected to the data wiring. Because the second energy bandgap is larger than the first energy bandgap, a quantum well is formed in the first semiconductor pattern, enhancing electron mobility therein.
Abstract:
A display substrate, a display device including the display substrate, and a method of fabricating the display substrate are provided. The display substrate includes a gate electrode; a gate-insulating layer disposed on the gate electrode; an oxide semiconductor pattern disposed on the gate-insulating layer; a source electrode disposed on the oxide semiconductor pattern; and a drain electrode disposed on the oxide semiconductor pattern and separated from the source electrode, wherein at least one portion of at least one of the gate-insulating layer or the oxide semiconductor pattern is plasma-processed.
Abstract:
A method of manufacturing a thin film transistor (“TFT”) substrate includes forming a first conductive pattern group including a gate electrode on a substrate, forming a gate insulating layer on the first conductive pattern group, forming a semiconductor layer and an ohmic contact layer on the gate insulating layer by patterning an amorphous silicon layer and an oxide semiconductor layer, forming a second conductive pattern group including a source electrode and a drain electrode on the ohmic contact layer by patterning a data metal layer, forming a protection layer including a contact hole on the second conductive pattern group, and forming a pixel electrode on the contact hole of the protection layer. The TFT substrate including the ohmic contact layer formed of an oxide semiconductor is further provided.
Abstract:
A thin film transistors (TFTs) substrate is structured to maintain as constant across the area of the substrate a kickback voltage due to Miller capacitance between the drain and gate of each TFT even in the presence of manufacturing induced misalignments between the drain electrodes and corresponding gate lines. Each thin film transistor includes a gate electrode, an active layer formed on the gate electrode so as to overlap the gate electrode, first and second source electrodes respectively connected to first and second data lines each of which crosses the gate line while being insulated from the gate line, and an elongated drain electrode located between the first and second source electrodes and disposed over the gate electrode so as to a crossing length of the drain electrode is larger than an underlying width of the gate electrode such that misalignment induced shifts of the position of the gate electrode relative to the drain electrode does not substantially change overlap area between the two.