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    Lactobacillus Plantarum and Uses Thereof
    21.
    发明申请
    Lactobacillus Plantarum and Uses Thereof 有权
    植物乳杆菌及其用途

    公开(公告)号：US20120020943A1

    公开(公告)日：2012-01-26

    申请号：US12868136

    申请日：2010-08-25

    Applicant: Wen-Hsin Lin

    Inventor： Wen-Hsin Lin

    IPC: A61K35/74 ,  C12N1/20 ,  A61P1/02 ,  A61P31/04 ,  A61P13/02

    CPC classification number: C12R1/25 ,  A23L33/135 ,  A61K2035/115 ,  C12N1/20

    Abstract: Provided is an isolated Lactobacillus plantarum CMU995, which was deposited at the Food Industry Research and Development Institute in Taiwan with the accession number BCRC 910472 and in the German Collection of Microorganisms and Cell Cultures (DSMZ) under accession number DSM 23780. Also provided are a composition comprising Lactobacillus plantarum CMU995 and a method for inhibiting pathogens, protecting the gastrointestinal tract, and/or protecting the urinary tract in a mammal comprising administrating an effective amount of Lactobacillus plantarum CMU995 to the mammal.

    Abstract translation: 提供了一种分离的植物乳杆菌CMU995，其保藏在台湾的食品工业研究开发研究所，登记号为BCRC 910472，并在德国收藏的微生物和细胞培养物（DSMZ）中，登录号DSM 23780。还提供了 组合物，其包含植物乳杆菌CMU995和抑制病原体，保护胃肠道和/或保护哺乳动物的尿道的方法，包括向哺乳动物施用有效量的植物乳酸乳杆菌CMU995。

    High-precision ceramic substrate preparation process
    22.
    发明申请
    High-precision ceramic substrate preparation process 审中-公开
    高精度陶瓷基板的制备工艺

    公开(公告)号：US20110123931A1

    公开(公告)日：2011-05-26

    申请号：US12805720

    申请日：2010-08-17

    Applicant: Wen-Hsin Lin

    Inventor： Wen-Hsin Lin

    IPC: G03F7/20

    CPC classification number: H05K3/108 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/281 ,  H05K2201/017

    Abstract: A high-precision ceramic substrate preparation process is disclosed to bond a dry film to a metal layer on a ceramic plate, and then to coat a conductive layer on the metal layer and an anti-etching metal layer on the conductive layer after application of an exposing and developing process to form a predetermined circuit pattern in the dry film, and then to remove the dry film and to etch the metal layer, and then to bond an oxygen-free tape, which is prepared from a compound of ceramic powder, glass powder and pasting agent, to the conductive layer, and then to sinter the oxygen-free tape in an oxygen-free sintering furnace into a retaining wall, and then to coat an anti-oxidation bonding layer on the surface of the conductive layer.

    Abstract translation: 公开了一种高精度陶瓷基板制备方法，将干膜与陶瓷板上的金属层接合，然后在施加了导电层之后在导电层上涂覆金属层上的导电层和抗蚀刻金属层 曝光和显影工艺以在干膜中形成预定的电路图案，然后除去干膜并蚀刻金属层，然后粘合由陶瓷粉末化合物玻璃制成的无氧胶带 粉末和粘贴剂，导电层，然后在无氧烧结炉中将无氧胶带烧结成保持壁，然后在导电层的表面上涂覆抗氧化粘合层。

    Display Device and Light Source Block Used Therein
    23.
    发明申请
    Display Device and Light Source Block Used Therein 有权
    其中使用的显示设备和光源块

    公开(公告)号：US20100039580A1

    公开(公告)日：2010-02-18

    申请号：US12493369

    申请日：2009-06-29

    Applicant: Chien-Hung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    Inventor： Chien-Hung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    IPC: G02F1/1335 ,  G02B5/00

    CPC classification number: G02B5/003 ,  G02F1/133608

    Abstract: A display device and a light source block used therein are provided. The display device includes the light source block, a film set, and a display panel. The light source block has a reflective surface, a film supporter intersecting the reflective surface at an edge, and a panel supporting surface. The film supporter connects an end of an extremity surface, and the panel supporting surface connects the other end of the extremity surface. The film set is disposed on the film supporter, and the display panel is disposed on the panel supporting surface. The display panel has a display area and a light-shielding unit disposed outside the display area. The edge between the reflective surface and the film supporter falls into a vertical projection of the light-shielding unit.

    Abstract translation: 提供了一种其中使用的显示装置和光源块。 显示装置包括光源块，胶片组和显示面板。 光源块具有反射表面，与边缘处的反射表面相交的膜支撑件和面板支撑表面。 胶片支架连接末端表面的一端，面板支撑面连接肢体表面的另一端。 胶片组设置在胶片支持体上，显示面板设置在面板支撑面上。 显示面板具有设置在显示区域外的显示区域和遮光单元。 反射面与胶片支持体之间的边缘落入遮光单元的垂直投影中。

    Image sensing component package and manufacture method thereof
    24.
    发明授权
    Image sensing component package and manufacture method thereof 有权

    公开(公告)号：US06670551B2

    公开(公告)日：2003-12-30

    申请号：US09871993

    申请日：2001-06-04

    Applicant: Wen-Hsin Lin ,  Fa-Tai Wang

    Inventor： Wen-Hsin Lin ,  Fa-Tai Wang

    IPC: H05K506

    CPC classification number: H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention discloses an image sensing semiconductor package and manufacture method thereof utilizing the plastic leaded chip carrier (PLCC) manufacture process to produce image sensing chips with a cheaper plastic carrier, and it also seals dry high-pressure gas inside the image sensing chip in the manufacture process. Therefore, when the image sensing chip is used in a device, it can prevent moisture in the air from entering into the interior of the image sensing component due to pressure difference that will shorten the lifespan of the image sensing chip. The invention also provides a component rinsing procedure for the image sensing semiconductor package manufacture process, so that no environmental factor of the manufacture process such as humidity and dust particles will affect the sensitivity of the chip or the normal display of the screen, and hence lower the defective rate of the product.

    Method for manufacturing PCB
    25.
    发明授权
    Method for manufacturing PCB 有权
    PCB制造方法

    公开(公告)号：US09299528B2

    公开(公告)日：2016-03-29

    申请号：US13523990

    申请日：2012-06-15

    Applicant: Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

    Inventor： Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

    IPC: H05K3/36 ,  H01J9/24 ,  H05K3/00 ,  H05K3/34

    CPC classification number: H01J9/241 ,  H05K3/0058 ,  H05K3/341 ,  H05K2201/10318 ,  H05K2201/10409 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

    Abstract: A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

    Abstract translation: 公开了一种制造印刷电路板的方法，包括以下步骤。 提供具有与上表面相对的上表面和底表面的基本板。 设置临时设置在基板上的多个电子部件。 提供临时设置在基板的位置上的至少一个定位销，其中电子部件不临时设置在该位置。 同时使用表面贴装技术来连接至少一个定位销和基板上的电子元件。

    Automatic marking method for karaoke vocal accompaniment
    26.
    发明授权
    Automatic marking method for karaoke vocal accompaniment 有权
    卡拉OK声乐伴奏自动标记方式

    公开(公告)号：US08626497B2

    公开(公告)日：2014-01-07

    申请号：US13258875

    申请日：2009-04-07

    Applicant: Wen-Hsin Lin

    Inventor： Wen-Hsin Lin

    IPC: G01L11/04

    CPC classification number: G10H1/361 ,  G10H2210/066 ,  G10H2210/076 ,  G10H2210/091

    Abstract: An automatic marking method for Karaoke vocal accompaniment is provided. In the method, pitch, beat position and volume of a singer are compared with the original pitch, beat position and volume of the theme of a song to generate a score of pitch, a score of beat and a score of emotion respectively, so as to obtain a weighted total score in a weighted marking method. By using the method, the pitch, beat position and volume error of each section of the song sung by the singer can be exactly worked out, and a pitch curve and a volume curve can be displayed, so that the singer can learn which part is sung incorrectly and which part needs to be enhanced. The present invention also has the advantages of dual effects of teaching and entertainment, high practicability and technical advancement.

    Abstract translation: 提供卡拉OK声乐伴奏的自动标记方法。 在方法中，将歌手的音调，节拍位置和音量与歌曲的主题的原始音高，节拍位置和音量进行比较，以分别产生音高，拍子分数和情感分数，以便 以加权标记方法获得加权总分。 通过使用该方法，可以精确地计算出歌手所唱歌曲的每个部分的音高，拍子位置和音量误差，并且可以显示音调曲线和音量曲线，以便歌手可以学习哪一部分是 唱歌不正确，哪一部分需要加强。 本发明还具有教学娱乐双重效果，实用性高，技术进步的优点。

    Process of manufacturing ceramic substrate
    30.
    发明申请
    Process of manufacturing ceramic substrate 审中-公开
    制造陶瓷基板的工艺

    公开(公告)号：US20110120969A1

    公开(公告)日：2011-05-26

    申请号：US12805186

    申请日：2010-07-16

    Applicant: Wen-Hsin Lin

    Inventor： Wen-Hsin Lin

    IPC: H01B13/32

    CPC classification number: H05K3/108 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/24

    Abstract: The present invention relates to a manufacturing process for the ceramics substrate, more particularly attaching a dry membrane to a surface of the metallic layer of the ceramics substrate, and removing the dry membrane from the circuit portion after exposure and development process to expose the metallic layer therein. Furthermore, the conductive metallic layer coated onto the surface of the metallic layer of the circuit, and the etching resistance layer is coated onto the surface of the conductive metallic layer, and further the dry membrane is removed and the conductive metallic layer and the metallic layer are etched. The etchant is blocked by the etching resistance layer to prevent etchant from directly contacting the surface of the conductive metallic layer. Thus, the predetermined width of the circuit will not be reduced and the precision of the circuit size can be upgraded.

    Abstract translation: 本发明涉及一种陶瓷基板的制造方法，特别是将干膜附着到陶瓷基板的金属层的表面，并且在曝光和显影处理之后从电路部分除去干膜，以露出金属层 其中。 此外，涂覆在电路的金属层的表面上的导电金属层和耐蚀刻层涂覆在导电金属层的表面上，并且进一步去除干膜，并且导电金属层和金属层 被刻蚀。 蚀刻剂被抗蚀剂层阻挡，以防止蚀刻剂直接接触导电金属层的表面。 因此，电路的预定宽度不会降低，并且可以提高电路尺寸的精度。

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