Light-emitting device
    22.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号:US08710737B2

    公开(公告)日:2014-04-29

    申请号:US12294850

    申请日:2007-03-28

    IPC分类号: H01J1/62

    摘要: To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

    摘要翻译: 为了提高发光装置发出的光的亮度,发光装置包括具有由光反射面(1r)和底面(1u)构成的开口部(1p)的基体(1) ,安装在开口部(1p)的底面(1u)上的发光芯片(2),覆盖发光芯片(2)的透明部件(3)和光学部件 ),其设置在透明构件(3)上。 在透明构件(3)与开口部(1p)的光反射面(1r)隔开的状态下,透明构件(3)设置在开口部(1p)的底面(1u) )。

    Light emitting device and illumination device
    23.
    发明授权
    Light emitting device and illumination device 有权
    发光装置及照明装置

    公开(公告)号:US08529089B2

    公开(公告)日:2013-09-10

    申请号:US12810769

    申请日:2008-12-26

    IPC分类号: F21S4/00

    摘要: A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

    摘要翻译: 发光装置包括基座,副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上,具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分,设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。