公开(公告)号：US08718810B2

公开(公告)日：2014-05-06

申请号：US13666578

申请日：2012-11-01

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Harry Q. Lee

IPC: G06F19/00

CPC classification number: H01L22/12 ,  B24B37/013 ,  B24B49/12 ,  H01L22/26

Abstract: While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.

Abstract translation: 当抛光衬底时，也照射来自光源的光。 测量从基板的表面反射的光的当前光谱。 在当前光谱中识别具有第一参数值的选定峰。 使用处理器从查找表确定与第一参数相关联的第二参数的值。 根据第二参数的值，改变衬底的抛光。 可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。

公开(公告)号：US20140093987A1

公开(公告)日：2014-04-03

申请号：US13791622

申请日：2013-03-08

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  G01J3/46 ,  G01N21/88

CPC classification number: H01L22/10 ,  G01J3/0218 ,  G01J3/42 ,  G01J3/46 ,  G01N21/88 ,  G01N21/9501 ,  G01N21/95607 ,  H01L22/12

Abstract: Detecting residue of a filler material over a patterned underlying layer includes causing relative motion between a probe of an optical metrology system and a substrate, obtaining a plurality of measured spectra with the optical metrology system through the probe from a plurality of different measurement spots within an area on the substrate, comparing each of the plurality of measured spectra to a reference spectrum to generate a plurality of similarity values, the reference spectrum being a spectrum reflected from the filler material, combining the similarity values to generate a scalar value, and determining the presence of residue based on the scalar value.

Abstract translation: 在图案化的下层上检测填充材料的残留物包括引起光学测量系统的探针与衬底之间的相对运动，通过探针从光学测量系统中获得多个测量光谱，该测量光谱来自多个不同的测量点 将所述多个测量光谱中的每一个与参考光谱进行比较以生成多个相似度值，所述参考光谱是从所述填充材料反射的光谱，组合所述相似度值以生成标量值，并且确定 基于标量值存在残差。

公开(公告)号：US11774235B2

公开(公告)日：2023-10-03

申请号：US16024312

申请日：2018-06-29

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  H01L21/66

CPC classification number: G01B11/06 ,  B24B37/013 ,  B24B49/12 ,  G01B11/0625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.

公开(公告)号：US20190252274A1

公开(公告)日：2019-08-15

申请号：US16397870

申请日：2019-04-29

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/3105 ,  B24B37/013 ,  H01L21/321 ,  B24D7/14 ,  B24B49/12 ,  B24B49/08 ,  B24B37/20 ,  H01L21/306

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

公开(公告)号：US20180071886A1

公开(公告)日：2018-03-15

申请号：US15818366

申请日：2017-11-20

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Benjamin Cherian

IPC: B24B37/013 ,  B24B49/12 ,  H01L21/306 ,  H01L21/66

CPC classification number: B24B37/013 ,  B24B49/12 ,  G01B11/06 ,  G01B11/0625 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.

公开(公告)号：US09886026B2

公开(公告)日：2018-02-06

申请号：US14626147

申请日：2015-02-19

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G05B19/418 ,  B24B37/013 ,  B24B37/04 ,  B24B37/20 ,  B24B49/12

CPC classification number: G05B19/418 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/45232

Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.

公开(公告)号：US09649743B2

公开(公告)日：2017-05-16

申请号：US14995097

申请日：2016-01-13

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee

IPC: B24B37/00 ,  B24B49/12 ,  B24B37/013 ,  B24B37/20 ,  G01N21/25

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/205 ,  G01N21/25

Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.

公开(公告)号：US09372116B2

公开(公告)日：2016-06-21

申请号：US14195519

申请日：2014-03-03

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Jun Qian

IPC: B24B37/013 ,  G01J3/46 ,  B24B37/04 ,  B24B49/12

CPC classification number: G01J3/46 ,  B24B37/013 ,  B24B37/042 ,  B24B49/12

Abstract: A method of generating reference spectra includes polishing a first substrate in a polishing apparatus, measuring a sequence of spectra from the first substrate during polishing with an in-situ optical monitoring system, for each spectrum in the sequence of spectra, determining a best matching reference spectrum from a first plurality of first reference spectra to generate a sequence of reference spectra, calculating a value of a metric of fit of the sequence of spectra to the sequence of reference spectra, comparing the value of the metric of fit to a threshold value and determining whether to generate a second library based on the comparison, and if the second library is determined to be generated, storing the sequence of spectra as a second plurality of reference spectra.

Abstract translation: 产生参考光谱的方法包括抛光抛光装置中的第一衬底，在光谱序列中的每个光谱下，用原位光学监测系统在抛光期间测量来自第一衬底的光谱序列，确定最佳匹配参考 频谱从第一多个第一参考光谱生成参考光谱序列，计算光谱序列的拟合度量与参考光谱序列的值，将拟合度量的值与阈值进行比较，以及 基于所述比较确定是否生成第二库，以及如果确定要生成所述第二库，则将所述光谱序列存储为第二多个参考光谱。

公开(公告)号：US20160101497A1

公开(公告)日：2016-04-14

申请号：US14973044

申请日：2015-12-17

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/005

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US20160018815A1

公开(公告)日：2016-01-21

申请号：US14333395

申请日：2014-07-16

Applicant: Applied Materials, Inc.

Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

IPC: G05B19/418

CPC classification number: G05B19/418 ,  B24B37/013 ,  G05B2219/45031 ,  G05B2219/45232 ,  G05B2219/49085 ,  H01L21/31053 ,  H01L22/12 ,  H01L22/26 ,  Y02P90/02

Abstract: A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

Abstract translation: 控制抛光的方法包括：存储基色谱，所述基色谱是在沉积覆盖在金属层或半导体晶片上的沉积的介电层之后并且在非金属层上沉积多个 沉积介电层。 在沉积非金属层之后并且在非金属层的抛光过程中，从原位光学监测系统接收在抛光期间反射基板的原始光谱序列的测量。 对每个原始光谱进行归一化，以使用原始光谱和基色谱产生归一化光谱序列。 基于归一化光谱序列中的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。