公开(公告)号：US11728185B2

公开(公告)日：2023-08-15

申请号：US17141622

申请日：2021-01-05

Applicant: Applied Materials, Inc.

Inventor： Jianshe Tang ,  Wei Lu ,  Haosheng Wu ,  Taketo Sekine ,  Shou-Sung Chang ,  Hari N. Soundararajan ,  Chad Pollard

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/12 ,  H01L21/306

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B3/08 ,  B08B3/12 ,  B08B5/02 ,  H01L21/02057 ,  H01L21/30625 ,  B08B2203/007 ,  B08B2230/01 ,  H01L21/02074 ,  H01L21/67109

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US11075165B2

公开(公告)日：2021-07-27

申请号：US16516817

申请日：2019-07-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Suketu A Parikh ,  Rong Tao ,  Roey Shaviv ,  Joung Joo Lee ,  Seshadri Ganguli ,  Shirish Pethe ,  David Gage ,  Jianshe Tang ,  Michael A Stolfi

IPC: H01L23/52 ,  H01L23/528 ,  H01L21/67 ,  H01L23/532 ,  H01L21/02 ,  H01L21/321 ,  H01L21/768 ,  H01L23/522

Abstract: Methods and apparatus for creating a dual metal interconnect on a substrate. In some embodiments, a first liner of a first nitride material is deposited into at least one 1× feature and at least one wider than 1× feature, the first liner has a thickness of less than or equal to approximately 12 angstroms; a second liner of a first metal material is deposited into the at least one 1× feature and at least one wider than 1× feature; the first metal material is reflowed such that the at least one 1× feature is filled with the first metal material and the at least one wider than 1× feature remains unfilled with the first metal material; a second metal material is deposited on the first metal material, and the second metal material is reflowed such that the at least one wider than 1× feature is filled with the second metal material.

公开(公告)号：US20210046604A1

公开(公告)日：2021-02-18

申请号：US16989734

申请日：2020-08-10

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  H01L21/321 ,  H01L21/67 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US20210046603A1

公开(公告)日：2021-02-18

申请号：US16831664

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B57/02 ,  B24B49/14

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended over the platen to direct the polishing liquid onto the polishing surface, wherein the source of the heating fluid is coupled to the dispenser and configured to deliver the heating fluid into the polishing liquid to heat the polishing liquid after the polishing liquid leaves the reservoir and before the polishing liquid is dispensed onto the polishing surface.

公开(公告)号：US20200331113A1

公开(公告)日：2020-10-22

申请号：US16849863

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B55/02 ,  B24B37/34

Abstract: A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

公开(公告)号：US10350723B2

公开(公告)日：2019-07-16

申请号：US15703740

申请日：2017-09-13

Applicant: Applied Materials, Inc.

Inventor： Shih-Haur Shen ,  Jianshe Tang ,  Jimin Zhang ,  David Maxwell Gage

IPC: B24B37/013 ,  B24B37/10 ,  B24B37/20 ,  B24B37/22 ,  B24B49/12

Abstract: During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top surface of an underlying dielectric layer of the substrate exposed and determine based on the first signal. An initial value of the second signal at the determined clearance time is determined. An offset is added to the initial value to generate a threshold value, and a polishing endpoint is triggered when the second signal crosses the threshold value.

公开(公告)号：US12290896B2

公开(公告)日：2025-05-06

申请号：US16795103

申请日：2020-02-19

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung Chang ,  Hari Soundararajan ,  Haosheng Wu ,  Jianshe Tang

IPC: B24B37/015

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.

公开(公告)号：US12214468B2

公开(公告)日：2025-02-04

申请号：US16189968

申请日：2018-11-13

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Yen-Chu Yang ,  Jianshe Tang ,  Shou-Sung Chang ,  Shih-Haur Shen ,  Taketo Sekine

IPC: B24B49/14 ,  B24B37/015 ,  B24B37/10 ,  B24B49/02 ,  B24B49/04 ,  B24B55/02 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.

公开(公告)号：US20240408650A1

公开(公告)日：2024-12-12

申请号：US18206367

申请日：2023-06-06

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Sih-Ling Yeh ,  Emily Drauss ,  Elton Zhong ,  Chad Pollard ,  Songling Shin ,  Jianshe Tang ,  Jeonghoon Oh

IPC: B08B3/02 ,  B05B7/24 ,  B08B13/00 ,  B24B57/04

Abstract: A chemical mechanical polishing system includes a first polishing station including a first platen to support a first polishing pad, a transfer station to receive a substrate from a robot, a carrier head movable on a predetermined path from the polishing station to the transfer station, a gas flow regulator having an input for a carrier gas, a liquid flow regulator having an input for a cleaning liquid, and a fluid jet cleaner at a position along the predetermined path. The fluid jet cleaner includes an atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner.

公开(公告)号：US12106976B2

公开(公告)日：2024-10-01

申请号：US18213717

申请日：2023-06-23

Applicant: Applied Materials, Inc.

Inventor： Jianshe Tang ,  Wei Lu ,  Haosheng Wu ,  Taketo Sekine ,  Shou-Sung Chang ,  Hari N. Soundararajan ,  Chad Pollard

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  B08B5/02 ,  H01L21/02 ,  H01L21/306

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B3/08 ,  B08B3/12 ,  B08B5/02 ,  H01L21/02057 ,  H01L21/30625 ,  B08B2203/007 ,  B08B2230/01 ,  H01L21/02074 ,  H01L21/67109

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.