公开(公告)号：US20220148974A1

公开(公告)日：2022-05-12

申请号：US17584051

申请日：2022-01-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN

IPC: H01L23/538 ,  H01L25/10

Abstract: An assembly structure includes a core-computing section and a sub-computing section. The core-computing section has a first surface and a second surface opposite to the first surface. The core-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The sub-computing section has a first surface stacked on the first surface of the core-computing section and a second surface opposite to the first surface. The sub-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The assembly structure includes a first signal transmission path and a second signal transmission path. The first signal transmission path is between the at least one conductive via of the sub-computing section and the at least one conductive via of the core-computing section. The second signal transmission path is between the second surface of the sub-computing section and the at least one conductive via of the sub-computing section.

公开(公告)号：US20210343671A1

公开(公告)日：2021-11-04

申请号：US17374743

申请日：2021-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Han CHEN ,  Hung-Yi LIN

IPC: H01L23/00 ,  H01L25/18 ,  H01L23/538 ,  H01L23/498 ,  G02B6/30

Abstract: A semiconductor package structure includes a first semiconductor die having an active surface and a passive surface opposite to the active surface, a conductive element leveled with the first semiconductor die, a first redistribution layer (RDL) being closer to the passive surface than to the active surface, a second RDL being closer to the active surface than to the passive surface, and a second semiconductor die over the second RDL and electrically coupled to the first semiconductor die through the second RDL. A first conductive path is established among the first RDL, the conductive element, the second RDL, and the active surface of the first semiconductor die.

公开(公告)号：US20210265280A1

公开(公告)日：2021-08-26

申请号：US16798170

申请日：2020-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Chiang SHIH ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu Sheng CHANG ,  Hsiu-Chi LIU ,  Mark GERBER

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L21/56

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

公开(公告)号：US20180337164A1

公开(公告)日：2018-11-22

申请号：US15599379

申请日：2017-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Hua CHEN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG ,  Teck-Chong LEE ,  Shiuan-Yu LIN

IPC: H01L25/16 ,  H01L23/522 ,  H01L23/00 ,  H01L23/532 ,  H01L23/31

Abstract: A semiconductor device package includes a dielectric layer, a first RDL, a second RDL, an inductor, a first electronic component and a second electronic component. The first RDL is adjacent to a first surface of the dielectric layer, and the first RDL includes first conductive pieces. The second RDL is adjacent to a second surface of the dielectric layer, and the second RDL includes second conductive pieces. The inductor is disposed in the dielectric layer. The inductor includes induction pillars, wherein each of the induction pillars is disposed through the dielectric layer, and each of the induction pillars is interconnected between a respective one of the first conductive pieces of the first RDL and a respective one of the second conductive pieces of the second RDL. The first electronic component and the second electronic component are between the first RDL and the second RDL, and electrically connected to each other through the inductor.

公开(公告)号：US20240371711A1

公开(公告)日：2024-11-07

申请号：US18144164

申请日：2023-05-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ting CHEN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/66 ,  H03H9/52 ,  H03H9/64

Abstract: A package structure is provided. The package structure includes an amplifier and a filter structure. The amplifier has an active surface. The filter structure is disposed over the amplifier, and communicates with the amplifier through a first signal path substantially vertical to the active surface of the amplifier.

公开(公告)号：US20240304584A1

公开(公告)日：2024-09-12

申请号：US18119270

申请日：2023-03-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hai-Ming CHEN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG

IPC: H01L23/00 ,  H01L23/538 ,  H10B80/00

CPC classification number: H01L24/20 ,  H01L23/5389 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H10B80/00 ,  H01L24/05 ,  H01L24/19 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/08265 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437

Abstract: A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first electronic component and a second region configured to communicate with an external device. The lower portion of the semiconductor substrate defines a power transmission region

公开(公告)号：US20230420395A1

公开(公告)日：2023-12-28

申请号：US17846649

申请日：2022-06-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Cheng LIN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG ,  Hsu-Chiang SHIH ,  Cheng-Yu HO

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L2223/6677

Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component is configured to receive a radio frequency (RF) signal and amplify a power of the RF signal. The second electronic component is disposed under the first electronic component. The second electronic component includes an interconnection structure passing through the second electronic component. The interconnection structure is configured to provide a path for a transmission of the RF signal.

公开(公告)号：US20230078564A1

公开(公告)日：2023-03-16

申请号：US17990645

申请日：2022-11-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu-Pin TSAI

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/50

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

公开(公告)号：US20230065615A1

公开(公告)日：2023-03-02

申请号：US17460057

申请日：2021-08-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN

IPC: H01L23/498 ,  H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/522

Abstract: An electronic device includes a first electronic component, an encapsulant and a second electronic component. The encapsulant encapsulates the first electronic component. The second electronic component is disposed over the first electronic component and separated from the encapsulant. The second electronic component is configured to receive a power from the first electronic component.

公开(公告)号：US20220384308A1

公开(公告)日：2022-12-01

申请号：US17334564

申请日：2021-05-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiao-Yen LEE ,  Hung-Yi LIN

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/522 ,  H01L23/00 ,  H01L25/10 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package structure includes a first electronic component, a conductive element and a first redistribution structure. The first electronic component has a first surface and a second surface opposite to the first surface, and includes a first conductive via. The first conductive via has a first surface exposed from the first surface of the first electronic component. The conductive element is disposed adjacent to the first electronic component. The conductive element has a first surface substantially coplanar with the first surface of the first conductive via of the first electronic component. The first redistribution structure is configured to electrically connect the first conductive via of the first electronic component and the conductive element.