公开(公告)号：US20110079245A1

公开(公告)日：2011-04-07

申请号：US12573500

申请日：2009-10-05

申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

IPC分类号： B08B7/00 ,  B08B1/04

CPC分类号： B08B1/04

摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

公开(公告)号：US07746485B2

公开(公告)日：2010-06-29

申请号：US12253160

申请日：2008-10-16

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： G01B11/28

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US20100120333A1

公开(公告)日：2010-05-13

申请号：US12610979

申请日：2009-11-02

申请人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/04 ,  H01L21/304 ,  H01L21/66 ,  B24B49/10

CPC分类号： B24B37/013 ,  B24B49/02 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.

摘要翻译： 描述形成裸硅衬底的方法。 测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。 由信号指示的信号或厚度被传送到控制器。 确定根据由信号指示的信号或厚度的调整的抛光参数。 在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。

公开(公告)号：US07657342B2

公开(公告)日：2010-02-02

申请号：US12185719

申请日：2008-08-04

申请人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： G06F19/00 ,  H01L21/00 ,  B24B49/00

摘要： A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

公开(公告)号：US20070158207A1

公开(公告)日：2007-07-12

申请号：US11326647

申请日：2006-01-06

申请人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

发明人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  B24B53/017 ,  C25F1/00 ,  C25F3/02

摘要： A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.

摘要翻译： 提供了一种用于电化学处理衬底的方法。 在一个实施例中，该方法包括在具有多个处理单元的处理垫上执行调节程序，通过向经调节的处理垫施加电压来激励处理单元，将其上布置有至少一个导电层的基板放置在通电 并且在通电的处理单元中去除导电层的至少一部分。 在另一个实施例中，用于抛光衬底的方法包括将具有多个处理单元的未使用的导电焊盘放置在处理系统的压板上，在压板上的焊盘中断开， 在衬垫中，将具有至少其上设置有导电层的衬底放置在通电焊盘上，以及去除通电电池中的至少一部分导电层。

公开(公告)号：US09862070B2

公开(公告)日：2018-01-09

申请号：US13459071

申请日：2012-04-27

申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

IPC分类号： B24B49/00 ,  B24B37/013 ,  B24B49/16

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

公开(公告)号：US20130288577A1

公开(公告)日：2013-10-31

申请号：US13459075

申请日：2012-04-27

申请人： Hung Chen ,  Lakshmanan Karuppiah

发明人： Hung Chen ,  Lakshmanan Karuppiah

IPC分类号： B24B47/10 ,  B24B1/00 ,  B24B37/32

CPC分类号： B24B37/32 ,  B24B47/10

摘要： In some aspects, a chemical mechanical polishing (CMP) apparatus is provided that includes a polishing head having (a) a rotatable spindle; (b) a membrane coupled to the rotatable spindle and adapted to press a substrate against a polishing pad during polishing of the substrate; and (c) a retaining ring rotatable coupled to the spindle and adapted to surround a substrate being pressed against a polishing pad during polishing and to limit lateral movement of the substrate relative to the polishing head. The CMP apparatus also includes a drive mechanism coupled to the retaining ring and adapted to drive the retaining ring at a different rate of rotation than the spindle during polishing. Numerous other aspects are provided.

摘要翻译： 在一些方面，提供了一种化学机械抛光（CMP）装置，其包括具有（a）可旋转主轴的抛光头; （b）膜，其耦合到所述可旋转心轴并适于在衬底的抛光期间将衬底压靠在抛光垫上; 和（c）保持环，其可旋转地联接到所述心轴并且适于围绕在抛光期间被压靠在抛光垫上的衬底并且限制所述衬底相对于所述抛光头的横向运动。 CMP设备还包括联接到保持环的驱动机构，并且适于在抛光期间以与主轴不同的旋转速度驱动保持环。 提供了许多其他方面。

公开(公告)号：US08210900B2

公开(公告)日：2012-07-03

申请号：US12263237

申请日：2008-10-31

申请人： Wen-Chiang Tu ,  You Wang ,  Yuchun Wang ,  Lakshmanan Karuppiah

发明人： Wen-Chiang Tu ,  You Wang ,  Yuchun Wang ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A method and apparatus for polishing or planarizing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a polishing pad assembly, delivering a polishing slurry to a surface of the polishing pad assembly, polishing the substrate with the surface of the polishing pad assembly, monitoring the removal rate of material from a plurality of regions on the surface of the substrate, determining whether the plurality of regions on the surface of the substrate are polishing uniformly, and selectively delivering a polishing slurry additive to at least one region of the plurality of regions to obtain a uniform removal rate of material from the plurality of regions on the surface of the substrate, wherein the removal rate of material from the at least one region is different than at least one other region of the plurality of regions.

摘要翻译： 一种用于通过化学机械抛光工艺抛光或平面化基板的方法和装置。 在一个实施例中，提供了一种处理半导体衬底的方法。 该方法包括将衬底定位在包括抛光垫组件的抛光设备上，将抛光浆料输送到抛光垫组件的表面，用抛光垫组件的表面抛光衬底，监测来自多个部件的材料的去除速率 在基板表面上确定基板表面上的多个区域是否均匀抛光，并且将抛光浆料添加剂选择性地输送到多个区域中的至少一个区域以获得均匀的材料去除速率 从所述衬底表面上的多个区域中去除所述至少一个区域的材料的去除速率不同于所述多个区域中的至少一个其它区域。

公开(公告)号：US07840375B2

公开(公告)日：2010-11-23

申请号：US12059435

申请日：2008-03-31

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

IPC分类号： G01B5/00 ,  G06F19/00

CPC分类号： G01N21/31 ,  G01N21/253 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67766

摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.

摘要翻译： 描述了从用于处理产品晶片的参考基板产生库的方法。 该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联 。

公开(公告)号：US07520968B2

公开(公告)日：2009-04-21

申请号：US11243488

申请日：2005-10-04

申请人： Rashid A. Mavliev ,  Lakshmanan Karuppiah

发明人： Rashid A. Mavliev ,  Lakshmanan Karuppiah

IPC分类号： C25B9/00

CPC分类号： B24B37/22 ,  B23H5/08 ,  B24B37/046 ,  B24B37/245 ,  H01L21/32125

摘要： An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.

摘要翻译： 公开了一种用于在基板上进行电化学处理的导电抛光垫组件的制造和翻新的装置和方法。 导电抛光垫组件使用接触表面作为基底形成，其被涂覆有金属涂层以产生导电接触表面。 在一个实施例中，金属涂层是喷涂在接触表​​面上的高纯度锡/锌合金。 接触表面含有磨料颗粒，同时金属涂层至少提供导电性质的接触表面。