公开(公告)号：US09679801B2

公开(公告)日：2017-06-13

申请号：US14730171

申请日：2015-06-03

Applicant: Apple Inc.

Inventor： Kwan-Yu Lai ,  Jun Zhai ,  Kunzhong Hu ,  Flynn P. Carson

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/768 ,  H01L25/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L21/768 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106

Abstract: Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a first redistribution layer (RDL) and a second RDL, and a second level die is mounted on a top side of the first redistribution layer. In an embodiment, the first level die is an active die, less than 50 μm thick.

公开(公告)号：US20170135219A1

公开(公告)日：2017-05-11

申请号：US14935292

申请日：2015-11-06

Applicant: Apple Inc.

Inventor： Jun Chung Hsu ,  Flynn P. Carson ,  Kwan-Yu Lai

IPC: H05K3/00 ,  H05K1/11

CPC classification number: H01L21/568 ,  H01L21/4857 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4682 ,  Y10T29/49156 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81

Abstract: Method of forming ultra thin coreless substrates are described. In an embodiment, the method utilizes a debond layer including high and low adhesion surface areas to the carrier substrate, and cutting through the low adhesion surface areas to remove a build-up structure from the carrier substrate. An electrical short layer may be formed as a part of or on the debond layer to facilitate electrical testing of the build-up structure prior to debonding, and aid in the formation a “known good” substrate on a support substrate.

公开(公告)号：US20160371529A1

公开(公告)日：2016-12-22

申请号：US14741831

申请日：2015-06-17

Applicant: Apple Inc.

Inventor： Milind S. Bhagavat ,  Patrick E. O'Brien ,  Jun Zhai ,  Dale R. Setlak ,  David D. Coons ,  Kwan-Yu Lai

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: A finger biometric sensor assembly may include a finger biometric sensor integrated circuit (IC) die having a finger sensing area and a cover layer aligned with the finger sensing area. The finger biometric sensor may also include a direct bonding interface between the finger biometric sensor and the cover layer.

Abstract translation: 手指生物测定传感器组件可以包括具有手指感测区域和与手指感测区域对准的覆盖层的手指生物测定传感器集成电路（IC）裸片。 手指生物测定传感器还可以包括手指生物测定传感器和覆盖层之间的直接接合界面。