公开(公告)号：US20220076979A1

公开(公告)日：2022-03-10

申请号：US17016030

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Thomas BREZOCZKY

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  B65G47/92

Abstract: A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

公开(公告)号：US20220076978A1

公开(公告)日：2022-03-10

申请号：US17016010

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU ,  Srinivasa Rao YEDLA

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  B65G47/92

Abstract: In one example, a substrate support for a processing chamber comprises a plurality of pins and a plurality of alignment elements. The plurality of pins are configured to mate with terminals of an electrostatic chuck. The plurality of pins are configured to be coupled to one or more power sources. The plurality of alignment elements are configured to interface with a plurality of centering elements of the electrostatic chuck to center the electrostatic chuck with the substrate support. Each of the plurality of alignment elements is configured to interface with a slot of a corresponding one of the plurality of centering elements.

公开(公告)号：US20220028712A1

公开(公告)日：2022-01-27

申请号：US16939629

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA

IPC: H01L21/67 ,  H01L21/66

Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

公开(公告)号：US20240153800A1

公开(公告)日：2024-05-09

申请号：US18141920

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/677

CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20240150888A1

公开(公告)日：2024-05-09

申请号：US18141923

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: C23C14/56 ,  C23C14/35 ,  H01F7/20 ,  H01J37/32 ,  H01L21/677

CPC classification number: C23C14/568 ,  C23C14/35 ,  H01F7/206 ,  H01J37/32733 ,  H01L21/677 ,  H01L21/67748 ,  H01L21/68742

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20230323536A1

公开(公告)日：2023-10-12

申请号：US18333361

申请日：2023-06-12

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Ganesh SUBBUSWAMY ,  Devi Raghavee VEERAPPAN ,  Thomas BREZOCZKY

IPC: C23C16/455 ,  C23C14/22 ,  C23C14/34

CPC classification number: C23C16/45574 ,  C23C16/45544 ,  C23C14/34 ,  C23C14/228

Abstract: Aspects of the present disclosure provide systems and apparatuses for a substrate processing assembly with a laminar flow cavity gas injection for high and low pressure. A dual gas reservoir assembly is provided in a substrate processing chamber, positioned within a lower shield assembly. A first gas reservoir is in fluid communication with a processing volume of the substrate processing assembly via a plurality of gas inlet, positioned circumferentially about the processing volume. A second gas reservoir is positioned circumferentially about the first gas reservoir, coupled therewith via one or more reservoir ports. The second gas reservoir is in fluid communication with a first gas source. A recursive path gas assembly is positioned in an upper shield body adjacent to an electrode to provide one or more gases to a dark space gap.

公开(公告)号：US20230238267A1

公开(公告)日：2023-07-27

申请号：US17584503

申请日：2022-01-26

Applicant: Applied Materials, Inc.

Inventor： Ramesh GOPALAN ,  Robert Toshiharu HIRAHARA ,  Stanley WU ,  Michael Prestoza DECENA ,  Wendell BOYD ,  Siamak SALIMIAN ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/304

CPC classification number: H01L21/6833 ,  H01L21/68757 ,  H01L21/304

Abstract: Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an electrostatic chuck assembly may comprise placing the electrostatic chuck assembly in a first planarizing apparatus, altering an upper ceramic surface of the electrostatic chuck assembly, and halting the altering of the upper ceramic surface of the electrostatic chuck assembly when an Sa parameter is less than approximately 0.1 microns, an Sdr parameter is less than approximately 2.5 percent, an Sz parameter is less than approximately 10 microns for any given area of approximately 10 mm2 of the upper ceramic surface, or a pit-porosity depth parameter of greater than 1 micron is less than approximately 0.1 percent of area of the upper ceramic surface.

公开(公告)号：US20230212735A1

公开(公告)日：2023-07-06

申请号：US17928709

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Nagabhushana NANJUNDAPPA ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY ,  Bhaskar PRASAD

IPC: C23C14/54 ,  H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  C23C14/35

CPC classification number: C23C14/541 ,  H01J37/32724 ,  H01J37/3244 ,  H01J37/32816 ,  C23C14/345 ,  C23C14/50 ,  C23C14/568 ,  C23C14/35 ,  H01J2237/002 ,  H01J2237/20235 ,  H01J2237/334 ,  H01J2237/2005 ,  H01J2237/20278 ,  H01J2237/2007 ,  H01J37/32899 ,  H01J37/32733

Abstract: Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

公开(公告)号：US20220406640A1

公开(公告)日：2022-12-22

申请号：US17354441

申请日：2021-06-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Nitin Bharadwaj SATYAVOLU

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/677

Abstract: A method and apparatus for aligning components within a processing module are described herein. The components include a substrate transfer device, a plurality of support chuck assemblies, and adjustable bushings disposed in the processing module. The substrate transfer device includes support arms with heads configured to passively correct the location of a substrate therein. The orientation of each of the support arms of the substrate transfer device is adjusted to align with each of the support chuck assemblies. The location of a process station is then adjusted to align with one of the support chuck assemblies by calibrating the adjustable bushings which correspond to each process station.

公开(公告)号：US20220336258A1

公开(公告)日：2022-10-20

申请号：US17233213

申请日：2021-04-16

Applicant: Applied Materials, Inc.

Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU

IPC: H01L21/687

Abstract: Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.