Abstract:
A foldable bed includes a plurality of connecting bars, a plurality of support bars, and a plurality of stand units. Each of the stand units includes two pivotally connected support legs each having a first end provided with an upper support portion, a second end provided with a lower support portion, and a middle section provided with a pivot portion. Each of the stand units further includes two clamping brackets each mounted on the respective support leg, and two vibration absorbers each mounted in the respective clamping bracket. Thus, when the two support legs are expanded, each of the vibration absorbers on one of the support legs abuts the pivot portion of the other one of the support legs so that the support legs are combined solidly and stably so as to enhance the structural strength of each of the stand units.
Abstract:
Methods and apparatus to support the execution of a managed application that is linked to a native library or application are disclosed. The disclosed methods and apparatus support a virtual machine that is associated with the same ISA as the executing platform, while the ISA of the native library or application is of a different ISA. The disclosed methods and apparatus also support the execution of a managed application that is linked with several native libraries or applications that are associated with several different ISAs respectively.
Abstract:
Methods and apparatus to support the execution of a managed application that is linked to a native library or application are disclosed. The disclosed methods and apparatus support a virtual machine that is associated with the same ISA as the executing platform, while the ISA of the native library or application is of a different ISA. The disclosed methods and apparatus also support the execution of a managed application that is linked with several native libraries or applications that are associated with several different ISAs respectively.
Abstract:
Disclosed is an apparatus and method for storing and searching computer node addresses in a computer network system. In one embodiment, the apparatus comprises a frame forwarding device such as a switch. The switch includes two MAC address tables including a primary MAC address table and secondary MAC address table both for storing and searching MAC addresses. The primary table stores records that contain compressed values of MAC addresses. The records are contained in storage locations that are referenced using the compressed value of the MAC address as a search index. In order to account for searching collisions that may result from different MAC addresses compressing to the same value, each record in the primary address table is linked to a chain of records in the secondary table. The records in the secondary table store the full value of the MAC address. Each chain of records in the secondary address table contains MAC addresses the present invention.
Abstract:
A microcontroller circuit provides proper clocks to a central processing unit of a microcontroller and peripherals according to a power saving mode and operating conditions of the peripherals. The microcontroller circuit comprises a prescaler, a second multiplexer, a central processing unit, a first switch, a second switch, a first peripheral, and an execution unit. The execution unit is installed in the central processing unit and used for controlling the first switch and the second switch. The switches control the transmission of clocks according to the power saving mode operated by the microcontroller circuit, so that the central processing unit and each peripheral can work with a proper clock to reduce power use.
Abstract:
A new method to form an integrated circuit device is achieved. The method comprises providing a substrate. A sacrificial layer is formed overlying the substrate. The sacrificial layer is patterned to form temporary vertical spacers where conductive bonding locations are planned. A conductive layer is deposited overlying the temporary vertical spacers and the substrate. The conductive layer is patterned to form conductive bonding locations overlying the temporary vertical spacers. The temporary vertical spacers are etched away to create voids underlying the conductive bonding locations.
Abstract:
A method for actively detecting link failures on a high availability backplane architecture. The backplane system includes redundant node boards operatively communicating with redundant switch fabric boards. Uplink ports of the node boards are logically grouped into trunk ports at one end of the communication link with the switch fabric boards. A probe packet is sent, and a probing timer is set whenever either a specified number of bad packets are received, or an idle timer expires. If a response to the probe packet is received before the probe timer expires then the link is deemed valid, otherwise the link is presumed to have failed. Preferably, either the node boards or the switch fabric boards are configured to properly handle a probe pack, which preferably has identical source and destination addresses.
Abstract:
Methods and apparatus to support the execution of a managed application that is linked to a native library or application are disclosed. The disclosed methods and apparatus support a virtual machine that is associated with the same ISA as the executing platform, while the ISA of the native library or application is of a different ISA. The disclosed methods and apparatus also support the execution of a managed application that is linked with several native libraries or applications that are associated with several different ISAs respectively.
Abstract:
Methods and apparatus to support the execution of a managed application that is linked to a native library or application are disclosed. The disclosed methods and apparatus support a virtual machine that is associated with the same ISA as the executing platform, while the ISA of the native library or application is of a different ISA. The disclosed methods and apparatus also support the execution of a managed application that is linked with several native libraries or applications that are associated with several different ISAs respectively.
Abstract:
A thermally compliant multi-layer wiring structure on a semiconductor chip is described. The multi-layer wiring structure incorporates an “empty” or air gap under the interconnect wiring and does not allow any thermally induced strains to be transmitted to the interconnecting solder balls. This design is to be used in chip scale packaging applications where printed circuit technology is used as the next level of package.