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56 条记录 (耗时 0.022 秒)

    LED package for backlight unit
    21.
    发明授权
    LED package for backlight unit 有权
    背光单元的LED封装

    公开(公告)号：US07156538B2

    公开(公告)日：2007-01-02

    申请号：US10953787

    申请日：2004-09-30

    申请人： Kyung Taeg Han ,  Chan Wang Park ,  Seon Goo Lee

    发明人： Kyung Taeg Han ,  Chan Wang Park ,  Seon Goo Lee

    IPC分类号： F21V21/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.

    摘要翻译： 这里公开了一种用于背光单元的LED封装。 LED封装包括多个LED，芯片接合部，引线接合部和主体。 多个LED布置在其上的裸片接合部分允许LED的第一电极电连接到外部电路。 引线接合部与芯片接合部隔开预定距离，以与芯片接合部绝缘，并且允许LED的第二电极电连接到外部电路，使得LED被操作。 本体具有用于以透明树脂填充LED上方的空间的模制杯和芯片接合部分和引线接合部分布置在其上的基座。

    Chip coated light emitting diode package and manufacturing method thereof
    22.
    发明授权
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US08013352B2

    公开(公告)日：2011-09-06

    申请号：US12684614

    申请日：2010-01-08

    申请人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    发明人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    摘要翻译： 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    Light emitting diode package with diffuser and method of manufacturing the same
    23.
    发明授权
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US07501656B2

    公开(公告)日：2009-03-10

    申请号：US11491947

    申请日：2006-07-25

    申请人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    发明人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

    High power LED housing and fabrication method thereof
    28.
    发明授权
    High power LED housing and fabrication method thereof 有权
    大功率LED外壳及其制造方法

    公开(公告)号：US07846752B2

    公开(公告)日：2010-12-07

    申请号：US12259696

    申请日：2008-10-28

    申请人： Chang Wook Kim ,  Seon Goo Lee

    发明人： Chang Wook Kim ,  Seon Goo Lee

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

    摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

    摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

    HIGH POWER LED HOUSING AND FABRICATION METHOD THEREOF
    29.
    发明申请
    HIGH POWER LED HOUSING AND FABRICATION METHOD THEREOF 有权
    高功率LED外壳及其制造方法

    公开(公告)号：US20090053839A1

    公开(公告)日：2009-02-26

    申请号：US12259696

    申请日：2008-10-28

    申请人： Chang Wook KIM ,  Seon Goo Lee

    发明人： Chang Wook KIM ,  Seon Goo Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

    摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

    摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

    High power light emitting diode package
    30.
    再颁专利
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：USRE45596E1

    公开(公告)日：2015-06-30

    申请号：US13294405

    申请日：2011-11-11

    申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

    发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

    IPC分类号： H01L29/22 ,  H01L23/48 ,  H01L33/62 ,  H01L33/60

    CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。