公开(公告)号：US20110023003A1

公开(公告)日：2011-01-27

申请号：US12893870

申请日：2010-09-29

申请人： Ke-Ying Su ,  Chia-Ming Ho ,  Gwan Sin Chang ,  Chien-Wen Chen

发明人： Ke-Ying Su ,  Chia-Ming Ho ,  Gwan Sin Chang ,  Chien-Wen Chen

IPC分类号： G06F17/50

CPC分类号： G01R31/2853 ,  G01R31/2884 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

摘要翻译： 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤，其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

公开(公告)号：US07818698B2

公开(公告)日：2010-10-19

申请号：US11865304

申请日：2007-10-01

申请人： Ke-Ying Su ,  Chia-Ming Ho ,  Gwan Sin Chang ,  Chien-Wen Chen

发明人： Ke-Ying Su ,  Chia-Ming Ho ,  Gwan Sin Chang ,  Chien-Wen Chen

IPC分类号： G06F17/50

CPC分类号： G01R31/2853 ,  G01R31/2884 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

摘要翻译： 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤，其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

公开(公告)号：US20080161554A1

公开(公告)日：2008-07-03

申请号：US11646589

申请日：2006-12-28

申请人： Shenghong A. Dai ,  Chih-Chia Cheng ,  Chien-Wen Chen ,  Chih-Hung Chen

发明人： Shenghong A. Dai ,  Chih-Chia Cheng ,  Chien-Wen Chen ,  Chih-Hung Chen

IPC分类号： C07D273/00 ,  C07D267/22

CPC分类号： C08G18/4825 ,  C08G18/10 ,  C08G18/7621 ,  C08G18/797 ,  C08G18/025

摘要： Disclosed are a macrocyclic carbodiimide (MC-CDI) and a process for synthesizing the same through condensation of a molecule with multiple-isocyanate terminal functional groups under high dilution in the presence of a phospholene catalyst such as phospholene or arsenic catalyst. Also disclosed are MC-CDI derivatives, such as MC-urea (MC-U), MC-acylurea (MC-ACU), acid functionalized MC-ACU, and anhydride functionalized MC-ACU, processes for synthesizing the same, and the applications of such derivatives as hydrolysis stabilizers in organic polymeric materials, such as polyurethane (PU) and polyesters, as well as the applications in the syntheses of the amide- and imide-modified polyurethane by ring-opening reaction of the MC-ACU.

摘要翻译： 公开了一种大环碳二亚胺（MC-CDI）及其通过在磷酸催化剂如磷酰或砷催化剂存在下在高稀释度下通过分子与多异氰酸酯末端官能团的缩合来合成它的方法。 还公开了MC-CDI衍生物，例如MC-脲（MC-U），MC-酰基脲（MC-ACU），酸官能化的MC-ACU和酸酐官能化的MC-ACU，其合成方法和应用 的有机聚合材料如聚氨酯（PU）和聚酯中的水解稳定剂的衍生物，以及通过MC-ACU的开环反应合成酰胺和酰亚胺改性的聚氨酯的应用。

公开(公告)号：US20060188824A1

公开(公告)日：2006-08-24

申请号：US11320513

申请日：2005-12-27

申请人： Harry Chuang ,  Kong-Beng Thei ,  Chih-Tsung Yao ,  Heng-Kai Liu ,  Ming-Jer Chiu ,  Chien-Wen Chen

发明人： Harry Chuang ,  Kong-Beng Thei ,  Chih-Tsung Yao ,  Heng-Kai Liu ,  Ming-Jer Chiu ,  Chien-Wen Chen

IPC分类号： G03F7/00

CPC分类号： H01L23/481 ,  G03F1/144 ,  G03F1/36 ,  H01L21/31144 ,  H01L21/76807 ,  H01L21/76816 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.

摘要翻译： 提供一种形成具有矩形图案的光掩模的方法和使用该光掩模形成半导体结构的方法。 用于形成光掩模的方法包括确定最小间距并识别具有小于最小间隔值的间隔的垂直导电特征图案。 该方法还包括确定第一扩展方向和缩小第二方向，并且检查设计规则，以查看所标识的每个垂直导电特征图案是否违反了设计规则。 如果没有违反设计的规则，则所确定的垂直导电特征图案被替换为具有矩形形状的经修改的垂直导电特征图案。 然后形成照相掩模。 可以使用光掩膜形成半导体结构。

公开(公告)号：US06855967B2

公开(公告)日：2005-02-15

申请号：US10283892

申请日：2002-10-30

申请人： Louis Chao-Chiuan Liu ,  Chien-Wen Chen

发明人： Louis Chao-Chiuan Liu ,  Chien-Wen Chen

IPC分类号： H01L23/528 ,  H01L27/10 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/5286 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and a method for forming buffer cells in power line areas between macro cell in a macro block area. In a power line level, a pin is formed between VSS and VDD lines. The pin is connected to the buffer cell. Next a signal line layer is formed and the signal line is connected to the pin and to a driver. In a first embodiment the driver is formed in a standard cell area. In a second embodiment, the driver is formed in a macro cell. A signal line is connected to the pin and the driver.

摘要翻译： 用于在宏块区域中的宏小区之间的电力线区域中形成缓冲单元的结构和方法。 在电源线电平上，在VSS和VDD线之间形成一个引脚。 引脚连接到缓冲单元。 接下来，形成信号线层，信号线连接到引脚和驱动器。 在第一实施例中，驱动器形成在标准单元区域中。 在第二实施例中，驱动器形成在宏小区中。 信号线连接到引脚和驱动器。

公开(公告)号：US08543333B2

公开(公告)日：2013-09-24

申请号：US13039314

申请日：2011-03-03

申请人： Po-Yen Lee ,  Chien-Wen Chen ,  Pai-Chang Yeh ,  Li-Wen Lian

发明人： Po-Yen Lee ,  Chien-Wen Chen ,  Pai-Chang Yeh ,  Li-Wen Lian

IPC分类号： G01C21/00 ,  G08G1/123

CPC分类号： G06F3/04842 ,  G01C21/00 ,  G01C21/3682 ,  G09B29/007

摘要： A method, a system, an apparatus, and a computer-readable medium for browsing spot information, adapted to an electronic device, are provided. In the present method, a plurality of spot information are retrieved, in which each of the spot information at least comprises a picture and a location of a spot. Next, an electronic map is displayed and a spot marker is marked at the spot location of each spot information on the electronic map. Meanwhile, a spot browsing bar is displayed on a side of the electronic map and the spot pictures of the spot information are sequentially displayed in the spot browsing bar. When a select operation of a certain spot marker on the electronic map is received, the spot browsing bar is scrolled to show the spot picture corresponding to the selected spot marker.

摘要翻译： 提供了适用于电子设备的用于浏览点信息的方法，系统，装置和计算机可读介质。 在本方法中，检索多个点信息，其中每个点信息至少包括图片和点的位置。 接下来，显示电子地图，并且在电子地图上的每个点信息的点位置处标记点标记。 同时，在电子地图的一侧显示现场浏览栏，并且在点浏览栏中顺序地显示点信息的照片。 当接收到电子地图上的特定点标记的选择操作时，滚动显示浏览栏以显示与所选择的点标记对应的点图。

公开(公告)号：US08518722B2

公开(公告)日：2013-08-27

申请号：US13064161

申请日：2011-03-09

申请人： Chien-Wen Chen ,  Chia-Jen Kao ,  Jui-Cheng Chuang

发明人： Chien-Wen Chen ,  Chia-Jen Kao ,  Jui-Cheng Chuang

IPC分类号： H01L21/66

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L22/12 ,  H01L23/055 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure.

摘要翻译： 提供了一种用于检测倒装芯片球栅阵列封装结构的欠补充空隙的方法，其包括在其中提供具有互连结构的衬底和多个中介层; 提供具有活性表面和背面的芯片，以及在芯片的有源表面上的多个第一连接元件; 将所述芯片的有源表面安装并电连接在所述基板上; 执行至少一次IR回流以将所述多个第一连接元件固定在所述基板上; 填充封装材料以覆盖所述芯片的有效表面和所述多个第一连接元件; 执行检测处理以检测在所述芯片的有效表面和所述多个第一元件之间不形成所述空隙; 以及在所述基板的背面上形成多个第二连接元件以获得倒装芯片球栅阵列封装结构。

公开(公告)号：US08214784B2

公开(公告)日：2012-07-03

申请号：US12893870

申请日：2010-09-29

申请人： Ke-Ying Su ,  Chia-Ming Ho ,  Gwan Sin Chang ,  Chien-Wen Chen

发明人： Ke-Ying Su ,  Chia-Ming Ho ,  Gwan Sin Chang ,  Chien-Wen Chen

IPC分类号： G06F17/50

CPC分类号： G01R31/2853 ,  G01R31/2884 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.

摘要翻译： 提供了一种用于提取集成电路中的寄生接触/通孔电容的系统和方法。 使用该系统的寄生提取可以通过考虑实际的接触/通孔形状和尺寸变化而提高接触/通过寄生电容提取的精度。 各种实施例的共同特征包括生成技术文件的步骤，其中电容表中的接触/通孔电容从有效接触/通孔宽度表导出。 有效接触/通孔宽度表的每个元件被校准以具有与IC中发生的实际接触/通孔配置的寄生电容匹配的寄生电容。

公开(公告)号：US20110258329A1

公开(公告)日：2011-10-20

申请号：US13087378

申请日：2011-04-15

申请人： Po-Yen Lee ,  Chien-Wen Chen ,  Pai-Chang Yeh ,  Li-Wen Lian

发明人： Po-Yen Lee ,  Chien-Wen Chen ,  Pai-Chang Yeh ,  Li-Wen Lian

IPC分类号： G06F15/16

CPC分类号： G06F21/41 ,  G06Q10/10 ,  H04L63/0815 ,  H04L67/02 ,  H04L67/125 ,  H04L69/14 ,  H04W12/06 ,  H04W56/001 ,  H04W76/15

摘要： A method and a system for providing online services corresponding to multiple mobile devices, a server, a mobile device, and a computer program product are provided. The server provides a service website. In the present method, a login request of a user account of the service website is received from a terminal device. A first connection with a first mobile device of the user account is established, and a first device data of the first mobile device is obtained. A second connection with a second mobile device of the user account is established while maintaining the first connection, and a second device data of the second mobile device is obtained. A first online service corresponding to the first mobile device and a second online service corresponding to the second mobile device are provided on the service website according to the first device data and the second device data.

摘要翻译： 提供了一种用于提供与多个移动设备，服务器，移动设备和计算机程序产品相对应的在线服务的方法和系统。 服务器提供服务网站。 在本方法中，从终端装置接收到服务网站的用户账号的登录请求。 建立与用户帐户的第一移动设备的第一连接，并获得第一移动设备的第一设备数据。 在保持第一连接的同时建立与用户帐户的第二移动设备的第二连接，并且获得第二移动设备的第二设备数据。 根据第一设备数据和第二设备数据，在服务网站上提供对应于第一移动设备的第一在线服务和对应于第二移动设备的第二在线服务。

公开(公告)号：US20110258160A1

公开(公告)日：2011-10-20

申请号：US13086124

申请日：2011-04-13

申请人： Po-Yen LEE ,  Pai-Chang Yeh ,  Chien-Wen Chen ,  Li-Wen Lian

发明人： Po-Yen LEE ,  Pai-Chang Yeh ,  Chien-Wen Chen ,  Li-Wen Lian

IPC分类号： G06F7/00

CPC分类号： G06Q10/00 ,  H04L29/12132 ,  H04L29/12198 ,  H04L61/1552 ,  H04L61/1594 ,  H04L67/1095

摘要： A data synchronization method for synchronizing data in a communication system including an account server including a first data record of an account, a mobile device including a second data record, and a data server including a third data record is disclosed. The mobile device is connected to the account server and the data server. First, a first synchronization procedure is performed to synchronize data between the first data record of the account server and the second data record of the mobile device according to a first identification data. After the first synchronization procedure has been completed, a second synchronization procedure is performed to synchronize data between the synchronized second data record of the mobile device and the third data record of the data server according to the first identification data and a second identification data.

摘要翻译： 公开了一种数据同步方法，用于在包括帐户服务器的通信系统中同步数据，所述帐户服务器包括帐户的第一数据记录，包括第二数据记录的移动设备和包括第三数据记录的数据服务器。 移动设备连接到帐户服务器和数据服务器。 首先，执行第一同步过程，以根据第一识别数据来同步帐户服务器的第一数据记录和移动设备的第二数据记录之间的数据。 在完成第一同步过程之后，执行第二同步过程，以根据第一识别数据和第二识别数据来同步移动设备的同步的第二数据记录与数据服务器的第三数据记录之间的数据。