摘要:
A setting tool for driving a fastening element in a constructional component includes a housing (11), a drive member (13) displaceable in a guide (12) located in the housing, a bolt guide (15) adjoining the drive member guide (12) in direction of the operational axis (A) and forming a dog point (16) for abutting the constructional component and a drive-in depth setting tool (20) for displacing the bolt guide (15) axially relative to the drive member guide (15) for setting a distance between a drive end (14) of the drive member (13) and the dog point (16) in the initial position of the drive member.
摘要:
A drive-in tool (10) for driving in fastening elements (60) includes a driving ram (13) which is displaceably supported in a guide (12), a drive unit (30 for the driving ram (13) and having at least one drive flywheel (32) which is set in rotation by an electric motor (31), and a return device (70) for displacing the driving ram (13) its initial position (22) after the completion of the drive-in process and having a return motor (71) connected with the driving ram (13) by a return mechanism.
摘要:
A method of producing a semiconductor chip includes providing a silicon growth substrate, producing a III nitride buffer layer on the growth substrate by sputtering, and growing a III nitride semiconductor layer sequence having an active layer above the buffer layer.
摘要:
A setting tool for driving a fastening element in a constructional component includes a housing (11), a drive member (13) displaceable in a guide (12) located in the housing, a bolt guide (15) adjoining the drive member guide (12) in direction of the operational axis (A) and forming a dog point (16) for abutting the constructional component and a drive-in depth setting tool (20) for displacing the bolt guide (15) axially relative to the drive member guide (15) for setting a distance between a drive end (14) of the drive member (13) and the dog point (16) in the initial position of the drive member.
摘要:
A semiconductor component has a semiconductor layer sequence made of a nitridic composite semiconductor material on a substrate. The substrate includes a silicon surface facing the semiconductor layer sequence. The semiconductor layer sequence includes an active region and at least one intermediate layer made of an oxygen-doped AN composite semiconductor material between the substrate and the active region.
摘要:
A method is provided for producing a light-emitting diode. A carrier substrate has a silicon surface. A series of layers is deposited on the silicon surface in a direction of growth and a light-emitting diode structure is deposited on the series of layers. The series of layers includes a GaN layer, which is formed with gallium nitride. The series of layers includes a masking layer, which is formed with silicon nitride. The masking layer follows at least part of the GaN layer in the direction of growth.
摘要:
An optoelectronic semiconductor chip is specified, which has an active zone (20) containing a multi quantum well structure provided for generating electromagnetic radiation, which comprises a plurality of successive quantum well layers (210, 220, 230). The multi quantum well structure comprises at least one first quantum well layer (210), which is n-conductively doped and which is arranged between two n-conductively doped barrier layers (250) adjoining the first quantum well layer. It comprises a second quantum well layer (220), which is undoped and is arranged between two barrier layers (250, 260) adjoining the second quantum well layer, of which one is n-conductively doped and the other is undoped. In addition, the multi quantum well structure comprises at least one third quantum well layer (230), which is undoped and which is arranged between two undoped barrier layers (260) adjoining the third quantum well layer.
摘要:
A drive-in tool drives in fastening elements and includes a driving ram and a drive unit. The driving ram is displaceably supported in a guide. The drive unit has a drive flywheel and a return device. The drive flywheel is set in rotation by an electric motor, and the return device displaces the driving ram from an initial position after the completion of the drive-in process. The return device has a return motor separate from the electric motor, and the return motor is connected to the driving ram by a return mechanism.
摘要:
A combustion-engined setting tool for driving fastening elements in a constructional component end including a combustion chamber (13) for combusting a gas mixture, an inlet/outlet device (40) for opening the combustion chamber (13) in its first position and for closing the combustion chamber (13) in its second position and having a valve element for reversibly displacing the inlet/outlet device (40) between its first and second positions, a locking element (37) for locking the valve element of the inlet/outlet device (40) in the second position of the device, a trigger (30) for actuating the locking element (37), a release switch (22) for triggering ignition in the combustion chamber (13), an electronic control unit (20) for controlling start of the ignition in the combustion chamber (13), and an initialization switch connected with the control unit (20), the control unit (20) initiating the ignition in the combustion chamber (13) when a time period between switching-on of the initialization switch and switching-on of the release switch (22), which is also connected with the control unit, does not exceed a predetermined set time period.
摘要:
A method for fabricating a component having an electrical contact region on an n-conducting AlGaInP-based or AlGaInAs-based outer layer of an epitaxially grown semiconductor layer sequence, in which electrical contact material, which includes Au and at least one dopant, is applied and the outer layer is then annealed. The dopant contains at least one element selected from the group consisting of Ge, Si, Sn and Te. Also, a component is disclosed which includes an epitaxially grown semiconductor layer sequence with an active zone which emits electromagnetic radiation, the semiconductor layer sequence having an n-conducting AlGaInP-based or AlGaInAs-based outer layer, to which an electrical contact region is applied using the method described.