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公开(公告)号：US6083633A
公开(公告)日：2000-07-04
申请号：US877020
申请日：1997-06-16
申请人： Julius C. Fister , Szuchain F. Chen , Christoper P. Laurello , Arvind Parthasarathi , Derek E. Tyler
发明人： Julius C. Fister , Szuchain F. Chen , Christoper P. Laurello , Arvind Parthasarathi , Derek E. Tyler
CPC分类号： H05K3/244 , B32B15/01 , Y10S428/926 , Y10S428/929 , Y10T428/12493 , Y10T428/12632 , Y10T428/12694 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12771 , Y10T428/12778 , Y10T428/12861 , Y10T428/1291 , Y10T428/12917
摘要： An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.
摘要翻译： 电导体具有涂覆有锡基涂层的铜基底。 为了抑制铜/锡金属间化合物的形成以及作为氧化和腐蚀屏障使用的游离的未反应的锡的消耗，衬底和涂层之间插入有阻挡层。 在第一实施例中，屏障由多个构成层形成，其中至少一个是铜。 铜层的厚度（“y”）取决于预期的使用温度，满足等式y =（ - 1.52 + 0.0871x + 0.00859 t）+/- 50％，其中t =使用温度下的预期时间，x =预期使用温度（摄氏度），y =微米级铜层的厚度。 在第二实施例中，阻挡层由一个或多个构成层形成，其中至少一个是铁或铁基。
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22.发明授权
公开(公告)号：US5573845A
公开(公告)日：1996-11-12
申请号：US352663
申请日：1994-12-09
IPC分类号： B32B7/04 , B32B15/08 , H01R13/405 , H01R43/24 , H05K1/05 , H05K3/20 , H05K3/38 , H05K3/44 , B32B9/00
CPC分类号： H01R43/24 , B32B15/08 , B32B7/04 , H05K3/384 , H01R13/405 , H05K1/056 , H05K2203/0307 , H05K2203/0361 , H05K3/202 , H05K3/44 , Y10S428/901 , Y10T428/249955
摘要： There is provided a composite material particularly suited for electrical and electronic applications having a metallic core with a desired surface finish. An acicular superficial coating layer having an apparent thickness of less than 275 angstroms is adjacent to at least a portion of the metallic core. The superficial coating layer is removable from the metallic core without appreciable change to the metallic core surface finish.
摘要翻译： 提供了特别适用于具有所需表面光洁度的金属芯的电气和电子应用的复合材料。 具有小于275埃的表观厚度的针状表面涂层与金属芯的至少一部分相邻。 表面涂层可从金属芯上移除，而金属芯表面光洁度却无明显变化。
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公开(公告)号：US5489373A
公开(公告)日：1996-02-06
申请号：US382693
申请日：1995-02-02
申请人： Arvind Parthasarathi
发明人： Arvind Parthasarathi
CPC分类号： C25D9/08
摘要： There is disclosed an aqueous chemical solution that consists essentially of zinc ions, a source of hydroxides, and silicon ions. The ratio of silicon to zinc (Si:Zn) is, by weight from about 1:5 to about 1:250. Within the ratio range, the silicon ions inhibit precipitation of zinc from the chemical solution. This is particularly useful when the chemical solution is an electrolyte for the deposition of zinc or a zinc containing compound onto a metallic structure where a critical zinc content must be maintained to impart adequate adhesion of a coated substrate to a polymer adhesive.
摘要翻译： 公开了一种基本上由锌离子，氢氧化物源和硅离子组成的水性化学溶液。 硅与锌（Si：Zn）的比例为约1:5至约1:250。 在比率范围内，硅离子抑制锌从化学溶液中的沉淀。 当化学溶液是用于将锌或含锌化合物沉积到必须保持临界锌含量以赋予涂覆的基材足够粘合到聚合物粘合剂的金属结构上的电解质时，这是特别有用的。
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24.发明授权Whisker resistant tin coatings and baths and methods for making such coatings 失效耐晶须锡涂层和浴缸以及制造这种涂层的方法
公开(公告)号：US4749626A
公开(公告)日：1988-06-07
申请号：US879118
申请日：1986-07-03
CPC分类号： C23C18/48 , C25D21/10 , C25D3/60 , C25D1/04 , H05K3/244 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： The present invention relates to an addition to tin coating solutions for inhibiting the growth of tin whiskers. The addition comprises a concentration of a metal salt selected from the group consisting of palladium salt, silver salt, nickel salt, iron salt, cadmium salt, platinum salt, gold salt, indium salt, ruthenium salt and cobalt salt. In a preferred embodiment, the metal salt addition is either a palladium salt such as palladium chloride or a silver salt such as silver sulfate.
摘要翻译： 本发明涉及添加用于抑制锡晶须生长的锡涂层溶液。 该添加物含有选自钯盐，银盐，镍盐，铁盐，镉盐，铂盐，金盐，铟盐，钌盐和钴盐中的金属盐的浓度。 在优选的实施方案中，金属盐添加物是钯盐如氯化钯或银盐如硫酸银。
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公开(公告)号：US5234536A
公开(公告)日：1993-08-10
申请号：US858791
申请日：1992-04-01
CPC分类号： H05K3/002 , H01L21/4839 , H01L23/145 , H01L23/49572 , H05K3/4092 , H01L2924/0002 , H05K2201/0355 , H05K2201/09063 , H05K2203/063 , H05K2203/1545 , H05K3/0041 , H05K3/386 , H05K3/4652
摘要： A method for the manufacture of an electronic circuit is provided. A substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the nonconductive substrate and patterned into a plurality of circuit traces. These steps may be repeated a plurality of time for a multi-metal layer structure.
摘要翻译： 提供了一种制造电子电路的方法。 基板通过蚀刻设置有索引装置和个性窗口。 粘合剂沉积在基材的一个表面上，以至少涂覆那些要层压到金属箔上的区域。 箔结合到非导电衬底并图案化成多个电路迹线。 对于多金属层结构，这些步骤可以重复多次。
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公开(公告)号：US4568431A
公开(公告)日：1986-02-04
申请号：US748104
申请日：1985-06-24
CPC分类号： C25D21/18 , C25D21/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723 , Y10S204/13
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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27.发明授权
公开(公告)号：US4551210A
公开(公告)日：1985-11-05
申请号：US670238
申请日：1984-11-13
申请人： Arvind Parthasarathi
发明人： Arvind Parthasarathi
CPC分类号： H05K3/384 , C25D5/16 , C25D5/34 , C25D5/48 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K3/241
摘要： The present invention relates to a treatment for improving the laminate adhesion of metal and metal alloy materials, particularly copper and copper alloy foils. The treatment comprises electrolytically forming a plurality of dendrites on a surface of the metal or metal alloy material and bonding the dendrites thereto. The dendrites are formed on and bonded to the metal or metal alloy material surface by one or more treatment anodes positioned at an angle to the material being treated and a single current source.
摘要翻译： 本发明涉及一种用于改善金属和金属合金材料，特别是铜和铜合金箔的层压粘合性的处理。 处理包括在金属或金属合金材料的表面上电解形成多个枝晶并将枝晶粘合到其上。 枝晶通过一个或多个处理阳极形成在金属或金属合金材料表面上并与金属或金属合金材料表面结合，所述一个或多个处理阳极与被处理材料成一定角度，并且具有单个电流源。
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公开(公告)号：US4532014A
公开(公告)日：1985-07-30
申请号：US670235
申请日：1984-11-13
CPC分类号： C25D1/04 , C25D7/0614 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.
摘要翻译： 本发明涉及一种用于对准金属或金属合金箔生产线中的多个辊的系统。 对准系统包括参考框架，其具有平行于通过生产线的箔片行进方向的纵向尺寸和可移动地安装到框架的光学对准系统。 光学对准系统包括激光束发生器，分束器和用于产生用于对准生产线中的每个箔接触辊的正交参考系的反射镜。
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