公开(公告)号：US5573845A

公开(公告)日：1996-11-12

申请号：US352663

申请日：1994-12-09

申请人： Arvind Parthasarathi ,  William L. Brenneman

发明人： Arvind Parthasarathi ,  William L. Brenneman

IPC分类号： B32B7/04 ,  B32B15/08 ,  H01R13/405 ,  H01R43/24 ,  H05K1/05 ,  H05K3/20 ,  H05K3/38 ,  H05K3/44 ,  B32B9/00

CPC分类号： H01R43/24 ,  B32B15/08 ,  B32B7/04 ,  H05K3/384 ,  H01R13/405 ,  H05K1/056 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K3/202 ,  H05K3/44 ,  Y10S428/901 ,  Y10T428/249955

摘要： There is provided a composite material particularly suited for electrical and electronic applications having a metallic core with a desired surface finish. An acicular superficial coating layer having an apparent thickness of less than 275 angstroms is adjacent to at least a portion of the metallic core. The superficial coating layer is removable from the metallic core without appreciable change to the metallic core surface finish.

摘要翻译： 提供了特别适用于具有所需表面光洁度的金属芯的电气和电子应用的复合材料。 具有小于275埃的表观厚度的针状表面涂层与金属芯的至少一部分相邻。 表面涂层可从金属芯上移除，而金属芯表面光洁度却无明显变化。

公开(公告)号：US5578869A

公开(公告)日：1996-11-26

申请号：US413149

申请日：1994-03-29

申请人： Paul R. Hoffman ,  Deepak Mahulikar ,  George A. Brathwaite ,  Dawit Solomon ,  Arvind Parthasarathi

发明人： Paul R. Hoffman ,  Deepak Mahulikar ,  George A. Brathwaite ,  Dawit Solomon ,  Arvind Parthasarathi

IPC分类号： H01L23/057 ,  H01L23/31 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L23/52 ,  H01L23/34 ,  H01L23/48 ,  H01L23/04

CPC分类号： H01L23/057 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/49894 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107

摘要： There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

摘要翻译： 提供了用于电子封装的金属部件。 该部件涂覆有非导电层，并且在表面上形成多个导电电路迹线。 电路迹线直接焊接到集成电路器件的输入/输出焊盘和第二多个电路迹线。 该组件可以包括散热器，以增强来自封装的集成电路器件的散热。

公开(公告)号：US4647315A

公开(公告)日：1987-03-03

申请号：US750573

申请日：1985-07-01

申请人： Arvind Parthasarathi ,  Ned W. Polan

发明人： Arvind Parthasarathi ,  Ned W. Polan

IPC分类号： C23C22/24 ,  C23C22/33 ,  C23C22/68 ,  C23C22/82 ,  C23C22/83 ,  C23F11/00 ,  H05K3/28

CPC分类号： C23C22/33 ,  C23C22/83 ,  H05K3/282 ,  H05K2203/0307 ,  H05K2203/0723

摘要： The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper base alloy materials. The technique of the present invention involves immersing the copper or copper base alloy material in a dilute aqueous chromic acid-phosphoric acid solution. After emerging from the chromic acid-phosphoric acid solution, the copper or copper base alloy material is preferably rinsed with a dilute aqueous caustic solution and dried. Copper and copper base alloy materials treated in accordance with the present invention have particular utility in printed circuit applications.

摘要翻译： 本发明涉及一种提高铜和铜基合金材料的抗褪色和抗氧化性能的技术。 本发明的技术包括将铜或铜基合金材料浸入稀酸铬酸 - 磷酸水溶液中。 在从铬酸 - 磷酸溶液中出来之后，铜或铜基合金材料优选用稀的苛性碱水溶液冲洗并干燥。 根据本发明处理的铜和铜基合金材料在印刷电路应用中具有特殊的用途。

公开(公告)号：US4549941A

公开(公告)日：1985-10-29

申请号：US670236

申请日：1984-11-13

申请人： Arvind Parthasarathi ,  Ned W. Polan

发明人： Arvind Parthasarathi ,  Ned W. Polan

IPC分类号： C25D5/16 ,  C25D5/34 ,  C25D5/48 ,  H05K3/38 ,  C25D5/10 ,  C25D17/00

CPC分类号： C25D5/16 ,  C25D5/34 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/0723 ,  Y10T428/12472

摘要： The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.

摘要翻译： 本发明涉及一种用于改善用于电气和电子应用的金属箔的粘合性能的处理。 本发明的处理包括在表面上形成多个树枝状结构之前，在金属箔的至少一个表面上施加光基本均匀的金属层。 金属层使待处理的表面或表面更均匀地具有电化学活性，因此更容易接受后续的树枝状处理。 本发明的处理在提高锻铜和铜合金箔的粘合性方面具有特别的用途。 还描述了用于执行本处理的装置。

公开(公告)号：US6136460A

公开(公告)日：2000-10-24

申请号：US54899

申请日：1998-04-03

申请人： Szuchain Chen ,  Julius Fister ,  Dennis Brauer ,  Arvind Parthasarathi ,  Christopher Laurello

发明人： Szuchain Chen ,  Julius Fister ,  Dennis Brauer ,  Arvind Parthasarathi ,  Christopher Laurello

IPC分类号： C23C28/00 ,  C23C28/02 ,  B32B19/00 ,  B32B9/00

CPC分类号： C23C28/021 ,  C23C28/023 ,  Y10T428/12021 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12722 ,  Y10T428/24942

摘要： A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing tin coating. Alternatively, the existing tin coating may be exposed to a chemical bath including the agent and later heated to reflow the tin coating and agent thereby incorporating the agent into the matrix of the tin coating.

摘要翻译： 将防晦暗剂引入锡涂层的基质中以减少锡涂层的氧化和/或变黄的方法。 试剂优选为锌，铟或磷，并且可以以熔融形式沉积以与现有的锡涂层合金。 或者，现有的锡涂层可以暴露于包括该试剂的化学浴中，并随后被加热以使锡涂层和试剂回流，从而将该试剂掺入锡涂层的基质中。

公开(公告)号：US5952083A

公开(公告)日：1999-09-14

申请号：US955191

申请日：1997-10-21

申请人： Arvind Parthasarathi ,  Satish Jalota ,  Jeffrey Schlater ,  Lynn Strauman ,  Jeffrey S. Braden

发明人： Arvind Parthasarathi ,  Satish Jalota ,  Jeffrey Schlater ,  Lynn Strauman ,  Jeffrey S. Braden

IPC分类号： C25D3/38 ,  C25D11/04 ,  H01L23/14 ,  H05K1/05 ,  H01L23/52

CPC分类号： H01L23/142 ,  C25D11/04 ,  C25D3/38 ,  H05K1/053 ,  H01L2924/0002 ,  Y10T428/24917

摘要： Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.

摘要翻译： 用于电子封装应用的可阳极氧化组件，例如用于印刷电路板或球栅阵列电子封装的基板，其具有形成在非导电阳极膜上的导电电路。 为了抑制阳极膜中导电沉淀物的形成，其可以在电路迹线和元件的金属芯之间形成电短路，金属芯由具有低于沉淀形成成分阈值的阳极化合金形成。 这种沉淀形成成分包括铁，硅和锰。

公开(公告)号：US5343073A

公开(公告)日：1994-08-30

申请号：US1014

申请日：1993-01-06

申请人： Arvind Parthasarathi ,  Deepak Mahulikar

发明人： Arvind Parthasarathi ,  Deepak Mahulikar

IPC分类号： C23C30/00 ,  C22C9/00 ,  C22C9/06 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L29/44 ,  H01L29/52 ,  H01L29/62

CPC分类号： H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752

摘要： There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

摘要翻译： 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬和锌混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。

公开(公告)号：US5156716A

公开(公告)日：1992-10-20

申请号：US691914

申请日：1991-04-26

申请人： Arvind Parthasarathi

发明人： Arvind Parthasarathi

IPC分类号： H01L21/48 ,  H01L23/14 ,  H01L23/495 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L23/145 ,  H01L21/4839 ,  H01L23/49572 ,  H05K3/002 ,  H05K3/4092 ,  H01L2924/0002 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2203/063 ,  H05K2203/1545 ,  H05K3/0041 ,  H05K3/386 ,  H05K3/4652

摘要： A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the non-conductive substrate and patterned into a plurality of circuit traces. Mechanical stamping of the substrate is not required providing a means to inexpensively manufacture small quantities of a desired circuit configuration.

摘要翻译： 提供了一种制造电子电路的方法。 非导电基板通过蚀刻设置有索引装置和个性窗口。 粘合剂沉积在基材的一个表面上，以至少涂覆那些要层压到金属箔上的区域。 箔结合到非导电衬底并且被图案化成多个电路迹线。 基板的机械冲压不需要提供廉价地制造少量所需电路结构的手段。

公开(公告)号：US4692221A

公开(公告)日：1987-09-08

申请号：US944776

申请日：1986-12-22

申请人： Arvind Parthasarathi

发明人： Arvind Parthasarathi

IPC分类号： C25D1/04 ,  C25D5/16 ,  H05K3/24 ,  H05K3/38

CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D5/16 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K3/241

摘要： The present invention relates to a process and apparatus for forming in situ surface treated metal foil. The apparatus includes a cathode and anode arranged and/or shaped to define a plating region characterized by a first zone having a first interelectrode gap and a second zone having a second interelectrode gap smaller than the first interelectrode gap. It has been found that by providing such an arrangement it is possible to generate in the first zone a localized current density below the limiting current density sufficient to plate metal foil onto the cathode and to simultaneously generate in the second zone a localized current density above the limiting current density sufficient to form dendrites on the freshly produced foil.

摘要翻译： 本发明涉及用于形成原位表面处理的金属箔的方法和设备。 该装置包括阴极和阳极，其布置和/或成形以限定电镀区域，其特征在于具有第一电极间隙的第一区域和具有小于第一电极间隙的第二电极间隙的第二区域。 已经发现，通过提供这种布置，可以在第一区域中产生低于极限电流密度的局部电流密度，足以将金属箔压平到阴极上并且同时在第二区域中产生局部电流密度高于 限制电流密度足以在新生成的箔上形成枝晶。

公开(公告)号：US5817544A

公开(公告)日：1998-10-06

申请号：US584934

申请日：1996-01-16

申请人： Arvind Parthasarathi

发明人： Arvind Parthasarathi

IPC分类号： H01L23/10 ,  H01L23/31 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L24/32 ,  H01L23/10 ,  H01L23/3142 ,  H01L23/49586 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181

摘要： A method for improving adhesion from a leadframe to a metallic wire is disclosed including using a laser beam to remove selected areas of an package adhesion enhancing layer to expose a layer on the leadframe which has a higher adhesion to metallic wires. The package adhesion enhancing layer is from the group consisting essentially of aluminum oxide, anti-tarnish finishes, and dielectrics. The exposed layer on the leadframe is selected from the group consisting essentially of silver, nickel, palladium.

摘要翻译： 公开了一种用于提高从引线框架到金属线材的附着力的方法，其包括使用激光束去除封装附着增强层的选定区域以暴露引线框架上的与金属线材具有较高粘合力的层。 包装附着力增强层来自基本上由氧化铝，防污漆和电介质组成的组。 引线框架上的暴露层选自基本上由银，镍，钯组成的组。