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公开(公告)号：US4532014A
公开(公告)日：1985-07-30
申请号：US670235
申请日：1984-11-13
CPC分类号： C25D1/04 , C25D7/0614 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.
摘要翻译： 本发明涉及一种用于对准金属或金属合金箔生产线中的多个辊的系统。 对准系统包括参考框架，其具有平行于通过生产线的箔片行进方向的纵向尺寸和可移动地安装到框架的光学对准系统。 光学对准系统包括激光束发生器，分束器和用于产生用于对准生产线中的每个箔接触辊的正交参考系的反射镜。
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公开(公告)号：US4549950A
公开(公告)日：1985-10-29
申请号：US670232
申请日：1984-11-13
CPC分类号： C25D21/06 , C25D21/18 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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公开(公告)号：US4568431A
公开(公告)日：1986-02-04
申请号：US748104
申请日：1985-06-24
CPC分类号： C25D21/18 , C25D21/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723 , Y10S204/13
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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公开(公告)号：US4647315A
公开(公告)日：1987-03-03
申请号：US750573
申请日：1985-07-01
申请人： Arvind Parthasarathi , Ned W. Polan
发明人： Arvind Parthasarathi , Ned W. Polan
CPC分类号： C23C22/33 , C23C22/83 , H05K3/282 , H05K2203/0307 , H05K2203/0723
摘要： The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper base alloy materials. The technique of the present invention involves immersing the copper or copper base alloy material in a dilute aqueous chromic acid-phosphoric acid solution. After emerging from the chromic acid-phosphoric acid solution, the copper or copper base alloy material is preferably rinsed with a dilute aqueous caustic solution and dried. Copper and copper base alloy materials treated in accordance with the present invention have particular utility in printed circuit applications.
摘要翻译： 本发明涉及一种提高铜和铜基合金材料的抗褪色和抗氧化性能的技术。 本发明的技术包括将铜或铜基合金材料浸入稀酸铬酸 - 磷酸水溶液中。 在从铬酸 - 磷酸溶液中出来之后，铜或铜基合金材料优选用稀的苛性碱水溶液冲洗并干燥。 根据本发明处理的铜和铜基合金材料在印刷电路应用中具有特殊的用途。
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5.发明授权Electrochemical surface preparation for improving the adhesive properties of metallic surfaces 失效用于改善金属表面的粘合性能的电化学表面处理
公开(公告)号：US4549941A
公开(公告)日：1985-10-29
申请号：US670236
申请日：1984-11-13
申请人： Arvind Parthasarathi , Ned W. Polan
发明人： Arvind Parthasarathi , Ned W. Polan
CPC分类号： C25D5/16 , C25D5/34 , C25D5/48 , H05K3/384 , H05K2201/0355 , H05K2203/0278 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723 , Y10T428/12472
摘要： The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.
摘要翻译： 本发明涉及一种用于改善用于电气和电子应用的金属箔的粘合性能的处理。 本发明的处理包括在表面上形成多个树枝状结构之前，在金属箔的至少一个表面上施加光基本均匀的金属层。 金属层使待处理的表面或表面更均匀地具有电化学活性，因此更容易接受后续的树枝状处理。 本发明的处理在提高锻铜和铜合金箔的粘合性方面具有特别的用途。 还描述了用于执行本处理的装置。
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公开(公告)号：US5578869A
公开(公告)日：1996-11-26
申请号：US413149
申请日：1994-03-29
申请人： Paul R. Hoffman , Deepak Mahulikar , George A. Brathwaite , Dawit Solomon , Arvind Parthasarathi
发明人： Paul R. Hoffman , Deepak Mahulikar , George A. Brathwaite , Dawit Solomon , Arvind Parthasarathi
IPC分类号： H01L23/057 , H01L23/31 , H01L23/367 , H01L23/42 , H01L23/498 , H01L25/065 , H01L23/52 , H01L23/34 , H01L23/48 , H01L23/04
CPC分类号： H01L23/057 , H01L23/3128 , H01L23/367 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/49894 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/30107
摘要： There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
摘要翻译： 提供了用于电子封装的金属部件。 该部件涂覆有非导电层，并且在表面上形成多个导电电路迹线。 电路迹线直接焊接到集成电路器件的输入/输出焊盘和第二多个电路迹线。 该组件可以包括散热器，以增强来自封装的集成电路器件的散热。
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7.发明授权Tin coatings incorporating selected elemental additions to reduce discoloration 失效含有选择元素添加剂的锡涂层以减少变色
公开(公告)号：US6136460A
公开(公告)日：2000-10-24
申请号：US54899
申请日：1998-04-03
CPC分类号： C23C28/021 , C23C28/023 , Y10T428/12021 , Y10T428/12687 , Y10T428/12694 , Y10T428/12708 , Y10T428/12722 , Y10T428/24942
摘要： A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing tin coating. Alternatively, the existing tin coating may be exposed to a chemical bath including the agent and later heated to reflow the tin coating and agent thereby incorporating the agent into the matrix of the tin coating.
摘要翻译： 将防晦暗剂引入锡涂层的基质中以减少锡涂层的氧化和/或变黄的方法。 试剂优选为锌，铟或磷，并且可以以熔融形式沉积以与现有的锡涂层合金。 或者，现有的锡涂层可以暴露于包括该试剂的化学浴中，并随后被加热以使锡涂层和试剂回流，从而将该试剂掺入锡涂层的基质中。
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公开(公告)号：US5952083A
公开(公告)日：1999-09-14
申请号：US955191
申请日：1997-10-21
CPC分类号： H01L23/142 , C25D11/04 , C25D3/38 , H05K1/053 , H01L2924/0002 , Y10T428/24917
摘要： Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
摘要翻译： 用于电子封装应用的可阳极氧化组件，例如用于印刷电路板或球栅阵列电子封装的基板，其具有形成在非导电阳极膜上的导电电路。 为了抑制阳极膜中导电沉淀物的形成，其可以在电路迹线和元件的金属芯之间形成电短路，金属芯由具有低于沉淀形成成分阈值的阳极化合金形成。 这种沉淀形成成分包括铁，硅和锰。
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公开(公告)号：US5343073A
公开(公告)日：1994-08-30
申请号：US1014
申请日：1993-01-06
IPC分类号： C23C30/00 , C22C9/00 , C22C9/06 , H01L21/56 , H01L23/28 , H01L23/48 , H01L23/495 , H01L23/50 , H01L29/44 , H01L29/52 , H01L29/62
CPC分类号： H01L23/10 , H01L23/3107 , H01L23/49582 , H01L24/48 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48618 , H01L2224/73265 , H01L2224/85201 , H01L2224/85418 , H01L2224/85871 , H01L24/45 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/16152 , H01L2924/181 , H01L2924/20752
摘要： There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.
摘要翻译： 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬和锌混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。
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10.发明授权Process for the manufacture of a three layer tape for tape automated bonding 失效用于制造用于胶带自动粘合的三层胶带的方法
公开(公告)号：US5156716A
公开(公告)日：1992-10-20
申请号：US691914
申请日：1991-04-26
申请人： Arvind Parthasarathi
发明人： Arvind Parthasarathi
CPC分类号： H01L23/145 , H01L21/4839 , H01L23/49572 , H05K3/002 , H05K3/4092 , H01L2924/0002 , H05K2201/0355 , H05K2201/09063 , H05K2203/063 , H05K2203/1545 , H05K3/0041 , H05K3/386 , H05K3/4652
摘要： A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the non-conductive substrate and patterned into a plurality of circuit traces. Mechanical stamping of the substrate is not required providing a means to inexpensively manufacture small quantities of a desired circuit configuration.
摘要翻译： 提供了一种制造电子电路的方法。 非导电基板通过蚀刻设置有索引装置和个性窗口。 粘合剂沉积在基材的一个表面上，以至少涂覆那些要层压到金属箔上的区域。 箔结合到非导电衬底并且被图案化成多个电路迹线。 基板的机械冲压不需要提供廉价地制造少量所需电路结构的手段。
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