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公开(公告)号:US11415744B1
公开(公告)日:2022-08-16
申请号:US17170203
申请日:2021-02-08
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Alec Hammond , Yusheng Bian , Michal Rakowski , Won Suk Lee , Asif J. Chowdhury , Roderick A. Augur , Abdelsalam Aboketaf
Abstract: Structures for a wavelength-division multiplexing filter and methods of forming a structure for a wavelength-division multiplexing filter. The structure includes a first slab having a first perimeter, a first waveguide core coupled to the first slab, and a plurality of second waveguide cores coupled to the first slab. A second slab is positioned to overlap with the first slab. The second slab includes a second perimeter and openings that are distributed inside the second perimeter. The openings of the second slab penetrate through the second slab.
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公开(公告)号:US20220221714A1
公开(公告)日:2022-07-14
申请号:US17146509
申请日:2021-01-12
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Won Suk Lee , Thomas G. Weeks, III , Michal Rakowski , Yusheng Bian , Roderick A. Augur , Alexander L. Martin , Petar I. Todorov
Abstract: Disclosed are a system, method, software tool, etc. for generating a layout indicating the paths for balanced optical waveguides (WGs) of a WG bus. A grid is used to route paths, which extend between corresponding first and second input/output nodes, respectively, and which are within boundaries of a defined area. The paths are automatically rerouted to balance for length and number of bends without overly increasing the lengths of or number of bends in those paths and further without moving the input/output nodes or falling outside the established boundaries. Automatic rerouting of the paths is performed iteratively based on results of various intersection operations related to different path-specific sets of points on the grid to determine when and where to insert additional linear segments and bends into the paths. Then, a layout indicating the balanced paths is generated. Also disclosed is a WG bus structure with balanced optical WGs.
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公开(公告)号:US11280961B1
公开(公告)日:2022-03-22
申请号:US17113567
申请日:2020-12-07
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Alec Hammond , Yusheng Bian , Michal Rakowski , Won Suk Lee , Asif J. Chowdhury , Roderick A. Augur
Abstract: Structures for an optical power splitter and methods of forming a structure for an optical power splitter. A splitter body defines a multimode interference region of the optical power splitter. A first side element positioned adjacent to a first side surface of the splitter body, and a second side element positioned adjacent to a second side surface of the splitter body.
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公开(公告)号:US20210389521A1
公开(公告)日:2021-12-16
申请号:US16901509
申请日:2020-06-15
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Judson Holt , Yusheng Bian , Andreas D. Stricker , Colleen Meagher , Michal Rakowski
IPC: G02B6/12 , G02B6/13 , H01L31/0232 , H01L31/028 , H01L31/18
Abstract: Structures for a photodetector and methods of fabricating a structure for a photodetector. A photodetector may have a light-absorbing layer comprised of germanium. A waveguide core may be coupled to the light-absorbing layer. The waveguide core may be comprised of a dielectric material, such as silicon nitride. Another waveguide core, which may be comprised of a different material such as single-crystal silicon, may be coupled to the light-absorbing layer.
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公开(公告)号:US20210318490A1
公开(公告)日:2021-10-14
申请号:US16842887
申请日:2020-04-08
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Bo Peng , Yusheng Bian , Michal Rakowski , Tymon Barwicz
Abstract: One illustrative backscattering generator disclosed herein includes a low-reflection waveguide structure, a slot waveguide structure comprising a first waveguide, a second waveguide and a slot located between the first waveguide and the second waveguide, and a variable direction coupler operatively coupled to the low-reflection waveguide structure and the slot waveguide structure.
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公开(公告)号:US11029465B1
公开(公告)日:2021-06-08
申请号:US16832023
申请日:2020-03-27
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Michal Rakowski , Yusheng Bian , Ajey Poovannummoottil Jacob , Steven M. Shank
Abstract: One illustrative device disclosed herein includes a micro-ring modulator that comprises an inner ring, an outer ring and a doped waveguide ring positioned between the inner ring and the outer ring. The device also includes an upper bus waveguide that is positioned vertically above at least a portion of the doped waveguide ring and at least a portion of the outer ring.
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公开(公告)号:US20230393339A1
公开(公告)日:2023-12-07
申请号:US17834375
申请日:2022-06-07
Applicant: GlobalFoundries U.S. Inc.
Inventor: Bartlomiej Jan Pawlak , Michal Rakowski , Yusheng Bian
CPC classification number: G02B6/2934 , G02B6/4215
Abstract: Structures including stacked photonics chips and methods of fabricating a structure including stacked photonics chips. The structure comprises a first chip including a first waveguide core, a ring resonator adjacent to a portion of the first waveguide core, and a first dielectric layer over the first waveguide core and the ring resonator. The first dielectric layer has a first surface. The structure further comprises a second chip including a second waveguide core and a second dielectric layer over the second waveguide core. The second dielectric layer has a second surface adjacent to the first surface of the first dielectric layer, and the second waveguide core is positioned adjacent to the ring resonator.
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28.
公开(公告)号:US11837851B2
公开(公告)日:2023-12-05
申请号:US17931933
申请日:2022-09-14
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Roderick A. Augur , Michal Rakowski , Kenneth J. Giewont , Karen A. Nummy
CPC classification number: H01S5/2018 , H01S5/20 , H01S5/2231 , H01S5/2232 , H01S5/3013 , H01S5/021 , H01S5/026 , H01S5/3054 , H01S5/32333
Abstract: A laser structure, including: a dielectric matrix formed of a first material; a laser source formed within the dielectric matrix and formed of a semiconductor material; and a plurality of side confining features formed within the dielectric matrix and extending parallel to and along a length of the laser source. The plurality of side confining features are formed of the semiconductor material.
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公开(公告)号:US11768153B1
公开(公告)日:2023-09-26
申请号:US17689120
申请日:2022-03-08
Applicant: GlobalFoundries U.S. Inc.
Inventor: Bartlomiej J. Pawlak , Michal Rakowski
CPC classification number: G01N21/31 , G02B6/2935 , G02B6/29343
Abstract: Disclosed is a structure (e.g., a lab-on-chip structure) including a substrate, an insulator layer on the substrate, and at least one optical ring resonator. Each ring resonator includes cladding material on the insulator layer and, embedded within the cladding material, a first waveguide core with an input and an output, and second waveguide core(s) (e.g., ring waveguide core(s)) positioned laterally adjacent to the first waveguide core. A reservoir is below the ring resonator within the insulator layer and substrate such that surfaces of the waveguide cores are exposed within the reservoir. During a sensing operation, the waveguide core surfaces contact with fluid within the reservoir and a light signal at the output of the first waveguide core is monitored (e.g., by a sensing circuit, which in some embodiments is also coupled to a reference optical ring resonator) and used, for example, for spectrum-based target identification and, optionally, characterization.
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公开(公告)号:US11630335B2
公开(公告)日:2023-04-18
申请号:US17170237
申请日:2021-02-08
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Michal Rakowski , Abdelsalam Aboketaf , Kevin K. Dezfulian , Massimo Sorbara
Abstract: Structures for an optical power modulator and methods of fabricating a structure for an optical power modulator. A first waveguide core includes first and second sections. A second waveguide core includes a first section laterally adjacent to the first section of the first waveguide core and a second section laterally adjacent to the second section of the first waveguide core. An interconnect structure is formed over the first waveguide core and the second waveguide core. The interconnect structure includes first and second transmission lines. The first transmission line is physically connected within the interconnect structure to the first section of the first waveguide core. The second transmission line includes a first section physically connected within the interconnect structure to the second section of the first waveguide core and a second section adjacent to the first transmission line.
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