LIGHT COUPLING BETWEEN STACKED PHOTONICS CHIPS

    公开(公告)号:US20230393339A1

    公开(公告)日:2023-12-07

    申请号:US17834375

    申请日:2022-06-07

    CPC classification number: G02B6/2934 G02B6/4215

    Abstract: Structures including stacked photonics chips and methods of fabricating a structure including stacked photonics chips. The structure comprises a first chip including a first waveguide core, a ring resonator adjacent to a portion of the first waveguide core, and a first dielectric layer over the first waveguide core and the ring resonator. The first dielectric layer has a first surface. The structure further comprises a second chip including a second waveguide core and a second dielectric layer over the second waveguide core. The second dielectric layer has a second surface adjacent to the first surface of the first dielectric layer, and the second waveguide core is positioned adjacent to the ring resonator.

    Optical ring resonator-based microfluidic sensor

    公开(公告)号:US11768153B1

    公开(公告)日:2023-09-26

    申请号:US17689120

    申请日:2022-03-08

    CPC classification number: G01N21/31 G02B6/2935 G02B6/29343

    Abstract: Disclosed is a structure (e.g., a lab-on-chip structure) including a substrate, an insulator layer on the substrate, and at least one optical ring resonator. Each ring resonator includes cladding material on the insulator layer and, embedded within the cladding material, a first waveguide core with an input and an output, and second waveguide core(s) (e.g., ring waveguide core(s)) positioned laterally adjacent to the first waveguide core. A reservoir is below the ring resonator within the insulator layer and substrate such that surfaces of the waveguide cores are exposed within the reservoir. During a sensing operation, the waveguide core surfaces contact with fluid within the reservoir and a light signal at the output of the first waveguide core is monitored (e.g., by a sensing circuit, which in some embodiments is also coupled to a reference optical ring resonator) and used, for example, for spectrum-based target identification and, optionally, characterization.

    Optical power modulators with unloaded transmission lines

    公开(公告)号:US11630335B2

    公开(公告)日:2023-04-18

    申请号:US17170237

    申请日:2021-02-08

    Abstract: Structures for an optical power modulator and methods of fabricating a structure for an optical power modulator. A first waveguide core includes first and second sections. A second waveguide core includes a first section laterally adjacent to the first section of the first waveguide core and a second section laterally adjacent to the second section of the first waveguide core. An interconnect structure is formed over the first waveguide core and the second waveguide core. The interconnect structure includes first and second transmission lines. The first transmission line is physically connected within the interconnect structure to the first section of the first waveguide core. The second transmission line includes a first section physically connected within the interconnect structure to the second section of the first waveguide core and a second section adjacent to the first transmission line.

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