公开(公告)号：US20120091478A1

公开(公告)日：2012-04-19

申请号：US13239132

申请日：2011-09-21

Applicant: Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

Inventor： Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

IPC: H01L33/50

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 从发光单元产生的热可以容易地消散，从而可以减少发光器件上的热负荷。 由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US20110241054A1

公开(公告)日：2011-10-06

申请号：US13159846

申请日：2011-06-14

Applicant: Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

Inventor： Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Abstract translation: 公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。 由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

公开(公告)号：US20110031891A1

公开(公告)日：2011-02-10

申请号：US12908692

申请日：2010-10-20

Applicant: Chung Hoon LEE ,  James S. SPECK ,  Hong San KIM ,  Jae Jo KIM ,  Sung Han KIM ,  Jae Ho LEE

Inventor： Chung Hoon LEE ,  James S. SPECK ,  Hong San KIM ,  Jae Jo KIM ,  Sung Han KIM ,  Jae Ho LEE

IPC: H05B41/16

CPC classification number: H05B33/0827 ,  H01L27/153 ,  H01L27/156 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05B33/02 ,  H05B33/08 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/083 ,  H05B33/0848 ,  H05B37/029

Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.

Abstract translation: 公开了一种用于AC电力操作的改进的发光装置。 传统的发光器件采用具有反向并联连接的发光单元阵列的交流发光二极管。 现有技术中的阵列响应于AC电源的相变而交替重复开/关，导致在1/2周期期间的短发光时间和闪烁效应的发生。 根据本发明的交流发光装置采用各种手段，响应于​​交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。 例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。 此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。

公开(公告)号：US20100277084A1

公开(公告)日：2010-11-04

申请号：US12837805

申请日：2010-07-16

Applicant: Chung Hoon LEE ,  James S. Speck ,  Hong San Kim ,  Jae Jo Kim ,  Sung Han Kim ,  Jae Ho Lee

Inventor： Chung Hoon LEE ,  James S. Speck ,  Hong San Kim ,  Jae Jo Kim ,  Sung Han Kim ,  Jae Ho Lee

IPC: H05B37/00

CPC classification number: H05B33/0827 ,  H01L27/153 ,  H01L27/156 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05B33/02 ,  H05B33/08 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/083 ,  H05B33/0848 ,  H05B37/029

Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.

Abstract translation: 公开了一种用于AC电力操作的改进的发光装置。 传统的发光器件采用具有反向并联连接的发光单元阵列的交流发光二极管。 现有技术中的阵列响应于AC电源的相变而交替重复开/关，导致在1/2周期期间的短发光时间和闪烁效应的发生。 根据本发明的交流发光装置采用各种手段，响应于​​交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。 例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。 此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。

公开(公告)号：US20090272971A1

公开(公告)日：2009-11-05

申请号：US12481998

申请日：2009-06-10

Applicant: Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/10 ,  H01L33/00 ,  H01L21/00 ,  H01L29/15

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US20120056215A1

公开(公告)日：2012-03-08

申请号：US13296735

申请日：2011-11-15

Applicant: Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

Inventor： Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

公开(公告)号：US20110175129A1

公开(公告)日：2011-07-21

申请号：US13074761

申请日：2011-03-29

Applicant: Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

Inventor： Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

IPC: H01L33/42

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

公开(公告)号：US20110175128A1

公开(公告)日：2011-07-21

申请号：US13074740

申请日：2011-03-29

Applicant: Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

Inventor： Chung Hoon LEE ,  Keon Young LEE ,  Hong San KIM ,  Dae Won KIM ,  Hyuck Jung CHOI

IPC: H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/36 ,  F21K9/00 ,  H01L27/153 ,  H01L33/20 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

公开(公告)号：US20100330714A1

公开(公告)日：2010-12-30

申请号：US12881657

申请日：2010-09-14

Applicant: Jung Hwa JUNG ,  Chung Hoon LEE

Inventor： Jung Hwa JUNG ,  Chung Hoon LEE

IPC: H01L21/56 ,  B29C45/14 ,  H01L33/52

CPC classification number: H01L21/565 ,  B29C33/10 ,  B29C39/006 ,  B29C39/10 ,  B29C39/26 ,  B29C45/14655 ,  B29C45/34 ,  B29L2011/00 ,  H01L23/49861 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.

Abstract translation: 提供了用于形成模制构件的模具和使用其形成模制构件的方法。 模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。 注射和排出孔从上表面延伸到下表面。 因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获 模制构件。

公开(公告)号：US20100244060A1

公开(公告)日：2010-09-30

申请号：US12819154

申请日：2010-06-18

Applicant: Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L33/62

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光器件包括形成在衬底上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。