公开(公告)号：US06784464B2

公开(公告)日：2004-08-31

申请号：US10396402

申请日：2003-03-26

申请人： Hideki Ichikawa ,  Mamoru Okanishi ,  Terumitsu Santo ,  Toshihiko Yoshida

发明人： Hideki Ichikawa ,  Mamoru Okanishi ,  Terumitsu Santo ,  Toshihiko Yoshida

IPC分类号： H01L3300

CPC分类号： H01L24/85 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/29144 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10336 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/0683 ,  H01S5/4025 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/207

摘要： There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor laser device. There are provided a stem 100 provided with a plurality of lead pins 121 through 124, a sub-mount 160 that is die-bonded onto the stem 100 and has its surface formed integrally with a monitoring PD 140 and two semiconductor laser elements 131 and 132 that are die-bonded onto the sub-mount 160 and have emission light monitored by the monitoring PD 140. A first bonding surface i.e. anode electrode 183 of the monitoring PD 140 and a second bonding surface i.e. end surface 123a of a lead pin 123 that is approximately perpendicular to the first bonding surface are wire-bonded to each other.

摘要翻译： 提供了一种半导体激光装置，其能够以简单的结构简化制造工艺，并且容易地将紧凑型封装上的两个半导体激光元件和监视PD以及用于半导体激光器件的引线接合方法。 设置有设置有多个引线引脚121至124的杆100，芯片粘合到杆100上并且其表面与监视PD 140和两个半导体激光元件131和132一体形成的子安装件160 其被裸片接合到子安装件160上并且具有由监控PD 140监控的发射光。监视PD 140的第一接合表面，即阳极电极183和第二接合表面，即导引销123的端面123a，其中 大致垂直于第一接合表面彼此线接合。

公开(公告)号：US06562693B2

公开(公告)日：2003-05-13

申请号：US09803658

申请日：2001-03-12

申请人： Hideki Ichikawa ,  Mamoru Okanishi ,  Terumitsu Santo ,  Toshihiko Yoshida

发明人： Hideki Ichikawa ,  Mamoru Okanishi ,  Terumitsu Santo ,  Toshihiko Yoshida

IPC分类号： H01L2176

CPC分类号： H01L24/85 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/29144 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10336 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/0683 ,  H01S5/4025 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/207

摘要： There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor laser device. There are provided a stem 100 provided with a plurality of lead pins 121 through 124, a sub-mount 160 that is die-bonded onto the stem 100 and has its surface formed integrally with a monitoring PD 140 and two semiconductor laser elements 131 and 132 that are die-bonded onto the sub-mount 160 and have emission light monitored by the monitoring PD 140. A first bonding surface i.e. anode electrode 183 of the monitoring PD 140 and a second bonding surface i.e. end surface 123a of a lead pin 123 that is approximately perpendicular to the first bonding surface are wire-bonded to each other.

公开(公告)号：US06519837B1

公开(公告)日：2003-02-18

申请号：US09669731

申请日：2000-09-26

申请人： Hideki Ichikawa ,  Koji Katahira ,  Norihisa Tsuchiyama

发明人： Hideki Ichikawa ,  Koji Katahira ,  Norihisa Tsuchiyama

IPC分类号： B23P2100

CPC分类号： B23P21/004 ,  Y02P90/04 ,  Y02P90/083 ,  Y10T29/53087 ,  Y10T29/5337 ,  Y10T29/53378 ,  Y10T29/53383

摘要： An Assembly/processing apparatus includes part tray, work tray where work pieces are placed, conveyor, base machine, part-tray lane, work-tray lane, part-tray transfer apparatus and work-tray transfer apparatus. Conveyor conveys part trays and work trays together, base machine includes assembling means for assembling parts to a work piece, and part tray lane and work tray lane are provided on base machine. Conveyor conveys part trays and work trays to base machine, and respectively places them on each of part tray lane and work tray lane. Then, assembling means takes parts from part tray, and assembles them to the work piece on work tray.

摘要翻译： 装配/处理装置包括部分托盘，放置工件的工作托盘，输送机，基本机器，部分托盘通道，工作托盘通道，部分托盘传送装置和工作托盘传送装置。 输送机将零件托盘和工作托盘一起运输，基本机器包括用于将零件组装到工件上的组装装置，并且在基本机器上提供部分托盘通道和工作托盘通道。 输送机将零件托盘和工作托盘运送到基本机器，并分别放置在零件托盘通道和工作托盘通道的每一个上。 然后，组装装置从零件托盘中取出零件，并将其组装到工件托盘上的工件上。

公开(公告)号：US5778512A

公开(公告)日：1998-07-14

申请号：US574033

申请日：1995-12-18

申请人： Hideki Ichikawa ,  Masahiro Takada ,  Kouji Katahira ,  Keniti Shibayama

发明人： Hideki Ichikawa ,  Masahiro Takada ,  Kouji Katahira ,  Keniti Shibayama

IPC分类号： H02K15/04 ,  H02K15/06

CPC分类号： H02K15/0414 ,  H02K15/066 ,  Y10T29/49012

摘要： A rotor for an electric rotary machine having an armature core, upper layer coil elements and lower layer coil elements is provided. Each coil element has a straight coil side and a pair of coil ends extending radially at a right angle from the coil side. Each coil end is inclined by a predetermined angle with respect to the coil side in a circumferential direction of the armature core. The lower layer coil side and the upper layer coil side are inserted into corresponding slots in a radial direction. A connector comprising a tip of the coil end of the upper layer coil element and a connector comprising a tip of the coil end of the lower layer coil element are welded together.

摘要翻译： 提供一种具有电枢铁芯，上层线圈元件和下层线圈元件的旋转电机的转子。 每个线圈元件具有直线圈侧和从线圈侧以直角径向延伸的一对线圈端。 每个线圈端部在电枢铁芯的圆周方向上相对于线圈侧倾斜预定的角度。 下层线圈侧和上层线圈侧沿径向插入对应的槽。 包括上层线圈元件的线圈端的尖端和包括下层线圈元件的线圈端的尖端的连接器的连接器被焊接在一起。

公开(公告)号：US5521441A

公开(公告)日：1996-05-28

申请号：US381404

申请日：1995-01-31

申请人： Tsutomu Shiga ,  Nobuyuki Hayashi ,  Masanori Ohmi ,  Hideki Ichikawa

发明人： Tsutomu Shiga ,  Nobuyuki Hayashi ,  Masanori Ohmi ,  Hideki Ichikawa

IPC分类号： F02N11/00 ,  H02K5/04 ,  H02K5/10 ,  H02K5/22 ,  F02N11/08 ,  H02P9/04

CPC分类号： H02K5/04 ,  F02N11/00 ,  H02K5/10 ,  H02K5/22 ,  H02K2205/09

摘要： A starter which assuredly and simply sealed an outer circumference of one engagement portion between a housing and a yoke or the other engagement portion between the yoke and an end frame with a band-shaped seal member. The banded-shaped seal member covers each engagement portion of the yoke, a center plate, the housing, a brush holder, and the end frame. The seal member has a clearance which is placed to correspond to a notched ventilation hole so that the yoke can be opened in the direction of the starter bottom or the ground.

摘要翻译： 一种起动器，其可靠且简单地密封壳体和轭之间的一个接合部分的外周，或者使用带状密封构件密封轭和端框架之间的另一接合部。 带状密封构件覆盖轭的每个接合部分，中心板，壳体，电刷架和端框架。 密封构件具有与凹口通气孔对应的间隙，使得轭可以在起动器底部或地面的方向上打开。