摘要:
Provided are gears in which flanks of mutually meshing teeth are polished and finished to a predetermined surface texture. In the gears, the arithmetic mean roughness Ra of the tooth flanks is equal to or less than 0.15 μm and the peak height Rpk satisfies 0.01 μm
摘要:
An iron powder for dust cores is provided which can be formed into a dust core having a high resistivity and having a low iron loss without degrading the mechanical strength. The iron powder for dust cores includes an iron powder and an oxide film on the surface thereof, wherein the oxide film is composed of a Si-based oxide in which the ratio of Si to Fe satisfies Si/Fe≧0.8 on an atomic number basis.
摘要:
A semiconductor light receiving element comprises: a substrate, a semiconductor layer of a first conductivity type formed on the substrate, a non-doped semiconductor light absorbing layer formed on the semiconductor layer of the first conductivity type, a semiconductor layer of a second conductivity type formed on the non-doped semiconductor light absorbing layer, and an electro-conductive layer formed on the semiconductor layer of the second conductivity type. A plurality of openings, periodically arrayed, are formed in a laminated body composed of the electro-conductive layer, the semiconductor layer of the second conductivity type, and the non-doped semiconductor light absorbing layer. The widths of the openings are less than or equal to the wavelength of incident light, and the openings pass through the electro-conductive layer and the semiconductor layer of the second conductivity type to reach the non-doped semiconductor light absorbing layer.
摘要:
A semiconductor device comprises a semiconductor layer having a semiconductor integrated circuit, which is for processing an electrical signal, on a semiconductor substrate and an optical interconnect layer for transmitting an optical signal are joined. Control of modulation of the optical signal transmitted in the optical interconnect layer is performed by an electrical signal from the semiconductor layer, and an electrical signal generated by reception of light in the optical interconnect layer is transmitted to the semiconductor layer. The optical interconnect layer is disposed on the underside of the semiconductor substrate.
摘要:
An arm structure includes a first arm pivotally supported on a body, and a second arm pivotally supported on the first arm at an axis portion formed on a distal end side of the first arm. A wire harness fixing portion for fixing a wire harness is provided at a distal end side of the second arm. A guide portion having a curved face for guiding the wire harness is provided at an end portion at an end side of the second arm, the end side being opposite to the distal end side. A width of the guide portion is larger than a width of a portion of the second arm corresponding to the axis portion, in a width direction perpendicular to a longitudinal direction of the second arm.
摘要:
The lattice mismatching between a Ge layer and a Si layer is as large as about 4%. Thus, when the Ge layer is grown on the Si layer, penetration dislocation is introduced to cause leakage current at the p-i-n junction. Thereby, the photo-detection sensitivity is reduced, and the reliability of the element is also lowered. Further, in the connection with a Si waveguide, there are also problems of the reflection loss due to the difference in refractive index between Si and Ge, and of the absorption loss caused by a metal electrode. In order to solve said problems, according to the present invention, there is provided a vertical type pin-SiGe photodiode having a structure which is embedded in a groove formed in a part of a Si layer, in which a p-type or n-type doped layer is formed in a lower section of the groove, and in which a i-SiGe layer having a rectangular shape or a reverse tapered shape is formed on a layered structure formed by laminating a i-Si layer and a SiGe buffer layer on the lower section and the side wall of the groove. Further, in an optical connection section with a Si waveguide, impedance matching is effected by the layered structure composed of the i-Si layer and the SiGe buffer layer, and an upper metal layer is separated therefrom so that a poly-Si bridge structure is employed to electrically connect the upper metal layer therewith.
摘要:
A powder for a powder magnetic core, a powder magnetic core, and methods of producing those products are provided, so that mechanical strength of a powder magnetic core can be enhanced by hydrosilylation reaction between vinylsilane and hydrosilane without degrading magnetic properties. The powder for a powder magnetic core is composed of magnetic particles 2 having a surface 21 coated with an insulating layer 3, wherein the insulating layer 3 includes a polymer resin insulating layer 33 comprising vinylsilane 4 and hydrosilane.
摘要:
Provided is a small-size optical phase modulation element and an optical modulator using it. The optical phase modulation element includes a Plasmon waveguide having a clad made of a metal material having a complex dielectric constant having a negative real part in the used wavelength and a core formed by a dielectric metal material having a complex dielectric constant having a positive real part in the used wavelength. The Plasmon waveguide is connected to an optical waveguide including a clad and a core both having a complex dielectric constant having a positive real part. The core of the Plasmon waveguide and the core of the optical waveguide are formed, at least partially, of the same semiconductor material. The Plasmon waveguide has a function to phase-modulate the incident light when voltage is applied.
摘要:
A powder for a powder magnetic core, a powder magnetic core, and methods of producing those products are provided, so that mechanical strength of a powder magnetic core can be enhanced by hydrosilylation reaction between vinylsilane and hydrosilane without degrading magnetic properties. The powder for a powder magnetic core is composed of magnetic particles 2 having a surface 21 coated with an insulating layer 3, wherein the insulating layer 3 includes a polymer resin insulating layer 33 comprising vinylsilane 4 and hydrosilane.
摘要:
The present invention provides a photodetector which solves the problem of low sensitivity of a photodetector, an optical communication device equipped with the same, and a method for making the photodetector, and a method for making the optical communication device. The photodetector includes a substrate, a lower cladding layer arranged on the substrate, an optical waveguide arranged on the lower cladding layer, an intermediate layer arranged on the optical waveguide, a optical absorption layer arranged on the intermediate layer, a pair of electrodes arranged on the optical absorption layer, and wherein the optical absorption layer includes a IV-group or III-V-group single-crystal semiconductor, and the optical absorption layer absorbs an optical signal propagating through the optical waveguide.