摘要:
A method and apparatus are provided for adjusting recession of an element, such as a pole tip, in a transducer structure formed in a plurality of thin film layers on an edge of a slider. A pre-stressed structure is formed as part of the plurality of thin film layers on the edge of the slider. The pre-stressed structure has a level of material stress. The recession is measured relative to a bearing surface of the slider, and then the level of material stress is adjusted as a function of the measured to effect a corresponding change in the recession.
摘要:
A semiconductor die and method of making it are provided. The die includes a first via extending through the entire thickness of the die and a first via electrode disposed inside the via electrically connecting an electrode at a top surface of the die with another electrode disposed at a bottom surface of the die.
摘要:
A power semiconductor device that includes a buried source electrode disposed at the bottom of a trench below a respective gate electrode, and a source connector including a finger electrically connecting the buried source to the source contact of the device, and a process for fabricating the device.
摘要:
A method and apparatus are provided characterizing the shape of a surface such as a bearing surface on a slider and for processing the shape. The shape is characterized by fitting a curve having a desired shape to measurement data and then determining residual deviations from the desired shape within localized regions. The surface is processed by selecting a material stress pattern to be applied to a working surface of the slider based on measured and desired contour shape parameters in a plurality of localized areas on the bearing surface. The measured contour shape parameter within a first of the plurality of localized areas is weighted more heavily than those within the other localized areas.
摘要:
A process for manufacturing a semiconductor device of the trench variety with reduced feature sizes and improved characteristics which process includes forming a termination structure having a field oxide disposed in a recess below the surface of the semiconductor die in which the active elements of the device are formed, and forming source regions after the major thermal steps have been performed.
摘要:
A method of an aspect includes running a plurality of threads on a plurality of thread processors. Memory accesses, of a thread of the plurality that is running on a first thread processor of the plurality, are monitored to both a first memory through a first memory controller and a second memory through a second memory controller. A second thread processor of the plurality is selected for a thread based on the monitoring of the memory accesses of the thread to both the first memory and the second memory. Installation of the thread, for which the second thread processor was selected, is initiated on the second thread processor. Other methods, apparatus, and systems are also disclosed.
摘要:
The present invention relates to a multi-branched Mannich base corrosion inhibitor and the method for preparing thereof. The method comprises (1) adding 3˜7 moles ketone and 3˜7 moles aldehyde to reaction kettle, adjusting pH to 2˜6 with acid, controlling temperature to 20˜50° C. and stirring for 20˜30 mins; (2) adding 1 mole organic polyamine to the reaction kettle under stirring, or adding the pH-adjusted ketone, aldehyde and organic solvent to organic polyamine, controlling temperature to 60˜90° C. and reacting for 1˜3 hrs, and after completion of the reaction, heating the system to 110° C. under nitrogen to remove water; the organic polyamine is organic compound comprising three or more primary amine groups and/or secondary amine groups. The Mannich base corrosion inhibitor of the present invention shows characters of strong adsorption force, high film strength, high film compactness, increase in corrosion inhibition efficiency by at least 2%, and overcomes the disadvantages in prior art of few adsorption centers, single adsorption group and weak adsorption force to metal surfaces.