摘要:
A power-managing key apparatus uses a power key to integrate the function of ACPI management of computer hardware and hibernation on/off of operation system. A processor coupled to the power key detects pressing-time parameters of the power key and a current state of the computer. The processor sends a hardware signal to emulate ACPI power button function in order to power on/off computer and awake the computer from a power saving mode. The processor sends a software signal to an operation system of the computer to disable/enable a hibernation state. Therefore, the complicated power management performed by computer hardware and operation system can be simplified.
摘要:
An electromagnetic interference diminishing structure of a connector assembly. The connector assembly includes a socket and a plug. The socket includes a main body enclosed by a metal housing connected to the grounding circuit of a circuit board. The plug includes a shield metal housing formed with grounding sections. A terminal main body is inserted in the shield metal housing. An insulating housing is fitted around the shield metal housing. When a front section of the plug is plugged into the socket, the metal housing of the socket and the grounding sections of the shield metal housing of the plug contact with each other through the holes of the insulating housing of the plug. Accordingly, the electromagnetic interference can be effectively diminished.
摘要:
A method for selectively etching a semiconductor feature opening to controllably achieve a critical dimension accuracy including providing a semiconductor wafer including a first opening formed extending through a thickness of at least one dielectric insulating layer and having an uppermost inorganic BARC layer; depositing a photoresist layer over the uppermost BARC layer and patterning the photoresist layer to form an etching pattern for etching a second opening overlying and encompassing the first opening; carrying out a first plasma assisted etching process to etch through a thickness of the BARC layer including a predetermined amount of CO in a plasma etching chemistry to increase an etching resistance of the photoresist layer; and, carrying out a second plasma assisted etching process to etch through a thickness portion of the at least one dielectric insulating layer to form the second opening.
摘要:
An integrated circuit structure includes a substrate having a first portion in a first device region and a second portion in a second device region; and two insulation regions in the first device region and over the substrate. The two insulation regions include a first dielectric material having a first k value. A semiconductor strip is between and adjoining the two insulation regions, with a top portion of the semiconductor strip forming a semiconductor fin over top surfaces of the two insulation regions. An additional insulation region is in the second device region and over the substrate. The additional insulation region includes a second dielectric material having a second k value greater than the first k value.
摘要:
An integrated circuit structure includes a substrate; two insulation regions over the substrate, with one of the two insulation regions including a void therein; and a first semiconductor strip between and adjoining the two insulation regions. The first semiconductor strip includes a top portion forming a fin over top surfaces of the two insulation regions.
摘要:
An integrated circuit including a plurality of Fin field effect transistors (FINFETs) is provided. The integrated circuit includes a plurality of fin-channel bodies over a substrate. The fin-channel bodies include a first fin-channel body and a second fin-channel body. A gate structure is disposed over the fin-channel bodies. At least one first source/drain (S/D) region of a first FINFET is adjacent the first fin-channel body. At least one second source/drain (S/D) region of a second FINFET is adjacent the second fin-channel body. The at least one first S/D region is electrically coupled with the at least one second S/D region. The at least one first and second S/D regions are substantially free from including any fin structure.
摘要:
Improved silicide formation and associated devices are disclosed. An exemplary method includes providing a semiconductor material having spaced source and drain regions therein, forming a gate structure interposed between the source and drain regions, performing a gate replacement process on the gate structure to form a metal gate electrode therein, forming a hard mask layer over the metal gate electrode, forming silicide layers on the respective source and drain regions in the semiconductor material, removing the hard mask layer to expose the metal gate electrode, and forming source and drain contacts, each source and drain contact being conductively coupled to a respective one of the silicide layers.
摘要:
A system for image processing is provided. The system includes a region of interest (ROI) module receiving video from a camera and detects a ROI(s) in a first image. A lookup table generates a value responsive to block type for a first vanishing point (VP). A labeling module identifies a point “p” most close to the first VP, a point “q” most remote to the first VP and a length “h” between “p” and “q” in each ROI(s), and generates information on p, q and h. Another lookup table generates information on p′, q′ and h′, wherein p′ is a point most close to a second VP, q′ is a point most remote to the second VP and h′ is a length between p′ and q′ in ROI(s) in the second image. A transforming module transforms ROI(s) in the first image into an ROI in the second image.
摘要:
A method of forming a semiconductor structure includes forming a PMOS device and an NMOS device. The step of forming the PMOS device includes forming a first gate stack on a semiconductor substrate; forming a first offset spacer on a sidewall of the first gate stack; forming a stressor in the semiconductor substrate using the first offset spacer as a mask; and epitaxially growing a first raised source/drain extension (LDD) region on the stressor. The step of forming the NMOS device includes forming a second gate stack on the semiconductor substrate; forming a second offset spacer on a sidewall of the second gate stack; epitaxially growing a second raised LDD region on the semiconductor substrate using the second offset spacer as a mask; and forming a deep source/drain region adjoining the second raised LDD region.
摘要:
An integrated circuit structure includes a substrate having a first portion in a first device region and a second portion in a second device region; and two insulation regions in the first device region and over the substrate. The two insulation regions include a first dielectric material having a first k value. A semiconductor strip is between and adjoining the two insulation regions, with a top portion of the semiconductor strip forming a semiconductor fin over top surfaces of the two insulation regions. An additional insulation region is in the second device region and over the substrate. The additional insulation region includes a second dielectric material having a second k value greater than the first k value.