公开(公告)号：US09029713B2

公开(公告)日：2015-05-12

申请号：US13852233

申请日：2013-03-28

Applicant: Ibiden Co., Ltd.

Inventor： Michimasa Takahashi

IPC: H05K1/03 ,  H05K1/11 ,  H05K7/00 ,  H05K1/02 ,  H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

公开(公告)号：US20150075848A1

公开(公告)日：2015-03-19

申请号：US14552771

申请日：2014-11-25

Applicant: IBIDEN CO., LTD.

Inventor： Nobuyuki NAGANUMA ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H05K1/09 ,  H05K1/02

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/116 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T156/1056

Abstract: A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.

Abstract translation: 布线板包括多个绝缘层，包括以第一，第二，第三，第四和第五绝缘层的顺序层叠的第一，第二，第三，第四和第五绝缘层。 所述第一绝缘层具有包括电镀的第一导体，所述第二绝缘层具有包括电镀的第二导体，所述第三绝缘层具有包括导电糊的第三导体，所述第四绝缘层具有包括电镀的第四导体，所述第五绝缘层具有 包括电镀的第五导体，并且第一导体，第二导​​体，第三导体，第四导体和第五导体沿着相同的轴线形成并且彼此电连接。

公开(公告)号：US20130112469A1

公开(公告)日：2013-05-09

申请号：US13729870

申请日：2012-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiro WATANABE ,  Michimasa Takahashi ,  Masakazu Aoyama ,  Takenobu Nakamura ,  Hiroyuki Yanagisawa

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/114 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/4614 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2224/0401

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。