Method for fabricating flexible electrical devices
    23.
    发明授权
    Method for fabricating flexible electrical devices 有权
    制造柔性电气装置的方法

    公开(公告)号:US09209403B2

    公开(公告)日:2015-12-08

    申请号:US13912172

    申请日:2013-06-06

    Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A′ is an aromatic or aliphatic group, and 1≦n/m≦4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

    Abstract translation: 提供一种制造柔性电气装置的方法。 该方法包括提供第一衬底,提供与第一衬底相对的第二衬底,其中第一衬底和第二衬底中的一个衬底包括式(I)的聚酰亚胺聚合物,其中B是多环脂族基团,A是含有 至少一个醚键,A'是芳族或脂族基团,并且在第一和第二基底之一上直接制造薄膜晶体管(TFT),其包括式(I)的聚酰亚胺聚合物, 并且在第一基板和第二基板之间布置介质层。

    Substrate structures applied in flexible devices
    24.
    发明授权
    Substrate structures applied in flexible devices 有权
    衬底结构应用于柔性装置

    公开(公告)号:US09023448B2

    公开(公告)日:2015-05-05

    申请号:US13774104

    申请日:2013-02-22

    Abstract: A substrate structure applied in flexible devices is provided. The substrate structure includes a carrier; a release layer with a first area formed on the carrier, which has a first adhesion force to the carrier; and a flexible substrate with a second area overlying part of the first area of the release layer and contacting the carrier, which has a second adhesion force to the release layer and a third adhesion force to the carrier, wherein the first area is larger than or equal to the second area, the third adhesion force is greater than the first adhesion force, and the first adhesion force is greater than the second adhesion force.

    Abstract translation: 提供了一种应用在柔性器件中的衬底结构。 衬底结构包括载体; 释放层,其具有形成在所述载体上的第一区域,所述第一区域对所述载体具有第一粘附力; 以及柔性基底,其具有覆盖在所述释放层的所述第一区域的一部分上的第二区域并使所述载体接触,所述载体对所述释放层具有第二粘附力和对所述载体的第三粘附力,其中所述第一区域大于或 等于第二区域,第三粘附力大于第一粘附力,并且第一粘附力大于第二粘附力。

    TOUCH PANEL
    25.
    发明申请
    TOUCH PANEL 审中-公开
    触控面板

    公开(公告)号:US20150109542A1

    公开(公告)日:2015-04-23

    申请号:US14191467

    申请日:2014-02-27

    CPC classification number: G06F3/041

    Abstract: A touch panel is provided, which includes a poly(vinylidene fluoride) (PVDF) substrate and a touch electrode structure. The PVDF substrate has two opposite surfaces. The touch electrode structure is at least disposed on one of the surfaces.

    Abstract translation: 提供了一种触摸面板,其包括聚(偏二氟乙烯)(PVDF)基板和触摸电极结构。 PVDF基板具有两个相对的表面。 触摸电极结构至少设置在其中一个表面上。

    METHOD FOR FABRICATING FLEXIBLE ELECTRICAL DEVICES
    26.
    发明申请
    METHOD FOR FABRICATING FLEXIBLE ELECTRICAL DEVICES 有权
    用于制造柔性电气装置的方法

    公开(公告)号:US20130267061A1

    公开(公告)日:2013-10-10

    申请号:US13912172

    申请日:2013-06-06

    Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A′ is an aromatic or aliphatic group, and 1≦n/m≦4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

    Abstract translation: 提供一种制造柔性电气装置的方法。 该方法包括提供第一衬底,提供与第一衬底相对的第二衬底,其中第一衬底和第二衬底中的一个衬底包括式(I)的聚酰亚胺聚合物,其中B是多环脂族基团,A是含有 至少一个醚键,A'是芳族或脂族基团,并且在第一和第二基底之一上直接制造薄膜晶体管(TFT),其包括式(I)的聚酰亚胺聚合物, 并且在第一基板和第二基板之间布置介质层。

Patent Agency Ranking