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    METHOD FOR MANUFACTURING A MICROMECHANICAL SYSTEM COMPRISING A REMOVAL OF SACRIFICIAL MATERIAL THROUGH A HOLE IN A MARGIN REGION
    22.
    发明申请
    METHOD FOR MANUFACTURING A MICROMECHANICAL SYSTEM COMPRISING A REMOVAL OF SACRIFICIAL MATERIAL THROUGH A HOLE IN A MARGIN REGION 有权
    用于制造包含通过一个边界区域中的孔的金属材料去除的微观系统的方法

    公开(公告)号：US20140175571A1

    公开(公告)日：2014-06-26

    申请号：US13722248

    申请日：2012-12-20

    Applicant: INFINEON TECHNOLOGIES DRESDEN GMBH

    Inventor： Thoralf Kautzsch ,  Heiko Froehlich ,  Mirko Vogt ,  Maik Stegemann

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: B81C1/00158 ,  B81C1/00476 ,  B81C2203/0145 ,  H01L41/0933

    Abstract: A method for manufacturing a micromechanical system includes creating a sacrificial layer at a substrate surface. A structural material is deposited at a sacrificial layer surface and at a support structure for later supporting the structural material. At least one hole is created in the structural material extending from an exposed surface of the structural material to the surface of the sacrificial layer. The at least one hole leads to a margin region of the sacrificial layer. The sacrificial layer is removed using a removal process through the at least one hole, to obtain a cavity between the surface of the substrate and the structural material. The method also includes filling the at least one hole and a portion of the cavity beneath the at least one hole close to the cavity. A corresponding micromechanical system and a microelectromechanical transducer are also described.

    Abstract translation: 微机械系统的制造方法包括在基板表面形成牺牲层。 结构材料沉积在牺牲层表面和支撑结构处，用于稍后支撑结构材料。 在从结构材料的暴露表面延伸到牺牲层的表面的结构材料中产生至少一个孔。 至少一个孔通向牺牲层的边缘区域。 使用通过至少一个孔的去除工艺去除牺牲层，以在基材的表面和结构材料之间获得空腔。 该方法还包括在靠近空腔的至少一个孔的下方填充至少一个孔和空腔的一部分。 还描述了相应的微机械系统和微机电换能器。

    Pressure Sensing Device
    28.
    发明公开
    Pressure Sensing Device 审中-公开

    公开(公告)号：US20230332969A1

    公开(公告)日：2023-10-19

    申请号：US18298831

    申请日：2023-04-11

    Applicant: Infineon Technologies Dresden GmbH & Co. KG

    Inventor： Marco Haubold ,  Mirko Vogt ,  Maik Stegemann ,  Marco Müller ,  Anita Förster ,  Anne Boitier-Mahlberg

    IPC: G01L9/00 ,  G01L13/02

    CPC classification number: G01L9/0072 ,  G01L13/025

    Abstract: A pressure sensing device includes a deflectable membrane structure to provide a deflection dependent output signal based on a pressure load, and a mechanical abutment structure for adjusting a spring constant of the deflectable membrane structure depending on the deflection of the deflectable membrane structure, wherein the mechanical abutment structure provides an abutting condition of the deflectable membrane structure when the deflection of the deflectable membrane structure exceeds a deflection threshold, wherein the abutting condition results in a change from a first spring constant to an increased, second spring constant of the deflectable membrane structure.

    Pressure sensor device and manufacturing method
    30.
    发明授权
    Pressure sensor device and manufacturing method 有权

    公开(公告)号：US10386255B2

    公开(公告)日：2019-08-20

    申请号：US15647360

    申请日：2017-07-12

    Applicant: Infineon Technologies Dresden GmbH

    Inventor： Thoralf Kautzsch ,  Heiko Froehlich ,  Marco Haubold ,  Andre Roeth ,  Maik Stegemann ,  Mirko Vogt

    IPC: G01L9/00 ,  G01L19/06 ,  G01L19/14

    Abstract: A manufacturing method includes providing a semiconductor substrate having a pressure sensor structure; and forming, during a BEOL process (BEOL=back-end-of-line), a metal-insulator-stack arrangement on the semiconductor substrate, wherein the metal-insulator-stack arrangement is formed to comprise (1) a cavity adjacent to the pressure sensor structure and extending over the pressure sensor structure, and (2) a pressure port through the metal-insulator-stack arrangement for providing a fluidic connection between the cavity and an environmental atmosphere, wherein the pressure port has a cross-sectional area, which is smaller than 10% of a footprint area of the pressure sensor structure within the cavity.

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