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公开(公告)号:US20210057880A1
公开(公告)日:2021-02-25
申请号:US17074050
申请日:2020-10-19
Applicant: Intel Corporation
Inventor: Karan Mehta , Richard Jones , Ranjeet Kumar , Guan-Lin Su , Duanni Huang , Haisheng Rong
Abstract: Embodiments of the present disclosure are directed to multi-wavelength laser generator may produce light with a frequency comb having equally spaced frequency lines. In various embodiments, the laser generator includes first, a semiconductor gain element is used to provide gain to the laser being generated. Second, a ring resonator filter, or ring filter, is used to select the wavelength comb spacing. Third, a narrow-band DBR or narrow-band mirror is used to select the number of wavelengths that lase. Fourth, a wide-band or narrow-band mirror is used to provide optical feedback and to form the optical cavity. Fifth, a phase tuner section is used to align the cavity modes with the ring resonances (i.e. the ring filter modes) in order to reduce or minimize the modal loss. Other embodiments may be described and/or claimed.
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公开(公告)号:US10908286B2
公开(公告)日:2021-02-02
申请号:US15721614
申请日:2017-09-29
Applicant: Intel Corporation
Inventor: Avi Feshali , Haisheng Rong
IPC: G01S7/481 , H01L31/0232 , H01L31/0224 , G01S17/10 , G01S17/89 , G01S17/42
Abstract: Technology for light detection and ranging (LIDAR) sensor can include an optical signal source, an optical modulation array and optical detector on the same integrated circuit (IC) chip, multi-chip module (MCM) or similar solid-state package.
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公开(公告)号:US10466515B2
公开(公告)日:2019-11-05
申请号:US15071105
申请日:2016-03-15
Applicant: Intel Corporation
Inventor: John Heck , David N. Hutchison , Jie Sun , Haisheng Rong , Woosung Kim
Abstract: Embodiments herein relate to photonic integrated circuits with an on-chip optical isolator. A photonic transmitter chip may include a laser and an on-chip isolator optically coupled with the laser that includes an optical waveguide having a section coupled with a magneto-optic liquid phase epitaxy grown garnet film. In some embodiments, a cladding may be coupled with the garnet film, the on-chip isolator may be arranged in a Mach-Zehnder interferometer configuration, the waveguide may include one or more polarization rotators, and/or the garnet film may be formed of a material from a rare-earth garnet family. Other embodiments may be described and/or claimed.
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公开(公告)号:US20190257688A1
公开(公告)日:2019-08-22
申请号:US16402990
申请日:2019-05-03
Applicant: Intel Corporation
Inventor: Ganesh Balamurugan , Haisheng Rong , Meer Nazmus Sakib , Hao Li
IPC: G01J1/16 , G01J1/42 , G02B6/12 , H01L31/0203
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a photonic apparatus with a photodetector with bias control to provide substantially constant responsivity. The apparatus includes a first photodetector, to receive an optical input and provide a corresponding electrical output; a second photodetector coupled with the first photodetector, wherein the second photodetector is free from receipt of the optical input; and circuitry coupled with the first and second photodetectors, to generate a bias voltage, based at least in part on a dark current generated by the second photodetector in an absence of the optical input, and provide the generated bias voltage to the first photodetector. The first photodetector is to provide a substantially constant ratio of the electrical output to optical input in response to the provision of the generated bias voltage. Additional embodiments may be described and claimed.
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公开(公告)号:US20160282265A1
公开(公告)日:2016-09-29
申请号:US14669514
申请日:2015-03-26
Applicant: Intel Corporation
Inventor: Xing Su , Kadhair Al-Hemyari , Kai Wu , Grace M. Credo , Haisheng Rong , Jacob Sendowski
IPC: G01N21/41
CPC classification number: G01N21/7746 , G01N21/39 , G01N21/553 , G01N2021/773 , G01N2021/7776
Abstract: An embodiment includes a sensor comprising a substrate die; a photonic ring resonator (RR) on the substrate die; a polymer, on the RR, having an affinity to a chemical analyte; a photonic waveguide on the substrate die and coupled to the RR; a laser, on the substrate die and coupled to the waveguide, to emit optical energy that operates with the RR at a resonance wavelength; and a photodetector, on the substrate die and coupled to the waveguide, to detect a change in refractive index (RI) of the RR operating with the optical energy in response to the polymer coupling to the analyte. Other embodiments are described herein.
Abstract translation: 一个实施例包括一个包括一个基片的传感器; 在衬底裸片上的光子环谐振器(RR); RR上的聚合物对化学分析物具有亲和性; 衬底上的光子波导管并耦合到RR; 激光器,在基板裸片上并且耦合到波导,以发射与RR在谐振波长下工作的光能; 以及光电检测器,其在所述基板裸片上并耦合到所述波导,以检测响应于与所述分析物的所述聚合物耦合而用所述光能操作的所述RR的折射率(RI)的变化。 本文描述了其它实施例。
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公开(公告)号:US09348099B2
公开(公告)日:2016-05-24
申请号:US14335756
申请日:2014-07-18
Applicant: Intel Corporation
Inventor: Mahesh Krishnamurthi , Judson Ryckman , Haisheng Rong , Ling Liao , Harel Frish , Oshrit Harel , Assia Barkai , Yun-Chung Na , Han-Din Liu
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4296 , G02B2006/12061 , G02B2006/121 , G02B2006/12104 , G02B2006/12147 , G02B2006/12152
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及用于光耦合器的技术和配置。 在一些实施例中,该装置可以包括用于透射从光源输入的光的光波导。 光波导可以包括具有一个沟槽的半导体层,该沟槽包括形成在大约45度角的边缘,以及基本垂直于半导体层形成的另一个小面。 边缘可以与另一介质接合以形成反射镜以接收输入的光并且基本垂直地反射接收的光以传播接收到的光。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US09250388B1
公开(公告)日:2016-02-02
申请号:US14334260
申请日:2014-07-17
Applicant: Intel Corporation
Inventor: Mahesh Krishnamurthi , I-Wei Hsieh , Haisheng Rong , Oshrit Harel , Harel Frish , Assia Barkai , Wenhua Lin
IPC: G02B6/12 , H01L21/30 , G02B6/132 , G02B6/136 , G02B6/34 , G02B6/26 , C03C15/00 , C23F1/00 , B29D11/00 , G02B6/293
CPC classification number: G02B6/29328 , G02B6/12004 , G02B6/12007 , G02B6/124 , G02B6/136 , G02B6/29308 , G02B6/2931 , G02B6/2938 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , G02B2006/12104 , G02B2006/12107 , G02B2006/12121 , G02B2006/12176 , H04B10/501
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical device having a semiconductor layer to propagate light and a mirror disposed inside the semiconductor layer and having echelle grating reflective surface to substantially totally internally reflect the propagating light inputted by one or more input waveguides, to be received by one or more output waveguides. The waveguides may be disposed in the semiconductor layer under a determined angle relative to the mirror reflective surface. The determined angle may be equal to or greater than a total internal reflection angle corresponding to the interface, to provide substantially total internal reflection of light by the mirror. The mirror may be formed by an interface of the semiconductor layer comprising the mirror reflective surface and another medium filling the mirror, such as a dielectric. Other embodiments may be described and/or claimed.
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公开(公告)号:US20160018610A1
公开(公告)日:2016-01-21
申请号:US14335756
申请日:2014-07-18
Applicant: Intel Corporation
Inventor: MAHESH KRISHNAMURTHI , Judson Ryckman , Haisheng Rong , Ling Liao , Harel Frish , Oshrit Harel , Assia Barkai , Shu-Lu Chen , Yun-Chung Na , Han-Din Liu
IPC: G02B6/42
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4296 , G02B2006/12061 , G02B2006/121 , G02B2006/12104 , G02B2006/12147 , G02B2006/12152
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及用于光耦合器的技术和配置。 在一些实施例中,该装置可以包括用于透射从光源输入的光的光波导。 光波导可以包括具有一个沟槽的半导体层,该沟槽包括形成在大约45度角的边缘,以及基本垂直于半导体层形成的另一个小面。 边缘可以与另一介质接合以形成反射镜以接收输入的光并且基本垂直地反射接收的光以传播接收到的光。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US20240388067A1
公开(公告)日:2024-11-21
申请号:US18787825
申请日:2024-07-29
Applicant: Intel Corporation
Inventor: Jin Hong , Ranjeet Kumar , Meer Nazmus Sakib , Haisheng Rong , Kimchau Nguyen , Mengyuan Huang , Aliasghar Eftekhar , Christian Malouin , Siamak Amiralizadeh Asl , Saeed Fathololoumi , Ling Liao , Yuliya Akulova , Olufemi Dosunmu , Ansheng Liu
Abstract: Embodiments of the present disclosure are directed to a silicon photonics integrated apparatus that includes an input to receive an optical signal, a splitter optically coupled to the input to split the optical signal at a first path and a second path, a polarization beam splitter and rotator (PBSR) optically coupled with the first path or the second path, and a semiconductor optical amplifier (SOA) optically coupled with the first path or the second path and disposed between the splitter and the PBSR. Other embodiments may be described and/or claimed.
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公开(公告)号:US20230204877A1
公开(公告)日:2023-06-29
申请号:US17561694
申请日:2021-12-23
Applicant: Intel Corporation
Inventor: John M. Heck , Haisheng Rong , Harel Frish , Ankur Agrawal , Boping Xie , Randal S. Appleton , Hari Mahalingam , Alexander Krichevsky , Pooya Tadayon , Ling Liao , Eric J. M. Moret
IPC: G02B6/42
CPC classification number: G02B6/4207 , G02B6/4214 , G02B6/428
Abstract: Technologies for beam expansion and collimation for photonic integrated circuits (PICs) are disclosed. In one embodiment, an ancillary die is bonded to a PIC die. Vertical couplers in the PIC die direct light from waveguides to flat mirrors on a top side of the ancillary die. The flat mirrors reflect the light towards curved mirrors defined in the bottom surface of the ancillary die. The curved mirrors collimate the light from the waveguides. In another embodiment, a cavity is formed in a PIC die, and curved mirrors are formed in the cavity. Light beams from waveguides in the PIC die are directed to the curved mirrors, which collimate the light beams.
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