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公开(公告)号：US09999124B2
公开(公告)日：2018-06-12
申请号：US15341108
申请日：2016-11-02
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Michael J. Fisher , Michael A. Gaynes , David C. Long , Thomas Weiss
CPC classification number: H05K1/0275 , G01N27/20 , G06F21/86 , G06F2221/2143 , H05K1/028 , H05K1/182 , H05K2201/09036
Abstract: Tamper-respondent assemblies with regions of increased susceptibility to a tamper event are provided, which include one or more tamper-detect sensors, one or more conductive traces, and an adhesive. The tamper-detect sensor(s) facilitates defining a secure volume about one or more electronic components to be protected, and the conductive trace(s) forms, at least in part, a tamper-detect network of the tamper-respondent assembly. The conductive trace(s) is disposed, at least in part, on the tamper-detect sensor(s). The adhesive contacts the conductive trace(s) on the tamper-detect sensor(s), and is disposed, at least in part, between and couples a surface of the tamper-detect sensor(s) to another surface of the assembly. Together, the tamper-detect sensor(s), conductive trace(s), and adhesive are a subassembly, with the subassembly being configured with multiple regions of increased susceptibility to breaking of the conductive trace(s) with a tamper event through the subassembly.
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公开(公告)号：US20180098423A1
公开(公告)日：2018-04-05
申请号：US15827275
申请日：2017-11-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Edward N. Cohen , Silvio Dragone , Michael J. Fisher , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K1/0275 , G08B13/128 , H05K1/0216 , H05K1/112 , H05K1/181 , H05K3/22 , H05K5/0208 , H05K2201/10151 , H05K2201/10265 , H05K2201/10371
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
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公开(公告)号：US09913370B2
公开(公告)日：2018-03-06
申请号：US15154077
申请日：2016-05-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Silvio Dragone , Michael J. Fisher , Michael A. Gaynes , David C. Long , Kenneth P. Rodbell , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K1/0275 , G06F21/87 , H05K1/181 , H05K1/185 , H05K5/0208 , H05K2201/10151 , H05K2201/10371
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.
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公开(公告)号：US09881880B2
公开(公告)日：2018-01-30
申请号：US15154088
申请日：2016-05-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Silvio Dragone , Michael A. Gaynes , Kenneth P. Rodbell , William Santiago-Fernandez
IPC: G01R31/02 , H01L23/00 , H05K1/03 , H05K1/18 , H05K3/30 , H01L23/053 , H01L23/08 , H01L21/48 , G06F21/86
CPC classification number: H01L23/576 , G06F21/87 , H01L21/4803 , H01L23/053 , H01L23/08 , H01L23/573 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/8385 , H01L2924/0665 , H01L2924/1434 , H01L2924/15192 , H01L2924/16251 , H01L2924/16588 , H05K1/0306 , H05K1/181 , H05K3/303 , H05K2201/10159
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).
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公开(公告)号：US09858776B1
公开(公告)日：2018-01-02
申请号：US15194738
申请日：2016-06-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Phillip Duane Isaacs
CPC classification number: G08B13/128 , G01N27/205 , H05K1/0275 , H05K1/0296 , H05K1/182 , H05K2201/10151
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).
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Patent Agency Ranking
公开(公告)号：US11083082B2
公开(公告)日：2021-08-03
申请号：US16567034
申请日：2019-09-11
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Kathleen Ann Fadden , James A. Busby , David C. Long , John R. Dangler , Alexandra Echegaray , Michael J. Fisher , William Santiago-Fernandez
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).
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公开(公告)号：US10798816B1
公开(公告)日：2020-10-06
申请号：US16747075
申请日：2020-01-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Arthur J. Higby , David C. Long , Michael J. Fisher , Russell A. Budd , Michel Turgeon , Sylvain Tetreault
Abstract: Tamper-respondent assemblies are provided which include an enclosure with an edge surface, and a tamper-respondent sensor. The tamper-respondent sensor covers, at least in part, the edge surface and an inner surface of the enclosure. The sensor includes at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern. The tamper-respondent sensor includes exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions.
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公开(公告)号：US10575398B2
公开(公告)日：2020-02-25
申请号：US15810295
申请日：2017-11-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , John R. Dangler , Michael J. Fisher , David C. Long
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
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公开(公告)号：US10257924B2
公开(公告)日：2019-04-09
申请号：US15831534
申请日：2017-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Silvio Dragone , Michael J. Fisher , Michael A. Gaynes , David C. Long , Kenneth P. Rodbell , William Santiago-Fernandez , Thomas Weiss
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.
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公开(公告)号：US10177102B2
公开(公告)日：2019-01-08
申请号：US15831554
申请日：2017-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. Busby , Silvio Dragone , Michael A. Gaynes , Kenneth P. Rodbell , William Santiago-Fernandez
IPC: G01R31/02 , H01L23/00 , H05K1/03 , H05K1/18 , H05K3/30 , H01L23/053 , H01L23/08 , H01L21/48 , G06F21/87
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).
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