公开(公告)号：US10365435B1

公开(公告)日：2019-07-30

申请号：US15788553

申请日：2017-10-19

Applicant: INPHI CORPORATION

Inventor： Samira Karimelahi ,  Masaki Kato

IPC: G02B6/124 ,  G02B6/125 ,  G02B6/126 ,  G02B6/27 ,  G02B6/122 ,  G02B6/30 ,  G01M11/00 ,  G02B6/12

Abstract: A surface grating coupler for polarization splitting or diverse includes a planar layer and an array of scattering elements arranged in the planar layer at intersections of a first set of concentric elliptical curves crossing with a second set of concentric elliptical curves rotated proximately 90 or 180 degrees to form a two-dimensional (2D) grating. Additionally, the grating coupler includes a first waveguide in double-taper shape and a second waveguide in double-taper shape respectively for split or diverse an incident light into the 2D grating into two output light to two output ports with a same (either TE or TM) polarization mode or one output port with TE polarization mode and another output port with TM polarization mode. The polarization diverse grating coupler is required to test multiple polarization sensitive photonics components and can be used with other single polarization grating coupler via a fiber array to perform wafer-level testing.

公开(公告)号：US10142032B2

公开(公告)日：2018-11-27

申请号：US15890616

申请日：2018-02-07

Applicant: INPHI CORPORATION

Inventor： Masaki Kato ,  Radhakrishnan L. Nagarajan

IPC: H04B10/2507 ,  H04B10/67 ,  H04J14/02 ,  H04B10/69 ,  G02B6/12 ,  G02B6/28 ,  G02B6/293

Abstract: A silicon photonics based temperature-insensitive delay line interferometer (DLI). The DLI includes a first arm comprising a first length of a first material characterized by a first group index corresponding to a first phase delay to transfer a first light wave with a first peak frequency and a second arm comprising a second length of a second material characterized by a second group index corresponding to a second phase to transfer a second light wave with a second peak frequency with a time-delay difference relative to the first light wave. The first phase delay and the second phase delay are configured to change equally upon a change of temperature. The time-delay difference between the first light wave and the second light wave is set to be inversed value of a free spectral range (FSR) to align at least the first peak frequency to a channel of a designated frequency grid.

公开(公告)号：US10056733B1

公开(公告)日：2018-08-21

申请号：US15453618

申请日：2017-03-08

Applicant: INPHI CORPORATION

Inventor： Brian Taylor ,  Radhakrishnan L. Nagarajan ,  Masaki Kato

IPC: H04J14/02 ,  H01S5/0687 ,  G02B6/28 ,  G02B6/42 ,  H01S5/12 ,  G02B6/125 ,  H04B10/50 ,  G02B6/12

CPC classification number: H01S5/0687 ,  G02B6/125 ,  G02B6/2813 ,  G02B6/2861 ,  G02B6/4286 ,  G02B2006/12135 ,  G02B2006/1215 ,  H01S5/005 ,  H01S5/021 ,  H01S5/12 ,  H04B10/5057 ,  H04J14/02

Abstract: A wavelength locker integrated with a silicon photonics transmission system comprising a silicon-on-insulator (SOI) substrate and an input via a power tap coupler to receive a fraction of a transmission signal with one or more frequencies from a primary output path of the silicon photonics transmission system. The wavelength locker further includes a splitter configured to split the input to a first signal in a first path and a second signal in a second path and a first delay-line-interferometer (DLI) coupled to the second path to receive the second signal and configured to generate an interference spectrum and output at least two sub-spectrums tunable to keep quadrature points of the sub-spectrums at respective one or more target frequencies. The wavelength locker is configured to generate an error signal fed back to the silicon photonics transmission system for locking the one or more frequencies at the one or more target frequencies.

公开(公告)号：US10025046B2

公开(公告)日：2018-07-17

申请号：US15672693

申请日：2017-08-09

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

公开(公告)号：US09759877B2

公开(公告)日：2017-09-12

申请号：US15375042

申请日：2016-12-09

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40

CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

公开(公告)号：US09726841B1

公开(公告)日：2017-08-08

申请号：US15208547

申请日：2016-07-12

Applicant: INPHI CORPORATION

Inventor： Jie Lin ,  Masaki Kato

IPC: G02B6/12 ,  G02B6/42 ,  H01L31/0232 ,  H01L31/028 ,  H01L31/02 ,  H01L27/02 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01L27/0248 ,  G02B6/12 ,  G02B6/12004 ,  G02B6/4275 ,  G02B2006/12123 ,  H01L27/1443 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/028 ,  H01L31/103 ,  H01L31/1804

Abstract: An integrated photo detector with enhanced electrostatic discharge damage (ESD) protection. The integrated photo detector includes a first photodiode formed in the SOI substrate and associated with a first p-electrode and a first n-electrode. Additionally, the integrated photo detector includes a second photodiode formed in the SOI substrate associated with a second p-electrode and a second n-electrode forming a capacitance no larger than a few femto Faradays. Moreover, the integrated photo detector includes a first electrode and a second electrode disposed respectively on the SOI substrate. The first/second electrode is respectively connected to the first p/n-electrode via a first/second metallic layer patterned with a reduced width from the first/second electrode to the first p/n-electrode and connected to the second p/n-electrode via a first/second metallic wire to make a parallel coupling between the first photodiode and the second photodiode with an ESD threshold of about 100V.

公开(公告)号：US09553689B2

公开(公告)日：2017-01-24

申请号：US14569471

申请日：2014-12-12

Applicant: INPHI CORPORATION

Inventor： Masaki Kato

IPC: H04J14/02 ,  H04B10/12 ,  H04B10/40 ,  G02B6/00

CPC classification number: G02B6/29398 ,  G02B6/00 ,  G02B6/29344 ,  H04B10/40 ,  H04J14/02

Abstract: A temperature insensitive DEMUX/MUX device whose wavelength does not change by environment temperature is provided for WDM application. The temperature insensitive DEMUX/MUX device includes a waveguide-based delay-line-interferometer configured to receive an input light bearing multiplexed wavelengths and output a first output light bearing the same multiplexed wavelengths but with a shifted intensity peak position. The first output light is transmitted into a DEMUX device through a first free space coupler and a grating fiber or waveguide to be demultiplexed for forming a plurality of second output lights each bearing an individual wavelength. The DEMUX device includes a second free space coupler for refocusing each second output light to corresponding output channel. The shifted intensity peak position of the first output light is tunable to make each second output light free from any temperature-induced drift off corresponding output channel.

Abstract translation: WDM应用提供了一种温度不敏感的DEMUX / MUX器件，其波长不会因环境温度而变化。 温度不敏感的DEMUX / MUX器件包括基于波导的延迟线干涉仪，其被配置为接收携带复用波长的输入光，并且输出具有相同复用波长但具有偏移的强度峰值位置的第一输出光。 第一输出光通过第一自由空间耦合器和光栅光纤或波导传输到DEMUX器件中，以被解复用以形成各自带有单个波长的多个第二输出光。 DEMUX设备包括第二自由空间耦合器，用于将每个第二输出光重新聚焦到相应的输出通道。 第一输出光的偏移强度峰值位置是可调的，以使得每个第二输出光不受相应输出通道的任何温度感应漂移。

公开(公告)号：US09496959B1

公开(公告)日：2016-11-15

申请号：US14789290

申请日：2015-07-01

Applicant: Inphi Corporation

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: H04B10/00 ,  G02B6/12 ,  H04B10/40 ,  H04J14/02 ,  H04B10/516

CPC classification number: G02B6/4257 ,  G02B6/30 ,  G02B6/421 ,  G02B6/4243 ,  G02B6/4246 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4286 ,  G02B6/4292 ,  G02F1/2255 ,  G02F2001/212 ,  H04B10/40 ,  H04B10/516 ,  H04J14/02

Abstract: The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

Abstract translation: 该装置包括具有底座构件，两个部分侧构件和盖构件的壳体，以在基座构件的后端提供具有开口的空间体积。 此外，该设备包括安装在基座部件上方的空间体积内的PCB，后端具有可插拔连接器。 该装置包括一个或多个透射 - 光学 - 组件封装中的光学传输装置，它们分别安装在PCB上，并且包括与盖构件接触的内置TEC模块和朝向 后端 此外，该装置包括硅光子芯片，其包括安装在PCB上的光纤至硅附着模块，并耦合到调制驱动器模块和跨阻抗放大器模块。 此外，该装置包括光输入端口和输出端口，其被连接到光纤到硅附接模块。

公开(公告)号：US09323128B1

公开(公告)日：2016-04-26

申请号：US14706908

申请日：2015-05-07

Applicant: Inphi Corporation

Inventor： Radhakrishnan L. Nagarajan ,  Hari Shankar ,  Masaki Kato ,  Yang Fu

IPC: G02F1/01 ,  G02B6/12 ,  G02F1/225 ,  H01S3/067 ,  G02F1/21 ,  H04B10/50 ,  G02F1/025

CPC classification number: G02F1/0123 ,  G02B6/12007 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/225 ,  G02F1/2255 ,  G02F2001/212 ,  G02F2202/105 ,  H01S3/06754 ,  H01S3/1608 ,  H01S5/0085 ,  H01S5/0687 ,  H01S5/4012 ,  H01S5/4087 ,  H04B10/505 ,  H04B10/50575

Abstract: An integrated optical modulator device. The device can include a driver module coupled to an optical modulator. The optical modulator is characterized by a raised cosine transfer function. This optical modulator can be coupled to a light source and a bias control module, which is configured to apply an off-quadrature bias to the optical modulator. This bias can be accomplished by applying an inverse of the modulator transfer function to the optical modulator in order to minimize a noise variance. This compression function can result in an optimized increased top eye opening for a signal associated with the optical modulator. Furthermore, the optical modulator can be coupled to an EDFA (Erbium Doped Fiber Amplifier) that is coupled to a filter coupled an O/E (Optical-to-Electrical) receiver.

Abstract translation: 集成光调制器装置。 该装置可以包括耦合到光调制器的驱动器模块。 光调制器的特征在于升高的余弦传递函数。 该光调制器可以耦合到光源和偏置控制模块，该偏置控制模块被配置为向光调制器施加非正交偏置。 可以通过将调制器传递函数的反相应用于光调制器来实现该偏置，以便最小化噪声方差。 该压缩功能可以导致用于与光学调制器相关联的信号的优化的增加的顶部眼睛开度。 此外，光调制器可以耦合到耦合到耦合到O / E（光 - 电）接收器的滤波器的EDFA（掺铒光纤放大器）。

公开(公告)号：US11828995B2

公开(公告)日：2023-11-28

申请号：US16995120

申请日：2020-08-17

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L Nagarajan ,  Masaki Kato

IPC: G02B6/43 ,  G02B6/42 ,  G02B6/122 ,  G02B6/12

CPC classification number: G02B6/43 ,  G02B6/122 ,  G02B6/4206 ,  G02B6/4274 ,  G02B2006/12061

Abstract: A silicon-based edge coupler for coupling a fiber with a waveguide includes a cantilever member being partially suspended with its anchored end coupled to a silicon photonics die in a first part of a silicon substrate and a free end terminated near an edge region separating a second part of the silicon substrate from the first part. The edge coupler further includes a mechanical stopper formed at the edge region with a gap distance ahead of the free end of the cantilever member. Additionally, a V-groove is formed in the second part of the silicon substrate characterized by a top opening and a bottom plane symmetrically connected by two sloped side walls along a fixed Si-crystallography angle. The V-groove is configured to support a fiber with an end facet being pushed against the mechanical stopper and a core center being aligned with the free end of the cantilever member.