公开(公告)号：US11923267B2

公开(公告)日：2024-03-05

申请号：US16831076

申请日：2020-03-26

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Je-Young Chang ,  Ram Viswanath ,  Elah Bozorg-Grayeli ,  Ahmad Al Mohammad

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/495

CPC classification number: H01L23/3672 ,  H01L23/373 ,  H01L23/49568

Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

公开(公告)号：US11710672B2

公开(公告)日：2023-07-25

申请号：US16504734

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Frederick W. Atadana ,  Elah Bozorg-Grayeli

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L21/50 ,  H01L21/56 ,  H01L23/42

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/16152

Abstract: Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.

公开(公告)号：US20210265238A1

公开(公告)日：2021-08-26

申请号：US16798118

申请日：2020-02-21

Applicant: INTEL CORPORATION

Inventor： Marely E. Tejeda Ferrari ,  Taylor Gaines ,  Elah Bozorg-Grayeli ,  James C. Matayabas, JR.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/42 ,  H01L21/48 ,  C09K5/14 ,  C08K3/04

Abstract: Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.

公开(公告)号：US20210225729A1

公开(公告)日：2021-07-22

申请号：US16746732

申请日：2020-01-17

Applicant: Intel Corporation

Inventor： Elah Bozorg-Grayeli ,  Kyle Arrington ,  Sergio Chan Arguedas ,  Aravindha Antoniswamy

IPC: H01L23/373 ,  H01L23/16 ,  H01L23/367 ,  H01L23/00 ,  H01L21/48

Abstract: A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.

公开(公告)号：US10569298B2

公开(公告)日：2020-02-25

申请号：US15717582

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Michael Greenley ,  Elah Bozorg-Grayeli

IPC: B05D3/06 ,  C09J163/00 ,  C09J5/04 ,  G02B7/02 ,  C09D163/00 ,  C08G59/18

Abstract: Embodiments herein relate to curing of an epoxy using an ultraviolet (UV) laser. A volume of epoxy may be coupled to an area of a surface, and the volume of epoxy is cured and surrounded by material other than cured epoxy, where the area of the surface is substantially equal to a diameter of the UV laser beam used to cure the epoxy. Other embodiments may be described and/or claimed.

公开(公告)号：US10475715B2

公开(公告)日：2019-11-12

申请号：US15037851

申请日：2015-06-17

Applicant: Intel Corporation

Inventor： Venmathy McMahan ,  Sivakumar Nagarajan ,  Elah Bozorg-Grayeli ,  Amrita Mallik ,  Kuang-Han Chu ,  Liwei Wang ,  Nisha Ananthakrishnan ,  Craig J. Weinman ,  Amram Eitan

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L21/56 ,  H01L23/18 ,  H01L23/373 ,  H01L25/065 ,  H01L25/07 ,  H01L23/00

Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.